RO4835™ laminate has excellent thermo-mechanical properties,and electrical characteristics that antenna designers need. The laminates have a dielectric constant (Dk) of 3.48 and a loss tangent (Df) of 0.0037 measured at
TSM-DS3 is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced
With a stable dielectric constant (Dk) of 3.5, TLF-35A minimizes passive intermodulation distortion (PIMD), ensuring superior signal integrity in high-frequency environments.
TLC-32 laminate offer a stable and consistent Dk (3.20 ±0.05), ensuring predictable signal integrity across a wide frequency range. With an ultra-low Df (<0.003 at 10 GHz), these laminates reduce
TLX Series materials offer unparalleled reliability across a broad spectrum of RF applications. This versatility stems from its dielectric constant (DK) range of 2.45 to 2.65, along with a variety
The dielectric constant of this TFA series is 2.94, 3.0, 6.15, 10.2. With the same level of dielectric constant excellent electrical properties, thermal properties, mechanical properties, is aerospace grade high
F4BTM and F4BTME laminates offer a dielectric constant (DK) ranging from 2.98 to 3.50, selectable based on design needs. Lower DK variants enable wider impedance control and reduced signal delay,
EZ-IO-F is a thermally stable composite that leverages nanotechnology, spread weave fabric, and PTFE to deliver superior performance. Designed to challenge even the best FR4 materials in complex, multi-layered digital
Shengyi SCGA-500 GF220 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.20(±0.02) at 10GHz, the laminate maintains outstanding dielectric stability
SYNAMIC9GN laminate have a dielectric constant (DK 3.34 @10GHz) and the dissipation factor (Df) of just 0.0014 at 10 GHz, very Low Df values result in minimal signal loss, with
Shengyi SCGA-500 GF255 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.55(±0.04) at 10GHz, the laminate maintains outstanding dielectric stability
Shengyi SCGA-500 GF265 is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 2.65(±0.04) at 10GHz, the laminate maintains outstanding dielectric stability
Shengyi SCGA-500 GF300 laminate is a low-loss PTFE woven glass PCB material, specifically engineered for high-frequency applications. With a dielectric constant of 3.00(±0.04) at 10GHz, the laminate maintains outstanding dielectric
Shengyi SG7350D2 laminate have a low dielectric constant of 3.55 at 10 GHz, maintains outstanding dielectric stability across various frequency and temperature ranges. Shengyi SG7350D2 laminate is a high-performance laminate
Shengyi mmWave77 laminate maintains exceptional dielectric stability over high frequency and temperature, with a low Dk of 3.07 at 10GHz, and the material has a very low dissipation factor (typically
The LNB33 laminate is characterized by a high glass transition temperature (Tg) exceeding 280°C. The dielectric constant (Dk) of LNB33 laminate is approximately 3.30±0.05 at 10 GHz (as per IPC-TM-650
TLY-5A laminates use ultra-lightweight woven fiberglass, offering superior dimensional stability. The material's woven structure enhances mechanical stability for high-volume manufacturing. Its low dissipation factor enables efficient performance in 77 GHz
F4BTMS series（F4BTMS220、F4BTMS233、F4BTMS255、F4BTMS265、F4BTMS294、F4BTMS300、F4BTMS350、F4BTMS430、F4BTMS450、F4BTMS615、F4BTMS1000） is the upgraded version of the F4BTM series. Significant technical advancements have been achieved in material formulation and production processes
TLE-95 laminate represents a significant advancement in materials used for high-frequency and high-performance electronics.TLE-95 is typically offered with a 2.95 DK ± 0.05.Its low CTE, controlled dimensional stability, and exceptional
With a DK range available from 2.17 to 3.0, these laminates can be fine-tuned to meet specific performance requirements. Both F4BM and F4BME exhibit excellent low loss characteristics, ensuring minimal
RT-duroid 6035HTC high-frequency circuit materials are advanced ceramic-filled PTFE composites specifically engineered for use in high-power RF and microwave applications. With a dielectric constant (Dk) of 3.5 at 10 GHz,
XtremeSpeed™ RO1200™ extremely low loss digital circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are specifically engineered to provide exceptional electrical performance and mechanical stability for the
TC350™ Plus laminates are ceramic-filled PTFE-based woven glass reinforced composite materials that offer a cost-effective, high performance, thermally enhanced solution for circuit designers.The low loss tangent of 0.0017 at 10
TMM® materials offer dielectric constants (Dk) spanning from 3.27 to 12.85 at 10G, Ideal for single material systems on a wide variety of applications.TMM® thermoset microwave materials, which are ceramic
