Isola Astra MT77 is a low-loss material that also has unique physical properties, including a higher temperature range and a wide range of operating frequencies. Isola Astra MT77 PCB material
TU-863+ (ThunderClad 1+) is high Tg halogen free low loss pcb material which is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant
EM-891K is high Tg ultra low loss pcb material which is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation
VT-462S features that have a high Tg exceeding 170°C, ensuring excellent dimensional stability and mechanical strength under elevated temperatures.With a very low Dk value, VT-462S minimizes signal delay and crosstalk,
ThunderClad 200G (TU-885) is a low-loss material based on modified FR-4 resin.This material offers a dielectric constant (Dk) of 3.45 at 10GHz, a dissipation factor (Df) of 0.0032 at 10GHz.
The high speed VT-463H Laminate is specifically engineered to meet the stringent demands of high speed and high frequency applications,With a high Tg of up to 170°C, VT-463H maintains excellent
RO4360G2™ laminates, characterized by a dielectric constant (Dk) of 6.15, exhibit low loss and are reinforced with glass fibers. Alongside a Dissipation Factor (Df) of just 0.0038 at 10 GHz,
RT duroid 6202PR is a high frequency circuit material with low loss and a low dielectric constant. It exhibits exceptional thermal conductivity, with a Dk value of 2.90, nearly double
Rogers RO3010 laminates are ceramic-filled PTFE composite suitable for applications up to 77 GHz. It exhibits a dielectric constant of 11.20 at room temperature, which remains stable up to 40
The IsoClad 917 and IsoClad 933 series boast a low dielectric constant (Dk ≈ 2.2–2.33 at 10 GHz), minimizing signal propagation delays and phase distortions. With an ultra-low dissipation factor
With a stable dielectric constant (Dk) of 3.5, TLF-35A minimizes passive intermodulation distortion (PIMD), ensuring superior signal integrity in high-frequency environments.
Panasonic's R-5515 laminates stand out as a premium choice for high-performance applications. It has a dielectric constant of 3.06 and a dissipation factor of 0.0021, making it ideal for multilayer
SYNAMIC9GN laminate have a dielectric constant (DK 3.34 @10GHz) and the dissipation factor (Df) of just 0.0014 at 10 GHz, very Low Df values result in minimal signal loss, with
The LNB33C laminate is characterized by a high glass transition temperature (Tg) exceeding 280°C.The dielectric constant (Dk) of LNB33C laminate is approximately 3.30 ± 0.05 at 10 GHz (as per
The S7136H laminate is characterized by a high Glass Transition Temperature (Tg) of over 280°C.With a dielectric constant of 3.42 at 10GHz, the S7136H laminate maintains outstanding dielectric stability across
DuPont™ Pyralux® AP double-sided, copper-clad laminate is an all-polyimide composite of polyimide film bonded to copper foil. With a dielectric constant (3.4 @1MHz) and With a dissipation factor (0.003 @1MHz),
Shengyi SF230 Low Loss MPI FCCL (Flexible Copper Clad Laminate) stands out as a high-performance, cost-effective, and sustainable solution that bridges the gap between standard polyimide and premium LCP materials.
With a Glass Transition Temperature (Tg) exceeding 210°C, this laminate exhibits exceptional thermal stability, making it highly resilient to the elevated temperatures encountered during lead-free assembly processes and in demanding
Isola IS680 laminates are designed with a glass transition temperature (Tg 200°C), providing excellent thermal stability under extreme conditions. With a dielectric constant (DK 2.80-3.45 @ 10GHz) and With a
IT-88GMW laminate offers a low dielectric constant (Dk) of less than 3.02 at 10GHz. this low Dk helps in minimizing signal distortion and maintaining signal integrity. It has a low
TLY-3 offers a compelling solution for tackling the challenges of high-frequency applications. With an ultra-low dissipation factor, TLY-3 minimizes signal loss and heat generation, making it ideal for high-power and
TC600 is a woven fiberglass reinforced, ceramic-filled PTFE composite for printed circuit boards. It offers high thermal conductivity, reducing dielectric and insertion losses, and improving amplifier and antenna performance. Its
VT-3703 and VT-3706 high frequency laminates are engineered to meet the stringent demands of modern RF and microwave applications. both low Dk (3.0) and high Dk (6.15) with extremely low
TU-883 is a very low loss category material based on a high performance resin. This material is reinforced with regular woven E-glass and designed with very low dielectric constant and
