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In this article, we’ll discuss what really characterizes the high speed low loss TU-863+ (Thunder Clad 1+). The relevant information is available for pcb design engineers to refer to in the selection of materials, QFPCB offers the best services when it comes to the High speed pcb board, so please feel free to contact us.
What is the high speed low loss TU-863+ material ?
TU-863+ (ThunderClad 1+) is high Tg halogen free low loss pcb material which is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board applications.
The material is suitable for environmental protection lead free process and also compatible with FR-4 processes. This green material is designed to achieve thermal robust, low signal attenuation and eliminate the use of potential hazardous halogenated resins.Unlike conventional low loss material using brominated resin as flame retardant. The material achieves flammability class of UL 94V-0 by incorporating phosphorus and nitrogen compounds in the materials.
The features of the high speed low loss TU-863+ material ?
Applications
>Backplane, High performance computing
>Line cards, Storage
>Servers, Telecom, Base station
>Office Routers
Performance and Processing Advantages
>Halogen, antimony, and red phosphorous free
>Low Dk & Df performance
>Moisture resistance
>Anti-CAF capability
>Higher Tg characteristics
>Low coefficient of thermal expansion
>Compatible to PCB processes
>Lead free process compatible
>Environmental friendly materials
Industry Approvals
>IPC-4101E Type Designation : /127, /128, /130
>IPC-4101E/130 Validation Services QPL Certified
>UL Designation – ANSI Grade: FR-4.1
>Flammability Rating: 94V-0
>Maximum Operating Temperature: 130°C
What are the Similarities Between the high speed low loss TU-863+ and the high speed low loss TU-863?
As previously mentioned, both the high Tg halogen free low loss TU-863+ (ThunderClad 1+) and TU-863 are closely interconnected. They exhibit identical thermal and mechanical properties, encompassing a low coefficient of thermal expansion, high glass transition temperature, minimal dissipation factor among other attributes.
Furthermore, their water absorption and applications are the same, which includes base station, high performance computing,servers,and telecom etc.
What are the Differences Between the high speed low loss TU-863+ and the high speed low loss TU-863 ?
The decomposition temperature of the material is 375 degrees Celsius, which differs from that of another variant of TU-863, exhibiting a slightly lower decomposition temperature of 365 degrees Celsius. This distinction contributes to enhanced thermal performance and indicates that the material exhibits minimal chemical decomposition.
For that material,we found that permittivity (RC70%) at 10GHz and the DK value is 3.45 per SPC method E-2/105. For the high speed low loss material, that permittivity (RC50%) at 1GHz(SPC method/HP4291B) and the DK value is 4.1/3.9, at 5GHz(SPC method E-2/105) and the DK value is 4.0,at 10GHz(SPC method E-2/105) and the DK value is 3.9 respectively,so the DK values of both material are different here.
Furthermore, the X and Y axis exhibit a coefficient of thermal expansion (CTE) ranging from 12 to 13 ppm/℃. In contrast, the CTE value for the z-axis varies between materials. Specifically, we observed a z-axis value of 2.2% for the high-speed low loss material. while the other material of high-speed low loss TU-863, that X and Y axis exhibit a coefficient of thermal expansion (CTE) ranging from 11 to 15 ppm/℃, displayed a slightly bigger z-axis value of 2.6%.
This encompasses virtually all the pertinent information regarding the high speed low loss TU-863+ (ThunderClad 1+) Laminate and this PCB material features great properties that enhance the functionality of pcb boards.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
