TSM-DS3 was developed for high power applications (TC = 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. In this article, we’ll discuss what really characterizes the high frequency TSM-DS3 laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency print circuit board, so please feel free to contact us.
What is the high frequency TSM-DS3 laminate?
TSM-DS3 is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3 is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rivals epoxies in fabricating large format complex multilayers.
TSM-DS3 was developed for high power applications (TC = 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3 was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.
A TSM-DS3 core combined with fastRise™27 (Df = 0.0014 at 10 GHz) prepreg is an industry leading solution for the lowest possible dielectric losses that can be attained at epoxy-like 420°F fabrication temperatures. The low insertion losses of TSM-DS3/ fastRise™27 are only rivaled by fusion bonding (PTFE laminates melt from 550 to 650°F (288 – 343°C)). Fusion bonding is expensive, it causes excessive material movement and it puts stress on plated through holes. For complex multilayers, the price of poor yield drives up the final material cost. fastRise™27 enables the sequential lamination of TSM-DS3 at a low 420°F (215°C) with consistency and predictability that reduces cost.
For microwave applications, the low x, y and z CTE values assure that critical spacings between traces in filters and couplers have very low movement with temperature.
TSM-DS3 can be used with very low profile copper foils yielding a smooth copper edge between coupled lines. Registration over many layers is critical for yield and variations in copper weight and copper etching across a panel can cause nonlinear movement. Non-linear movement over large panels leads to a lack of registration of the drilled hole to the pad and possibly open circuits. The laminate is compatible with Ticer® and OhmegaPly® resistive foils. Resistor foil stability is best achieved when laminating at low temperatures using AGC’s fastRise™27 family of prepregs.
TSM-DS3 high frequency laminate data sheet
TSM-DS3 is intended for RF circuitry and requires OEM design validation for digital circuitry.
Features of the high frequency TSM-DS3 laminate
Temperature-Stable Dielectric Constant (Dk ±0.25% from -30°C to 120°C)
With a stable dielectric constant (Dk) of ±0.25% across a wide temperature range from -30°C to 120°C, TSM-DS3 ensures consistent performance even in fluctuating thermal environments. Exceptional thermal stability ensures consistent signal integrity across extreme temperature ranges, eliminating performance drift in harsh environments.
Industry-Best Dissipation Factor (Df = 0.0011 @10 GHz)
Achieving a loss tangent (Df) of 0.0011 at 10 GHz, this laminate minimizes signal degradation, making it ideal for high-frequency applications. Ultra-low signal loss at high frequencies makes it ideal for mmWave and RF designs, preserving power efficiency and minimizing heat generation.
High Thermal Conductivity (0.65 W/m·K)
Boasting a thermal conductivity of 0.65 W/m*K, TSM-DS3 efficiently dissipates heat, ensuring reliable operation under demanding thermal loads. Efficient heat dissipation reduces hotspots, extending component lifespan in power-dense applications.
Low Fiberglass Content (~5%)
With approximately 5% fiberglass, the material is lightweight yet robust, providing an optimal balance of mechanical strength and electrical performance. Minimizes resin-rich areas, enhancing dimensional stability and reducing the risk of delamination during thermal cycling.
Epoxy-Rivaling Dimensional Stability
Matching the stability typically associated with epoxy resins, TSM-DS3 maintains its form and function even under thermal and mechanical stress. Near-zero CTE (Coefficient of Thermal Expansion) ensures alignment integrity in multilayer PCBs, even under thermal stress.
Compatibility with Resistive Foils
This laminate is fully compatible with resistive foils, expanding its usability in a variety of advanced electronic applications. Seamlessly integrates with embedded resistive materials for hybrid circuit designs, simplifying complex layouts.
Applications of the high frequency TSM-DS3 laminate
The laminate’s properties make it indispensable across industries requiring precision, durability, and high-frequency performance:
Couplers and Phased Array Antennas
The low loss and stable dielectric properties make TSM-DS3 an excellent choice for high-performance couplers and phased array systems, ensuring precise signal control and minimal interference. Ideal for designing couplers and phased array antennas where minimal signal loss and high precision are crucial.
Radar Manifolds
Utilized in radar manifolds for their ability to maintain stable performance under varying conditions. Its reliable performance under extreme conditions makes it ideal for radar systems, where signal integrity is paramount.
mmWave and Automotive Antennas
With the rapid growth of mmWave technology and automotive connectivity, TSM-DS3 supports advanced antenna designs that operate at high frequencies with uncompromised efficiency. Supports the development of advanced automotive radar systems by providing reliable performance at millimeter-wave frequencies.
Oil Drilling
In harsh environments, such as those encountered in oil drilling, the material’s robust performance ensures longevity and reliability. Withstands high temperatures and vibrations in downhole monitoring tools.
Semiconductor and ATE Testing
For the semiconductor industry and automated test equipment (ATE) setups, TSM-DS3 provides the consistency needed for accurate, high-speed testing and quality assurance. Offers dependable performance in semiconductor and automatic test equipment (ATE) testing environments, where accuracy and consistency are paramount.
Advantages of the high frequency TSM-DS3 laminate
eyond its superior material properties, TSM-DS3 offers significant benefits in terms of manufacturing and processability:
Enables Large Format, High Layer Count PWBs
TSM-DS3 facilitates the production of complex printed wiring boards (PWBs) with large formats and high layer counts without compromising performance. Superior dimensional stability allows fabrication of oversized multilayer boards without warping or registration issues.
Complex Designs with Predictable Yield
Its excellent processability ensures that even intricate board designs can be built with high consistency and predictable yields. This is a crucial factor for manufacturers looking to maintain quality while scaling production.
Facilitates Complex PCB Designs and Ease of Processing
The laminate’s unique characteristics enable the creation of multifaceted PWB layouts, supporting advanced electronic applications that demand both precision and reliability. Its compatibility with standard PCB manufacturing processes and materials facilitates easier integration into existing workflows, reducing production complexity and costs.
Conclusion
TSM-DS3 Dimensionally Stable Low Loss laminate represents a cutting-edge solution for high frequency applications, offering unparalleled temperature stability, superior dissipation factor, high thermal conductivity, and excellent dimensional stability. Moreover, the manufacturing advantages offered by TSM-DS3, including support for complex designs and consistent quality, make it an invaluable asset for manufacturers seeking to enhance product performance while maintaining cost-effectiveness.
