RF Antenna PCBs (e.g., RF amplifiers and RF filters) should be positioned as close as possible to the RF antenna or RF input/output ports to minimize signal loss and optimize
IM Series™ high-frequency laminates represent an exceptional Passive Intermodulation (PIM) performance enhancement of our AD300D™, AD255C™ and DiClad® 880 antenna-grade laminates. This combination of ultra-low roughness IM foil with the
The IsoClad 917 and IsoClad 933 series boast a low dielectric constant (Dk ≈ 2.2–2.33 at 10 GHz), minimizing signal propagation delays and phase distortions. With an ultra-low dissipation factor
With a stable dielectric constant (Dk) of 3.5, TLF-35A minimizes passive intermodulation distortion (PIMD), ensuring superior signal integrity in high-frequency environments.
CER-10 is an organic-ceramic DK-10 laminate belonging to the ORCER family of Taconic products. It features a woven glass reinforcement, which contributes to its exceptional interlaminar bond strength and solder
Panasonic's R-5515 laminates stand out as a premium choice for high-performance applications. It has a dielectric constant of 3.06 and a dissipation factor of 0.0021, making it ideal for multilayer
Shengyi AEROWAVE 300 laminate is a high-performance, low-loss PCB material specifically engineered for advanced RF and microwave applications. With a dielectric constant (3.0 @10GHz), AeroWave 300 laminate maintains excellent dielectric
Shengyi SCGA-500 GF220 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.20(±0.02) at 10GHz, the laminate maintains outstanding dielectric stability
Shengyi SCGA-500 GF255 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.55(±0.04) at 10GHz, the laminate maintains outstanding dielectric stability
Shengyi SCGA-500 GF265 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.65(±0.04) at 10GHz, the laminate maintains outstanding dielectric stability
Shengyi SCGA-500 GF300 laminate is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 3.00(±0.04) at 10GHz, the laminate maintains outstanding dielectric
Shengyi SG7350D2 laminate have a low dielectric constant of 3.55 at 10 GHz, maintains outstanding dielectric stability across various frequency and temperature ranges. Shengyi SG7350D2 laminate is a high-performance laminate
The LNB33 laminate is characterized by a high glass transition temperature (Tg) exceeding 280°C. The dielectric constant (Dk) of LNB33 laminate is approximately 3.30±0.05 at 10 GHz (as per IPC-TM-650
The LNB33C laminate is characterized by a high glass transition temperature (Tg) exceeding 280°C.The dielectric constant (Dk) of LNB33C laminate is approximately 3.30 ± 0.05 at 10 GHz (as per
The IT-8615G material has a Dielectric Constant (Dk) of 6.15, which is precisely tailored for specific RF applications. With a dissipation factor (0.0038 @ 10 GHz) translates to reduced dielectric
With a Glass Transition Temperature (Tg) exceeding 210°C, this laminate exhibits exceptional thermal stability, making it highly resilient to the elevated temperatures encountered during lead-free assembly processes and in demanding
With a Glass Transition Temperature (Tg) exceeding 210°C, the laminate offers exceptional thermal stability, making it resilient against the high temperatures encountered during lead-free assembly processes and in demanding operational
IT-88GMW laminate offers a low dielectric constant (Dk) of less than 3.02 at 10GHz. this low Dk helps in minimizing signal distortion and maintaining signal integrity. It has a low
RO3035™ laminates are ceramic-filled PTFE-based circuit materials that exhibit consistent mechanical properties irrespective of the selected dielectric constant. The low loss tangent of 0.0015 at 10 GHz to enable low
These AD250C™, AD255C™, AD300D™ and AD350A™ Series antenna products are glass-reinforced, PTFE-based composites that offer controlled dielectric constants, low-loss performance, and superior passive intermodulation (PIM) characteristics.
F4BTMS series（F4BTMS220、F4BTMS233、F4BTMS255、F4BTMS265、F4BTMS294、F4BTMS300、F4BTMS350、F4BTMS430、F4BTMS450、F4BTMS615、F4BTMS1000） is the upgraded version of the F4BTM series. Significant technical advancements have been achieved in material formulation and production processes
RO4835INDTM LoPro® thermoset laminates have a stable Dk of 3.48 at 10 GHz, this material ensures consistent signal integrity across a wide frequency range, minimizing phase shifts and impedance mismatches.
TC600 is a woven fiberglass reinforced, ceramic-filled PTFE composite for printed circuit boards. It offers high thermal conductivity, reducing dielectric and insertion losses, and improving amplifier and antenna performance. Its
RO4725JXR™ and RO4730G3™ laminates possess the mechanical and electrical properties essential for antenna design. These materials exhibit a dielectric constant (Dk) of 2.55 and 3.0, respectively, and a loss tangent
