pcb material

high thermal material

VT-901 is a high glass transition temperature (Tg) of 250°C pcb material, It provides exceptional thermal stability.With a Td of 395°C, VT-901 exhibits exceptional thermal stability, minimizing material degradation during
The high glass transition temperature (Tg) of VT-447C, typically above 170°C, provides exceptional thermal stability.VT-447C is formulated as a halogen-free material, offering significant environmental and safety advantages over traditional brominated
Rogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on
Synamic 6N laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method. Synamic 6N
The IT-170GRA2TC is a high Tg (175° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. IT-170GRA2TC cooperation produces
IT-998GSETC laminates are specifically engineered to meet these demands. With an ultra-low dielectric constant (Dk < 3.21 @ 10 GHz) and ultra-low dissipation factor (Df < 0.0014 @ 10 GHz),
Aluminum Nitride (AlN) is the best available thermally conductive material (170 W/mK) that is also a strong electric insulator. It is therefore used in a variety of applications where heat
The IS550H laminate features a glass transition temperature (Tg 200°C), providing excellent thermal stability and dimensional integrity under elevated temperatures. With a dielectric constant (DK 4.43 @10GHz) and a dissipation
The high Tg of 185°C (DSC) IT-170GT PCB material which is known for its elevated glass transition temperature (Tg). IT-170GT cooperation produces laminates with dielectric constant as low as 3.9
The R-1755D boasts a high Tg value of ≥154°C, ensuring dimensional stability and mechanical integrity even under elevated temperatures. Panasonic R-1755D has a low Df of 0.016 at 1 GHz,
TU-862HF is high-temperature and halogen-free materials made from epoxy resin and E-glass fabric.The high Tg of 200 °C TU-862HF PCB material which is known for its elevated glass transition temperature
EM-828G is high-temperature, halogen-free materials made from epoxy resin and E-glass fabric. The high Tg of 170 °C EM-828G PCB material which is known for its elevated glass transition temperature
TC350™ Plus laminates are ceramic-filled PTFE-based woven glass reinforced composite materials that offer a cost-effective, high performance, thermally enhanced solution for circuit designers.The low loss tangent of 0.0017 at 10

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