pcb material

high speed laminate

Panasonic MEGTRON6 R-5775 laminate is a High speed and low loss material,and the glass transition temperature of MEGTRON6 R-5775 laminate is 185 degrees Celsius. Therefore, Panasonic MEGTRON6 R-5775 laminate is
ROGERS 4003C and ROGERS 4350B have excellent low dielectric loss characteristics. As a result, they provide a more cost-effective and processable high-frequency material selection than PTFE materials.
TU-863+ (ThunderClad 1+) is high Tg halogen free low loss pcb material which is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant
RO4835™ laminate has excellent thermo-mechanical properties,and electrical characteristics that antenna designers need. The laminates have a dielectric constant (Dk) of 3.48 and a loss tangent (Df) of 0.0037 measured at
EM-891K is high Tg ultra low loss pcb material which is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation
The VT-464G laminate features a very low Dk value, minimizing signal delay and crosstalk, which is critical for high speed data transmission. With a high Tg exceeding 170°C, VT-464G maintains
ThunderClad 4R (TU-943R) laminate features a dielectric constant (Dk) of 3.22 at 10GHz, ensuring consistent signal performance across a wide range of frequencies. With a dissipation factor (Df) of 0.0015
VT-462S features that have a high Tg exceeding 170°C, ensuring excellent dimensional stability and mechanical strength under elevated temperatures.With a very low Dk value, VT-462S minimizes signal delay and crosstalk,
ThunderClad 200G (TU-885) is a low-loss material based on modified FR-4 resin.This material offers a dielectric constant (Dk) of 3.45 at 10GHz, a dissipation factor (Df) of 0.0032 at 10GHz.
PegaClad 1 (TU-1300E) is an advanced material specifically engineered for high-frequency, ultra-low-loss applications. The material offers a dielectric constant of 3.44 at 10GHz, which is stable and consistent over a
ThunderClad 2 Sp (TU-883 Sp) is a low-loss material based on a high-performance resin system. This material offers a dielectric constant (Dk) of 3.15 at 10GHz, a dissipation factor (Df)
RT/duroid® 6002 microwave material is the first low-loss, low dielectric constant laminate that material boasts a Dielectric Constant (Dk) of 2.94 ±0.04 at 10GHz, with a low loss tangent of
RO4360G2™ laminates, characterized by a dielectric constant (Dk) of 6.15, exhibit low loss and are reinforced with glass fibers. Alongside a Dissipation Factor (Df) of just 0.0038 at 10 GHz,
RT duroid 6202PR is a high frequency circuit material with low loss and a low dielectric constant. It exhibits exceptional thermal conductivity, with a Dk value of 2.90, nearly double
Rogers RO3010 laminates are ceramic-filled PTFE composite suitable for applications up to 77 GHz. It exhibits a dielectric constant of 11.20 at room temperature, which remains stable up to 40
IM Series™ high-frequency laminates represent an exceptional Passive Intermodulation (PIM) performance enhancement of our AD300D™, AD255C™ and DiClad® 880 antenna-grade laminates. This combination of ultra-low roughness IM foil with the
MAGTREX™ 555 laminate is a low-loss material with controlled permeability and permittivity, using a ceramic filler and thermoplastic matrix. It offers mechanical and electrical stability, compatibility with standard PCB processing,
The IsoClad 917 and IsoClad 933 series boast a low dielectric constant (Dk ≈ 2.2–2.33 at 10 GHz), minimizing signal propagation delays and phase distortions. With an ultra-low dissipation factor
TSM-DS3 is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced
With a stable dielectric constant (Dk) of 3.5, TLF-35A minimizes passive intermodulation distortion (PIMD), ensuring superior signal integrity in high-frequency environments.
TLC-32 laminate offer a stable and consistent Dk (3.20 ±0.05), ensuring predictable signal integrity across a wide frequency range. With an ultra-low Df (<0.003 at 10 GHz), these laminates reduce
The WL-CT series(WL-CT300、WL-CT330、WL-CT330Z、WL-CT338、WL-CT350、WL-CT440、WL-CT615) of organic polymer ceramic fiberglass cloth copper-clad laminates is a high frequency material based on a thermosetting resin system.
TP material stands out as a distinctive high-frequency thermoplastic in the industry. The dielectric layer of the TP laminate is uniquely composed of a blend of ceramic and polyphenylene oxide
TLX Series materials offer unparalleled reliability across a broad spectrum of RF applications. This versatility stems from its dielectric constant (DK) range of 2.45 to 2.65, along with a variety

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