Rogers RO3010 laminates are ceramic-filled PTFE composite suitable for applications up to 77 GHz. It exhibits a dielectric constant of 11.20 at room temperature, which remains stable up to 40
TP material stands out as a distinctive high-frequency thermoplastic in the industry. The dielectric layer of the TP laminate is uniquely composed of a blend of ceramic and polyphenylene oxide
TLX Series materials offer unparalleled reliability across a broad spectrum of RF applications. This versatility stems from its dielectric constant (DK) range of 2.45 to 2.65, along with a variety
Rogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on
The high Tg of 180 °C (DSC) TU-752 PCB material which is known for its elevated glass transition temperature (Tg). TU-752/ TU-75P laminate / prepreg are made of high quality
F4BTM and F4BTME laminates offer a dielectric constant (DK) ranging from 2.98 to 3.50, selectable based on design needs. Lower DK variants enable wider impedance control and reduced signal delay,
The Panasonic R-1766 PCB material is characterized by a glass transition temperature (Tg) of 140 degrees Celsius. The Panasonic R-1766 exhibits a dielectric constant of 4.3 at 1 GHz. And
Panasonic Ecool R-1787 PCB material offers a Tg value of 140 degrees Celsius, the glass transition temperature describes how a PCB material transforms from a solid state to a molten
Shengyi SCGA-500 GF220 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.20(±0.02) at 10GHz, the laminate maintains outstanding dielectric stability
With a Tg of 140°C exceeding industry standards, ensuring dimensional stability and resistance to deformation under elevated temperatures. One of its most valued properties is the thermal conductivity of 1.0
Shengyi SCGA-500 GF265 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.65(±0.04) at 10GHz, the laminate maintains outstanding dielectric stability
SAR20H Metal Base Laminate is a high performance material that excels in demanding applications requiring efficient thermal management, mechanical stability, and environmental compliance. Its versatility and ease of processing make
The SAR15 material is halogen-free, aligning with global environmental regulations, and offers a high Comparative Tracking Index (CTI), making it safer and more resistant to electrical failures caused by moisture
This is a halogen-free build-up material for printed wiring boards. MGC's halogen-free material achieves the UL94 V-0 flame retardancy level not only without using brominated flame retardants or antimony compounds
The DS-7409HG laminate demonstrates a dielectric constant of 4.6 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The DS-7409HG(IQ) laminate demonstrates a dielectric constant of 4.3 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
At a frequency of 1 GHz, the material has a dielectric constant (Dk) of 5.7, which measures its ability to store electrical energy in a capacitor-like manner. One of the
Shengyi WLM1 Laminate have a high Glass Transition Temperature (Tg) (typically 180°C, confirm specific grade via datasheet), providing critical dimensional stability during high-temperature SMT assembly processes and under the sustained
The Shengyi SI13U laminate demonstrates a dielectric constant of 4.8 at 1 GHz. A dissipation factor of 0.013 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during
The Shengyi SAR30 material is halogen-free, aligning with global environmental regulations, and offers a high Comparative Tracking Index (CTI), making it safer and more resistant to electrical failures caused by
The Shengyi S1190 laminate exhibits a glass transition temperature (Tg) of 170 °C under Thermomechanical Analysis (TMA) conditions, while its Tg under Dynamic Mechanical Analysis (DMA) conditions is 200 °C.The
Shengyi Synamic8G laminate have a glass transition temperature of 200 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance. The dielectric constant of Synamic8G is
The Shengyi ST110G laminate is fully halogen-free and exhibits a glass transition temperature (Tg) of 175 °C under Dynamic Mechanical Analysis (DMA). One of the standout features of ST110G laminate
The IT-170GRA2TC is a high Tg (175° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. IT-170GRA2TC cooperation produces
