An Integrated Circuit (IC) is a small-sized chip made with silicon material, having a large number of components developed over it. Printed Circuit Boards are basically the physical version of the designed circuit. A common PCB has components like resistors, capacitors, inductors, wires, diodes, BJTs, MOSFETs and many more. All the components come in various forms as per the PCB requirements. Preparing the PCBs for small circuits is convenient, but for large and complex circuits, it becomes bulky for end users. To remove this, the electronic components are etched over the silicon wafer with the Photo-lithography process. Multiple layers of the PCB can also be developed into Silicon wafers.
What are IC PCBs?
IC PCBs are complex circuits inside but look like tiny products from the outside. Integrating circuits into a compact version started after increasing demands for high-density circuits for a product. Based on the density of the components to be integrated into the Silicon wafer, is termed as scaled integration. Thus, small-scale, medium-scale, large-scale, very large scale and now ultra-large-scale integration methods have been developed to prepare any product into a compact IC package.
A product’s PCB can have multiple IC packages depending on the circuit requirements. IC packages have an external pin configuration to connect with the other elements in the circuit. The IC packages are available in both PTH and SMD formats. The core circuit of the IC is properly enclosed with protective housing. A suitable marking is done on the outer surface of the IC package for technical reference.
Fabrication of IC
Making an IC chip is a very intrinsic and complex process. The purest form of Silicon is used for wafer formation because the impurity level in Silicon will further affect circuit performance. Thin layers of Silicon are sliced off from the substrate. The designed circuit is then masked and etched over the wafer surface. To grow the various electronic components, controlled doping is done on the wafer. The final part is then tested for quality & functionality and sent for further usage.
Benefits of IC PCB in Electronics Industries
- Miniature Design – IC PCBs have become popular in most applications due to their compact design and aspect ratio. Lightweight and compact products have become the prime requirements for users. Ultra large-scale integration methods have enabled the IC packages to incorporate any circuit into it. IC PCBs include a large number of components in small packages. These components are developed over the substrate by fabrication tools. These methods effectively reduce the overall dimensions of the IC without altering any component of the circuit.
- Superior Overall Performance – Integrated circuit packages have better performance than ordinary PCBs. All the components and traces are embedded right into a small package, which ends in a lower time for signal and data flow. Configuring multiple ICs into a product increases the overall performance of the product without connecting to an additional setup. Having a higher density of the components also contributes to the enhanced capability of the product.
- Efficient Product & Manufacturing Cost – The preliminary setup cost for IC PCB manufacturing is better due to the advanced machinery. In huge production volumes, the overall cost of the PCB is comparatively low. The material required for production is also much less, which results in lower product costs. Integrated designs and high-tech manufacturing increase production efficiency and output, which is cost-friendly for PCB manufacturers.
- Compatible with Advanced Technologies – With the introduction of new trends in many areas, the products need to have all the current features. This is possible with IC PCBs in products. The new innovations have large electronic circuits which need to be realised into a compact product. Providing advanced technology and solutions to end users has become possible with IC technology. Product user experience has also been improved with IC substrate PCBs.
- Environmental Considerations – IC substrate PCBs have various components for dedicated functions. Many components are made with hazardous materials. Also, the chemicals used in the manufacturing and assembly process also sometimes have harmful factors. Integrated circuit packages eliminate the possibility of hazardous components in products. Continuous research of environmentally friendly materials is under process by PCB component developers.
Limitations of IC PCBs
- Design Complexity – The end requirement of any application is derived from a core electrical and electronic circuit. These circuits are becoming more complex and detailed due to increased demand & requirements. Lay-outing the circuit into a compact form is a complex and critical task to do. The error probability is required to be nearly zero for compact designs. After the design part, if any error remains and is forwarded to the manufacturing unit, the product is of no use. Hence, designing a perfect version of IC PCB is crucial at the initial stages.
- Skilled & Precise Fabrication Requirements – IC substrate PCB manufacturing and assembly is itself a skilled and critical process. It includes various stages with numerous sub-activities to complete the fabrication process of a PCB. Fabricating the IC PCB requires advanced manufacturing & assembly setup with the highest precision. Any kind of deviation at any stage will be conveyed to all the products, leading to the rejection and failure of the end product.
- Unstability at High Temperature & Voltage – The IC PCBs are perfect for low-level applications. At higher levels like high temperature and voltage, the ICs show instability sometimes. The internal components inside the IC have limited features with limited functionalities. To operate on high-end applications, IC requires additional setup to control the higher parameters. If the IC substrate PCBs are kept under these conditions for a long period, then the product reliability also is affected negatively.
- No Re-usability – Conventional PCBs have numerous components mounted on the surface of the board. In product failure or component damage conditions, the PCB can be repaired or upgraded by replacing the component or by using some repairing techniques. The repairing and replacement activities have little scope for IC PCBs due to their integration criteria. IC substrate PCBs have no further usage and recyclability option.
Conclusion
The Integrated Circuit Printed Circuit Boards have transformed electronics by achieving miniaturisation and enhanced performance. The integration of IC packages into almost all the present applications has become necessary for the best results. The future of technology and electronics is highly dependent on the IC. More advancements in IC PCB technology with improvised characteristics are under continuation. New material composition and upgraded components for the IC are being introduced on a frequent basis.
