One company known to offer top quality copper clad laminates is Taiwan Union Technology Corporation (TUC). As you may already know, copper clad laminates function as the base material for a printed circuit board. Furthermore, TU-883 utilizes regular woven E-glass as the reinforcing material. This product also comes through copper clad lamination on either just one or the two sides of the reinforcing material after resin soaking.
In this article, we’ll discuss what really characterizes the high speed low loss TU-883.The relevant information is available for pcb design engineers to refer to in the selection of materials, And QFPCB offers the best services when it comes to the TU-883 PCB Materials, so you can also call QFPCB to discuss.
What is the high speed low loss TU-883 material ?
TU-883 is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and dissipation factor resin system for high speed low loss,radio frequency and wireless applications. TU-883 material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-883 laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability and CAF resistance.
These laminates have properties such as compatibility with lead free processes and are RoHS compliant. With the growing demand for high-frequency applications the company has ventured into laminates that are capable of handling such application. They have high Tg, and may have super low loss or very low loss for signal integrity and a CTE Z-axis of less than or equal to 3%.
Besides, they have excellent dimensional stability. They may also be CAF resistant and are cost-effective as well. With the emerging discoveries and never-ending innovations, the use of laminates for high-frequency applications are ever-increasing.
The features of the high speed low loss TU-883 material ?
Performance and Processing Advantages
>Excellent electrical properties
>Dielectric constant less than 4.0
>Dissipation factor less than 0.005
>Stable and flat Dk/Df performance over frequency and temperature
>Compatible with modified FR-4 processes
>Excellent moisture resistance and Lead Free reflow process compatible
>Improved z-axis thermal expansion
>Anti-CAF capability
>Excellent through-hole and soldering reliability
>Halogen Free
Industry Approvals
>IPC-4101 Type Designation: /134
>IPC-4101/134 Validation Services QPL Certified
>UL File Number : E189572
>ANSI Grade : No-ANSI
>Flammability Rating: 94V-0
>Maximum Operating Temperature: 160°C
Applications
>Radio frequency
>Backplane, High performance computing
>Line cards, Storage
>Servers, Telecom, Base station, Office Routers
What are the Functional Requirements of using TU-883 Laminates ?
TU-883 Laminates are made from copper foils,Prepregs and Copper clad laminates (CCL). These are woven together with E-glass then coated with epoxy resin. As a result, it provides the characteristic of UV blocking and allowing for compatibility with (AOI) automated optical inspection processes. This makes them suitable for operation in conditions such as the ones present in thermocycles or where there are processes requiring excessive assembly.
TU-883 laminates guarantee significant cost saving and production flexibility. They can meet the IPC-4101 requirements. TU-883 Laminates uses a lot of materials that are majorly environmentally friendly. Every laminate must pass strict quality control and they have the necessary certifications. They achieve this by ensuring that they are FR-4 compatible, are halogen free, free from red-phosphorus and also free from antimony. TU-883 are also durable and widely used by other OEM manufacturers and provide mass lamination services to PCB manufacturers, indicating quality of product. This is because delamination due to their application is difficult unless under extraneous circumstances. This makes it adaptable to most PCB fabrication processes.
How do TU-883 Laminates compare to FR4 PCB Material ?
With TU-883 laminates, their use determines their type. For FR-4 PCB materials, they will be able to be used for most standard applications without adjustments. FR-4 is a designation name by NEMA that describes glass-reinforced epoxy laminate material to increase thermal resistance. It is versatile and acts as an accepted as standard.
What are the Advantages of using TU-883 Laminates over other Alternatives ?
There are stated advantages of using TU-883 Laminates. It is seen to exhibit great electrical properties, thermal expansion improvement on its z-axis. Besides, it is free of Halogen. Also, its dielectric factor is not greater than 4 and its dissipation factor not exceeding 0.005. The Laminates have high moisture resistance, anti CAF capability and performs stably under frequency and temperature while also being at flat Dk/Df performance. The Laminates are also seen to be compatible with FR-4 processes that have been modified together with compatibility to Lead free reflow processes.
This insinuates that TU-883 laminates are indeed available for OEM applications. Taking to account its application in consumer electronics, in mobile phones, in computers, routers, servers storage or even in automotive electronics. Most of them come manufactured as finished products having already incorporated the laminates in their assembly.
PCB designers should specify laminates that offer the optimal price-performance ratio. Therefore, conducting thorough research and analysis of PCB materials is crucial. This article has assessed and examined the properties and advantages of TU-883 laminate,for everyone to learn and pcb circuit design reference only.
