Shengyi S1150G features a glass transition temperature of 155 degree Celsius. With a dielectric constant (4.5 @1GHz), the Dielectric Constant (Dk) of Shengyi S1150G material is a measure of its
Panasonic R-1786 PCB material offers a Tg value of 140 degrees Celsius, the glass transition temperature describes how a PCB material transforms from a solid state to a molten state.
IT-8350G is an advanced Ultra-Low Loss (ULL) & High Tg (185°C by TMA) material specifically engineered to meet the stringent requirements of demanding Radio Frequency (RF) applications.The Dielectric Constant (Dk)
RO3035™ laminates are ceramic-filled PTFE-based circuit materials that exhibit consistent mechanical properties irrespective of the selected dielectric constant. The low loss tangent of 0.0015 at 10 GHz to enable low
Panasonic R-3566D is a high CTI and high RTI material, it has an excellent tracking resistance and excellent heat resistance. R-3566D has a glass transition temperature (Tg) of 170 degrees
IT-150DATC is a high Tg (180° C by DSC), advanced multifunctional epoxy and low loss material. This material has low Dk and low Df performance.With a dielectric constant (3.73 @
The R-1755D boasts a high Tg value of ≥154°C, ensuring dimensional stability and mechanical integrity even under elevated temperatures. Panasonic R-1755D has a low Df of 0.016 at 1 GHz,
EM-828G is high-temperature, halogen-free materials made from epoxy resin and E-glass fabric. The high Tg of 170 °C EM-828G PCB material which is known for its elevated glass transition temperature
TC600 is a woven fiberglass reinforced, ceramic-filled PTFE composite for printed circuit boards. It offers high thermal conductivity, reducing dielectric and insertion losses, and improving amplifier and antenna performance. Its
VT-770 and VT-770(LK) are advanced high frequency laminates specifically designed for applications that demand excellent electrical performance, high thermal stability, and reliability. With a high Tg of 260°C, these laminates
At 10GHz, VT-6735 maintains a low dielectric constant of 3.5, VT-6735 delivers outstanding thermal conductivity, exceeding 1 W/mK. This characteristic ensures efficient heat dissipation, which is crucial for maintaining device
TLY-5 laminates are made from lightweight woven fiberglass, offering superior dimensional stability compared to chopped fiber-reinforced PTFE composites.Its low dissipation factor ensures reliable performance in automotive radar applications operating at
TC350™ Plus laminates are ceramic-filled PTFE-based woven glass reinforced composite materials that offer a cost-effective, high performance, thermally enhanced solution for circuit designers.The low loss tangent of 0.0017 at 10
I-Tera MT40 is an advanced laminate material meticulously engineered to meet the stringent demands of today’s high-speed digital and RF/microwave printed circuit board (PCB) designs.With a dissipation factor as low
VT-4BC features a high glass transition temperature of 180°C ensures it maintains its structural integrity and electrical properties at elevated temperatures. it features a thermal conductivity of 10 W/mK, which
VT-3703 and VT-3706 high frequency laminates are engineered to meet the stringent demands of modern RF and microwave applications. both low Dk (3.0) and high Dk (6.15) with extremely low
The Shengyi S1000-2M PCB material is a high-performance FR-4 epoxy laminate & prepreg systems designed for advanced circuitry applications. And the S1000-2M pcb material also brings the board reliability with
TU-872 SLK Sp is formulated from a high-performance, modified epoxy FR-4 resin. This material is reinforced with innovative woven glass fabric and specifically engineered to possess an exceptionally low dielectric
TU-883 is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and
The Shengyi S1000H is a highly efficient laminate used for bonding several layers of multilayer boards. Shengyi S1000H features a glass transition temperature of 150 degree Celsius. Also, it is
NF-30 copper clad, non-reinforced laminates are high-performance ceramic-filled PTFE composites specifically designed for use in advanced microwave and high-frequency electronic applications. The ceramic-filled PTFE composite exhibits a very low dielectric
RF-10 copper-clad laminates are composite materials made from ceramic-filled PTFE and woven fiberglass. RF-10 laminates feature a tight dielectric constant (DK) tolerance of 10.2 ± 0.3, which provides excellent consistency
FR408 is a high-performance FR-4 epoxy laminate & prepreg systems designed for advanced circuitry applications. Its low dielectric constant and low dissipation factor make it an ideal candidate for broadband
TU-872 SLK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor
