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Home
About
PCB Assembly
BGA Assembly
SMT Assembly
Flex PCB Assembly
Rigid-flex PCB Assembly
Turnkey PCB Assembly
Lead Free PCB Assembly
Prototype PCB Assembly
Quick Turn PCB Assembly
High Volume PCB Assembly
Low Volume PCB Assembly
PCB Manufacturing
Products
High Frequency Circuit Board
Multilayer Circuit Board
Rigid Flex Circuit Board
ATE PCB Circuit Board
HDI Circuit Board
Ceramic PCB
IC Substrate PCB
High Frequency PCB
Heavy Copper PCB
High Speed PCB
Multilayer PCB
Rigid Flex PCB
DCB/DBC Ceramic PCB
Metal Core PCB
IC Substrate
Flexible PCB
PCB Design
HDI PCB
ATE PCB
PCB Layer Stackup
Impedance Control PCB
Applications
Blog
PCB Materials
Ceramic PCB Technology
PCB Design Technology
High Frequency Technology
PCBA Assembly Technology
PCB Manufacturing Technology
Contact us
PIM laminate
Shengyi LNB33C Ceramic Filler Laminate That Is A Premier Choice For High Frequency Antenna PCB Application
The LNB33C laminate is characterized by a high glass transition temperature (Tg) exceeding 280°C.The dielectric constant (Dk) of LNB33C laminate is approximately 3.30 ± 0.05 at 10 GHz (as per
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