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With the continuous development of modern electronic products toward high performance and high integration, heat dissipation has increasingly become a key factor limiting the improvement of product performance. Owing to their excellent thermal conductivity and electrical properties, copper substrates have become one of the ideal choices for heat dissipation solutions in high-power LED lighting, automotive electronics, and various high-performance computing devices in the electronics industry.
In this context, QFPCB Factory has closely followed market demand and continued to innovate, introducing a series of heat dissipation solutions, including single-side and double-sided aluminum substrates, single-side and double-sided copper substrates, and multilayer metal substrates. Additionally, the company plans to further develop embedded copper block heat dissipation technology suitable for high-layer-count PCBs.
Taking its latest double-sided “thermoelectric separation” copper substrate as an example, compared to traditional single-sided aluminum or copper substrates, the double-sided copper substrate is not only suitable for surface-mount devices but also effectively addresses the heat dissipation challenges of through-hole components. This is because the pins of through-hole components do not come into direct contact with conductive materials on the double-sided copper substrate, thereby avoiding short-circuit issues. At the same time, the double-sided copper substrate also supports via hole designs, enabling the conduction of double-sided circuits and providing more possibilities for the circuit connections of additional components.
Let’s first look at the image above, which represents a standard aluminum or copper substrate. In this design, heat dissipation must pass through the thermally conductive dielectric layer (shown in purple). While this type of substrate is relatively easy to manufacture, its thermal conductivity decreases after passing through the dielectric layer. Such substrates are suitable for low-power LED lights, where basic performance is sufficient.
However, for applications like automotive LED chips or high-frequency PCBs, where heat dissipation demands are significantly higher, aluminum substrates or standard copper substrates may no longer meet the requirements. In such cases, thermoelectric separation copper substrates are commonly used.
What exactly is a thermoelectric separation copper substrate?
In a thermoelectric separation copper substrate, the circuit layer and the thermal layer are located on different layers. The thermal layer directly contacts the heat dissipation part of the LED chip (as shown on the right side of the image above), achieving optimal heat dissipation with zero thermal resistance.
Advantages of Thermoelectric Separation Copper Substrates:
1.High thermal conductivity of the copper substrate itself, ensuring excellent heat conduction and dissipation.
2.The thermoelectric separation structure enables zero thermal resistance contact with the LED chip, reducing light degradation and maximizing the chip’s lifespan.
3.High density, allowing for a smaller size under the same power requirements.
4.Ideal for use with single high-power LED chips, especially in COB packaging, to enhance the overall performance of lighting fixtures.
5.Customizable structural designs based on specific lighting fixture requirements, resulting in raised features (such as copper protrusions, copper recesses, or parallel heat dissipation structures) after processing.
What are the design requirements for the “raised features” on thermoelectric separation copper substrates?
The minimum width for the raised features on a thermoelectric separation copper substrate is 1 mm. The shape can be designed as needed (most commonly as square pads, but polygonal shapes are also possible). Areas requiring raised features should be clearly marked and provided as images, compressed together with the PCB files for submission. It is recommended to review the production draft for confirmation.
The double-sided “thermoelectric separation” copper substrate produced by QFPCB has achieved a leap in thermal conductivity. Utilizing a special raised structure for heat dissipation, the substrate boasts a thermal conductivity as high as 380 W/m·K, far surpassing the 1-2 W/m·K of ordinary copper substrates. Its withstand voltage can reach up to 5000V, primarily determined by the thickness of the FR4 material. This significant improvement in thermal performance enables the double-sided “thermoelectric separation” copper substrate to more effectively meet the heat dissipation requirements of high-heat-generating components such as high-power transistors, MOS tubes, LEDs, and triodes, thereby ensuring the stable operation and extended service life of electronic products.
The double-sided “thermoelectric separation” copper substrate processed by our company not only marks a major breakthrough in PCB thermal management technology for QFPCB but also reflects its proactive response to the trend of high performance and high integration in electronic products. As market demands for thermal performance continue to rise, this product is expected to see widespread adoption in the future, providing a solid guarantee for the stable operation and extended lifespan of electronic devices.
Moving forward, QFPCB will continue to uphold the principle of “making technological innovation more efficient,” constantly optimizing product quality and service levels, and dedicating itself to driving the sustained development of the electronics industry. If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
