The Shengyi S1190 laminate exhibits a glass transition temperature (Tg) of 170 °C under Thermomechanical Analysis (TMA) conditions, while its Tg under Dynamic Mechanical Analysis (DMA) conditions is 200 °C.The
The I-Speed® provides a minimum Tg of 180°C, ensuring superior dimensional and mechanical stability under high thermal loads, making it ideal for use in lead-free soldering and high-temperature reflow processes.With
TU-872 SLK Sp is formulated from a high-performance, modified epoxy FR-4 resin. This material is reinforced with innovative woven glass fabric and specifically engineered to possess an exceptionally low dielectric
