Shengyi SH260 is a pure polyimide with a high glass transition temperature of 250⁰C laminate and prepreg system, reinforced with a non-woven aramid substrate.One crucial aspect to consider is its
VT-4B7 features a robust thermal conductivity of 7.0 W/mK, Facilitates rapid heat transfer away from components, ensuring optimal performance and longevity. with an MOT of 130°C, VT-4B7 can operate reliably
With a Tg of 140°C exceeding industry standards, ensuring dimensional stability and resistance to deformation under elevated temperatures. One of its most valued properties is the thermal conductivity of 1.0
SAR20H Metal Base Laminate is a high performance material that excels in demanding applications requiring efficient thermal management, mechanical stability, and environmental compliance. Its versatility and ease of processing make
The SAR15 material is halogen-free, aligning with global environmental regulations, and offers a high Comparative Tracking Index (CTI), making it safer and more resistant to electrical failures caused by moisture
This is a halogen-free build-up material for printed wiring boards. MGC's halogen-free material achieves the UL94 V-0 flame retardancy level not only without using brominated flame retardants or antimony compounds
The DS-7409HG(IQ) laminate demonstrates a dielectric constant of 4.3 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
At a frequency of 1 GHz, the material has a dielectric constant (Dk) of 5.7, which measures its ability to store electrical energy in a capacitor-like manner. One of the
Shengyi WLM1 Laminate have a high Glass Transition Temperature (Tg) (typically 180°C, confirm specific grade via datasheet), providing critical dimensional stability during high-temperature SMT assembly processes and under the sustained
The DS-7402HD laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The Shengyi SI13U laminate demonstrates a dielectric constant of 4.8 at 1 GHz. A dissipation factor of 0.013 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during
One of its standout features is its exceptionally high glass transition temperature (Tg) of 280°C, which ensures outstanding dimensional stability and minimal warpage under elevated temperatures. The Shengyi SI10US laminate
The Shengyi SAR30 material is halogen-free, aligning with global environmental regulations, and offers a high Comparative Tracking Index (CTI), making it safer and more resistant to electrical failures caused by
The Shengyi S1190 laminate exhibits a glass transition temperature (Tg) of 170 °C under Thermomechanical Analysis (TMA) conditions, while its Tg under Dynamic Mechanical Analysis (DMA) conditions is 200 °C.The
Shengyi S1141 features a low glass transition temperature (Tg), the transition temperature of the material is precisely 140 degrees centigrade.With a dielectric constant (4.4 @1GHz), The Dielectric Constant (Dk) of
IT-958GTC laminate is a halogen free, High Tg (175° C by DSC), advanced multifunctional epoxy and low loss material. IT-958GTC laminate offers a low dielectric constant (Dk) of 3.7 at
Aluminum Nitride (AlN) is the best available thermally conductive material (170 W/mK) that is also a strong electric insulator. It is therefore used in a variety of applications where heat
The NP-175FM provides a minimum Tg of 170°C, making it fully lead-free compatible and suitable for advanced soldering profiles. The NP-175FM offers a well-balanced dielectric constant (DK 4.2 @1GHz) and
This DuPont™ Pyralux® HT laminate exhibits low dielectric constant (Dk 3.4 @1MHz) and low dissipation factor (Df 0.002 @1MHz), resulting in minimal signal loss and stable electrical performance across a
Ceramic printed circuit boards (PCB), also known as ceramic substrates, they are made with ceramic materials such as aluminum oxide(Al₂O₃) or aluminum nitride(AIN) instead of the standard fiberglass material. Ceramic
Yellowing has been observed on the Al₂O₃ ceramic portions of Direct Bonded Copper (DBC) substrates, with varying degrees of discoloration. Recently, some customers have expressed concerns that this phenomenon might
ThinFlex-W22, W-2010ED-N4 is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with ED copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
Ceramic metallization has the following requirements: excellent sealing performance, low sheet resistance and resistivity of the metal conductive layer, strong adhesion to the ceramic substrate, and the ceramic must still
