In the fast-evolving world of high frequency electronics, selecting the right laminate material is crucial for achieving superior performance and reliability. The WL-CT Series laminates stand out as a cutting-edge solution, offering a unique combination of electrical, thermal, and mechanical properties tailored for mission-critical applications.
In this article, we’ll discuss what really characterizes the high frequency WL-CT Series laminates(WL-CT300、WL-CT330、WL-CT330Z、WL-CT338、WL-CT350、WL-CT440、WL-CT615）. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is The WL-CT Series Laminates?
The series(CT300、CT330、CT330Z、CT338、CT350、CT440、CT615） of organic polymer ceramic fiberglass cloth copper-clad laminates is a high frequency material based on a thermosetting resin system. The dielectric layer consists of hydrocarbon resin, ceramics, and fiberglass cloth, offering low-loss performance that meets the requirements for high frequency design. Furthermore, the PCB processability of this material can be referenced from FR4 material processing techniques. Compared with PTFE material processing, it is simpler, easier to handle, and capable of replacing similar foreign products.
Hydrocarbon resin and composite ceramics exhibit excellent characteristics such as low loss, high temperature resistance, and temperature stability. These properties ensure that the dielectric constant and loss of this series of materials have stable temperature characteristics, a low thermal expansion coefficient, and a high glass transition temperature (TG) exceeding 280°C.
This series offers a range of dielectric constants to choose from, including 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15. The materials are compatible with ED copper foil or reverse RTF copper foil. RTF copper foil demonstrates superior PIM performance, reducing conductor losses and insertion losses. Additionally, RTF copper foil features adhesive backing, increasing the material thickness by 0.018mm (0.7mil), which enhances its adhesion properties.
This series can also be paired with aluminum substrates to form aluminum-based high frequency materials. The circuit board can be processed using FR4 board process technology as a reference. The outstanding mechanical and physical properties of the board allow for multiple pressing cycles, making it suitable for multi-layer, high-density multi-layer, and backplane processing. Moreover, it exhibits exceptional machinability when processing dense vias and fine lines.
WL-CT Series(CT300、CT330、CT330Z、CT338、CT350、CT440、CT615） Laminates Data Sheet
Features of The WL-CT Series Laminates
Low Dielectric Constant Tolerance and Low Loss
With ultra-low dielectric constant (Dk) tolerance and minimal signal loss (Df), these laminates ensure consistent signal integrity even at high frequencies. This makes them ideal for high speed RF and microwave applications.
Excellent Dielectric Constant Temperature Characteristics
Hydrocarbon ceramic thermosetting resin system with better PCB processability and heat resistance. Excellent dielectric constant temperature characteristics with low variation with temperature. These laminates exhibit excellent stability in dielectric constant across a wide temperature range, minimizing performance variations due to temperature changes.
Matched Coefficient of Thermal Expansion (CTE)
Thermal expansion coefficient in X/Y direction, equivalent to copper foil, small thermal expansion coefficient in Z direction, ensuring dimensional thermal stability and hole copper reliability. The laminates exhibit an exceptionally low coefficient of thermal expansion (CTE) in the X/Y plane, reducing the risk of delamination or warping during thermal cycling.
High Glass Transition Temperature (Tg > 280 °C)
High TG value greater than 280℃, still maintain dimensional stability and hole copper quality at high temperature. With a Tg exceeding 280 °C, This Series laminates resist deformation under lead free soldering profiles and harsh operating temperatures, enhancing long term dimensional stability.
Superior Thermal Conductivity
High thermal conductivity, better than thermoplastic materials in the same class, suitable for high-power applications. Outperforming thermoplastic materials in its class, This Series efficiently dissipates heat, enhancing reliability in high-power applications.
Excellent Radiation Resistance
Designed to withstand radiation exposure, these laminates are suitable for aerospace and space equipment operating in harsh radiation environments. The inorganic filler system imparts superior resistance to ionizing radiation, making the laminates ideal for aerospace and spaceborne electronics.
Low outgassing performance
Minimal volatile emissions make them compliant with vacuum environment requirements, critical for satellite and space applications. Low outgassing performance, tested according to the standard method of material volatility performance under vacuum conditions, meeting the requirements of vacuum outgassing for aerospace applications.
Applications of The WL-CT Series Laminate
The unique properties of PCB laminates make them indispensable across industries where failure is not an option:
Aerospace equipment, space, in-cabin equipment, aircraft
Ideal for use in aerospace equipment where reliability under extreme conditions is crucial. On board avionics, in cabin control panels, and satellite payload electronics benefit from It’s radiation tolerance, low outgassing, and thermal stability.
Microwave, antenna, phase-sensitive antenna
Supports the development of high-performance microwave antennas and phase-sensitive antennas used in communication systems. Phase sensitive antenna arrays, microwave transmit/receive modules, and phased array radomes leverage the laminate’s low Dk/Df and temperature stable dielectric properties for precise beamforming.
Early warning radar, airborne radar and other kinds of radar
Early warning and airborne radar systems demand substrates that maintain electrical performance under wide temperature swings and high power RF loads WL-CT meets these criteria.
Phased array antennas, beamwave networks
These laminates have gained significant recognition in advanced electronic applications, particularly for phased array antennas and beamwave networks. These laminates are engineered with a thermosetting resin system that incorporates hydrocarbon resins, ceramic fillers, and fiberglass cloth, providing exceptional electrical and mechanical properties required for high frequency operations.
Satellite communication, navigation
Enables reliable performance in satellite transponders, GPS modules, and low-Earth-orbit (LEO) systems, where thermal cycling and radiation resistance are critical. Enhances satellite communications and navigation by providing reliable performance at high frequencies and under extreme environmental conditions.
Power amplifier
Used in power electronics requiring efficient heat dissipation, such as base station amplifiers and electric vehicle (EV) power systems. Suitable for power amplifiers requiring excellent frequency stability and low dielectric loss.
Manufacturing Advantages of WL-CT Series Laminate
The distinctive characteristics of PCB series laminates also bring significant benefits during the manufacturing process:
Commercial Availability
These laminates are readily available on the market, facilitating easy procurement and integration into manufacturing workflows. Mass-produced and readily available, these materials reduce lead times and ensure supply chain stability.
High-Volume Production
are readily available through established supply chains, ensuring consistent quality and timely delivery. Designed for large-scale production, PCB Series laminates maintain consistent quality, ensuring that high-performance standards are met in every batch.
Cost-effective products
Despite its premium performance, These laminates delivers cost savings through high process yields, material versatility, and long-term reliability, which collectively lower total system cost and reduce the need for rework or replacements.
WL-CT Series PCB Material Standard Copper Clad And Core Thickness
Ultimately, The WL-CT Series laminates(WL-CT300、WL-CT330、WL-CT330Z、WL-CT338、WL-CT350、WL-CT440、WL-CT615） represent a leap forward in material science, addressing the dual challenges of performance and manufacturability. Whether for aerospace systems pushing the boundaries of exploration, radar networks safeguarding nations, or satellite constellations enabling global connectivity, these laminates deliver the reliability and precision needed to power tomorrow’s innovations. For engineers and designers seeking materials that combine cutting-edge electrical properties, thermal resilience, and cost-effective scalability, the Series is a compelling choice.
