pcb board Archives

VT-447C Laminate That Is A Premier Choice For High Tg And High CTI PCB Application

The high glass transition temperature (Tg) of VT-447C, typically above 170°C, provides exceptional thermal stability.VT-447C is formulated as a halogen-free material, offering significant environmental and safety advantages over traditional brominated

Panasonic R-1755V Laminate That Is A Premier Choice For High Reliability Glass Epoxy Multi-layer PCB Application

The R-1755V boasts a high Tg value of ≥165°C, ensuring dimensional stability and mechanical integrity even under elevated temperatures. Panasonic R-1755V has a low Df of 0.016 at 1 GHz,

Shengyi SAR10S Aluminium Base Laminate That Is A Premier Choice For Mid-power LED Lighting Applications

With a Tg of 140°C exceeding industry standards, ensuring dimensional stability and resistance to deformation under elevated temperatures. One of its most valued properties is the thermal conductivity of 1.0

Shengyi SAR20H Aluminium Base Laminate That Is A Premier Choice For Hi-pot LED Lighting Application

SAR20H Metal Base Laminate is a high performance material that excels in demanding applications requiring efficient thermal management, mechanical stability, and environmental compliance. Its versatility and ease of processing make

Shengyi SAR15 Aluminium Base Laminate That Is A Premier Choice For LED TV Application

The SAR15 material is halogen-free, aligning with global environmental regulations, and offers a high Comparative Tracking Index (CTI), making it safer and more resistant to electrical failures caused by moisture

The IC Substrate Uses Low CTE Halogen-Free CCL-HL832NX Series BT Material For Semiconductor Packaging

This is a halogen-free build-up material for printed wiring boards. MGC's halogen-free material achieves the UL94 V-0 flame retardancy level not only without using brominated flame retardants or antimony compounds

The IC Substrate Uses BT Material (CCL-HL820WDI ) For Chip-LEDs

At a frequency of 1 GHz, the material has a dielectric constant (Dk) of 5.7, which measures its ability to store electrical energy in a capacitor-like manner. One of the

Shengyi WLM1 High Tg Laminate White Color PCB Substrate for Mini-LED Backlight

Shengyi WLM1 Laminate have a high Glass Transition Temperature (Tg) (typically 180°C, confirm specific grade via datasheet), providing critical dimensional stability during high-temperature SMT assembly processes and under the sustained

DS-7402HD Halogen Free Laminate That Is A Premier Choice For IC Package – Memory – PC DRAM Applications

The DS-7402HD laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor

Shengyi SI13U Low CTE Laminate For PKG Substrate Fabrication

The Shengyi SI13U laminate demonstrates a dielectric constant of 4.8 at 1 GHz. A dissipation factor of 0.013 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during

Shengyi SI10US Advanced High Modulus Laminate For PKG Substrate Fabrication

One of its standout features is its exceptionally high glass transition temperature (Tg) of 280°C, which ensures outstanding dimensional stability and minimal warpage under elevated temperatures. The Shengyi SI10US laminate

Shengyi SAR30 Aluminium Base Laminate That Is A Premier Choice For Hi-power LED lighting Application

The Shengyi SAR30 material is halogen-free, aligning with global environmental regulations, and offers a high Comparative Tracking Index (CTI), making it safer and more resistant to electrical failures caused by

Shengyi S1151G Mid-Tg Laminate That Is A Premier Choice For High CTI PCB Application

Shengyi S1151G features a glass transition temperature of 155 degree Celsius.With a dielectric constant (4.6 @1GHz), the Dielectric Constant (Dk) of Shengyi S1151G material is a measure of its ability

Shengyi S1141 Laminate That Is A Premier Choice For Conventional FR-4 PCB Application

Shengyi S1141 features a low glass transition temperature (Tg), the transition temperature of the material is precisely 140 degrees centigrade.With a dielectric constant (4.4 @1GHz), The Dielectric Constant (Dk) of

IT-968TC Ultra Low Loss Laminate That Is A Premier Choice For High Tg And Lead Free PCB Application

The IT-968TC laminate is an advanced low CTE, high Tg (190° C by TMA) and ultra low loss material.With a lower Dk of 3.66 @ 10GHz and Ultra low Df

High Thermal Conductivity Aluminum Nitride (AlN) Ceramic Substrate

Aluminum Nitride (AlN) is the best available thermally conductive material (170 W/mK) that is also a strong electric insulator. It is therefore used in a variety of applications where heat

NP-175FM High Tg Laminate That Is A Premier Choice For High Thermal Reliability Application

The NP-175FM provides a minimum Tg of 170°C, making it fully lead-free compatible and suitable for advanced soldering profiles. The NP-175FM offers a well-balanced dielectric constant (DK 4.2 @1GHz) and

DuPont™ Pyralux® HT Flexible Circuit Materials For Multilayer Flex And Rigid Flex PCB Applications

This DuPont™ Pyralux® HT laminate exhibits low dielectric constant (Dk 3.4 @1MHz) and low dissipation factor (Df 0.002 @1MHz), resulting in minimal signal loss and stable electrical performance across a

ThinFlex-W22, W-2010ED-N4 Adhesiveless Double Sided Copper Clad Laminate

ThinFlex-W22, W-2010ED-N4 is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with ED copper foil on both sides. With a dielectric constant (3.3 @1GHz) and

In-depth Understanding of Ceramic Substrate Metallization: The Perfect Combination of Ceramics and Metal

Ceramic metallization has the following requirements: excellent sealing performance, low sheet resistance and resistivity of the metal conductive layer, strong adhesion to the ceramic substrate, and the ceramic must still

DuPont™ Pyralux® AP All-Polyimide Flexible Laminate That Is A Premier Choice For Multilayer Flex And Rigid Flex Application

DuPont™ Pyralux® AP double-sided, copper-clad laminate is an all-polyimide composite of polyimide film bonded to copper foil. With a dielectric constant (3.4 @1MHz) and With a dissipation factor (0.003 @1MHz),

The noble one among metal-core PCBs, the thermoelectrically separated copper substrate (with high thermal conductivity of 380W)

The double-sided "thermoelectric separation" copper substrate produced by QFPCB has achieved a leap in thermal conductivity. Utilizing a special raised structure for heat dissipation, the substrate boasts a thermal conductivity

ThinFlex-W22, W-1005RD-C Adhesiveless Double Sided Copper Clad Laminate

ThinFlex-W22, W-1005RD-C represents a significant advancement in flexible printed circuit (FPC) materials technology. It is an adhesiveless double-sided (D/S) copper clad laminate, engineered to meet the demanding requirements of modern

ThinFlex-W22, W-2005RD-C Adhesiveless Double Sided Copper Clad Laminate

ThinFlex-W22, W-2005RD-C is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with RA copper foil on both sides. With a dielectric constant (3.3 @1GHz) and