F4BTM and F4BTME laminates offer a dielectric constant (DK) ranging from 2.98 to 3.50, selectable based on design needs. Lower DK variants enable wider impedance control and reduced signal delay,
Shengyi AEROWAVE 300 laminate is a high-performance, low-loss PCB material specifically engineered for advanced RF and microwave applications. With a dielectric constant (3.0 @10GHz), AeroWave 300 laminate maintains excellent dielectric
Shengyi SCGA-500 GF220 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.20(±0.02) at 10GHz, the laminate maintains outstanding dielectric stability
Shengyi SCGA-500 GF255 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.55(±0.04) at 10GHz, the laminate maintains outstanding dielectric stability
Shengyi SCGA-500 GF265 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.65(±0.04) at 10GHz, the laminate maintains outstanding dielectric stability
Shengyi SCGA-500 GF300 laminate is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 3.00(±0.04) at 10GHz, the laminate maintains outstanding dielectric
The IT-8615G material has a Dielectric Constant (Dk) of 6.15, which is precisely tailored for specific RF applications. With a dissipation factor (0.0038 @ 10 GHz) translates to reduced dielectric
Rogers CLTE-XT PTFE laminate have a dielectric constant (Dk) of 2.94 at 10 GHz at the same frequency, CLTE-XT ensures minimal signal degradation and excellent efficiency. It's ultra-low loss tangent
XtremeSpeed™ RO1200™ extremely low loss digital circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are specifically engineered to provide exceptional electrical performance and mechanical stability for the
The RF-60TC is a PTFE-based, ceramic-filled fiberglass substrate designed for high-power RF and microwave applications.This material is optimized to offer lower operating temperatures in high-power environments, while enhancing gain and
