One of its standout features is its exceptionally high glass transition temperature (Tg) of 280°C, which ensures outstanding dimensional stability and minimal warpage under elevated temperatures. The Shengyi SI10US laminate
Shengyi mmWave77 laminate maintains exceptional dielectric stability over high frequency and temperature, with a low Dk of 3.07 at 10GHz, and the material has a very low dissipation factor (typically
Synamic 6N laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method. Synamic 6N
Shengyi Synamic6GX laminate have a glass transition temperature of 172 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance.The dielectric constant of Synamic6GX is 3.73,
Shengyi Synamic8G laminate have a glass transition temperature of 200 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance. The dielectric constant of Synamic8G is
Synamic 6 laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method.Synamic 6 laminate
IT-998GSETC laminates are specifically engineered to meet these demands. With an ultra-low dielectric constant (Dk < 3.21 @ 10 GHz) and ultra-low dissipation factor (Df < 0.0014 @ 10 GHz),
The IT-988GLSETC is an advanced low CTE, high Tg (Glass Transition Temperature, reaching 180° C as measured by TMA) and ultra low loss material. It has a relatively lower value,
With a Glass Transition Temperature (Tg) exceeding 210°C, this laminate exhibits exceptional thermal stability, making it highly resilient to the elevated temperatures encountered during lead-free assembly processes and in demanding
N4000-13 laminate is high glass transition temperature (Tg > 210°C), which ensures thermal reliability in demanding applications. the material also features a low dielectric constant (DK 3.6 @ 10GHz) and
TerraGreen® 400G2 features a glass transition temperature (Tg) of 200°C, With a dielectric constant (DK 3.10 @ 10GHz) and a dissipation factor (DF 0.0015 @ 10GHz) translates to reduced dielectric
The I-Speed® provides a minimum Tg of 180°C, ensuring superior dimensional and mechanical stability under high thermal loads, making it ideal for use in lead-free soldering and high-temperature reflow processes.With
NPG-186 laminate have a glass transition temperature (Tg) of 210°C (DMA),making it ideal for high thermal reliability environments. Key electrical properties such as a low dielectric constant (DK 3.66 @10GHz)
NPG-170D is designed with a glass transition temperature (Tg) of 170℃ (DSC), delivering superior thermal stability during both assembly and end-use. Its dielectric constant (DK 4.0 @1GHz) and dissipation factor
IT-88GMW laminate offers a low dielectric constant (Dk) of less than 3.02 at 10GHz. this low Dk helps in minimizing signal distortion and maintaining signal integrity. It has a low
