RT/duroid® 5870 and 5880 glass microfiber rein forced PTFE composites are designed for exacting strip line and micro strip circuit applications. the two products in this family are RT/duroid 5870
Rogers CuClad 217, CuClad 233 and CuClad 250 series laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates.The woven fiberglass reinforcement in CuClad products provides greater
TSM-DS3 is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced
F4BTM and F4BTME laminates offer a dielectric constant (DK) ranging from 2.98 to 3.50, selectable based on design needs. Lower DK variants enable wider impedance control and reduced signal delay,
SYNAMIC9GN laminate have a dielectric constant (DK 3.34 @10GHz) and the dissipation factor (Df) of just 0.0014 at 10 GHz, very Low Df values result in minimal signal loss, with
Synamic 6N laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method. Synamic 6N
Shengyi Synamic6GX laminate have a glass transition temperature of 172 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance.The dielectric constant of Synamic6GX is 3.73,
Shengyi Synamic8G laminate have a glass transition temperature of 200 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance. The dielectric constant of Synamic8G is
Synamic 6 laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method.Synamic 6 laminate
Shengyi S7045GH laminate demonstrates a Tg value of 180°C as measured by the DSC method, and a glass transition temperature (Tg) of 190°C determined via the DMA method.It has a
The IT-968G laminate is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. With a lower Dk (Dielectric Constant) of 3.59 @
Isola IS680 laminates are designed with a glass transition temperature (Tg 200°C), providing excellent thermal stability under extreme conditions. With a dielectric constant (DK 2.80-3.45 @ 10GHz) and With a
NPG-186 laminate have a glass transition temperature (Tg) of 210°C (DMA),making it ideal for high thermal reliability environments. Key electrical properties such as a low dielectric constant (DK 3.66 @10GHz)
Shengyi S7439G Laminate exhibits a Dielectric Constant (Dk) of 3.86 and a Dissipation Factor (Df) of 0.0070 at 10 GHz. Shengyi S7439G laminate features a high Glass Transition Temperature (Tg)
With a DK range available from 2.17 to 3.0, these laminates can be fine-tuned to meet specific performance requirements. Both F4BM and F4BME exhibit excellent low loss characteristics, ensuring minimal
TC600 is a woven fiberglass reinforced, ceramic-filled PTFE composite for printed circuit boards. It offers high thermal conductivity, reducing dielectric and insertion losses, and improving amplifier and antenna performance. Its
CLTE-AT laminates use the common building blocks developed with CLTE-XT™ laminates, but with some changes to make the product more affordable. CLTE-AT laminates have “Best-in-Class” Insertion Loss (S21) and Loss
TMM® materials offer dielectric constants (Dk) spanning from 3.27 to 12.85 at 10G, Ideal for single material systems on a wide variety of applications.TMM® thermoset microwave materials, which are ceramic
ThunderClad 400G (TU-885 Sp) is a super low-loss material formulated from a high-performance resin system. This material is reinforced with low-Dk woven glass fabric and specifically engineered to possess an
