pcb material

high frequency laminate

EM-891K is high Tg ultra low loss pcb material which is made of high performance epoxy resin and regular woven E-glass fabric, designed with low dielectric constant and low dissipation
VT-6710 high frequency laminate combines ceramic-filled PTFE composites with a higher dielectric constant (Dk) of 10.7, a low dissipation factor (Df) of 0.0022, It is specifically engineered to excel in
VT-6880 excels in high frequency applications, the laminate has a very low dielectric constant (DK 2.2), providing stable performance across a broad frequency range, including microwave and millimeter-wave frequencies.
The high speed VT-463H Laminate is specifically engineered to meet the stringent demands of high speed and high frequency applications,With a high Tg of up to 170°C, VT-463H maintains excellent
PegaClad 1 (TU-1300E) is an advanced material specifically engineered for high-frequency, ultra-low-loss applications. The material offers a dielectric constant of 3.44 at 10GHz, which is stable and consistent over a
RO4360G2™ laminates, characterized by a dielectric constant (Dk) of 6.15, exhibit low loss and are reinforced with glass fibers. Alongside a Dissipation Factor (Df) of just 0.0038 at 10 GHz,
RT duroid 6202PR is a high frequency circuit material with low loss and a low dielectric constant. It exhibits exceptional thermal conductivity, with a Dk value of 2.90, nearly double
Rogers RO3010 laminates are ceramic-filled PTFE composite suitable for applications up to 77 GHz. It exhibits a dielectric constant of 11.20 at room temperature, which remains stable up to 40
Rogers CuClad 217, CuClad 233 and CuClad 250 series laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates.The woven fiberglass reinforcement in CuClad products provides greater
The IsoClad 917 and IsoClad 933 series boast a low dielectric constant (Dk ≈ 2.2–2.33 at 10 GHz), minimizing signal propagation delays and phase distortions. With an ultra-low dissipation factor
Panasonic's R-5515 laminates stand out as a premium choice for high-performance applications. It has a dielectric constant of 3.06 and a dissipation factor of 0.0021, making it ideal for multilayer
SYNAMIC9GN laminate have a dielectric constant (DK 3.34 @10GHz) and the dissipation factor (Df) of just 0.0014 at 10 GHz, very Low Df values result in minimal signal loss, with
Shengyi mmWave77 laminate maintains exceptional dielectric stability over high frequency and temperature, with a low Dk of 3.07 at 10GHz, and the material has a very low dissipation factor (typically
The LNB33C laminate is characterized by a high glass transition temperature (Tg) exceeding 280°C.The dielectric constant (Dk) of LNB33C laminate is approximately 3.30 ± 0.05 at 10 GHz (as per
The S7136H laminate is characterized by a high Glass Transition Temperature (Tg) of over 280°C.With a dielectric constant of 3.42 at 10GHz, the S7136H laminate maintains outstanding dielectric stability across
The IT-8615G material has a Dielectric Constant (Dk) of 6.15, which is precisely tailored for specific RF applications. With a dissipation factor (0.0038 @ 10 GHz) translates to reduced dielectric
DuPont™ Pyralux® AP double-sided, copper-clad laminate is an all-polyimide composite of polyimide film bonded to copper foil. With a dielectric constant (3.4 @1MHz) and With a dissipation factor (0.003 @1MHz),
Shengyi SF230 Low Loss MPI FCCL (Flexible Copper Clad Laminate) stands out as a high-performance, cost-effective, and sustainable solution that bridges the gap between standard polyimide and premium LCP materials.
N9000-13 RF is a PTFE Performance Blended product which combines the RF electrical properties of PTFE with the competitive performance features of AGC’s proprietary N4000-13 epoxy. including a stable Dielectric
With a Glass Transition Temperature (Tg) exceeding 210°C, this laminate exhibits exceptional thermal stability, making it highly resilient to the elevated temperatures encountered during lead-free assembly processes and in demanding
With a Glass Transition Temperature (Tg) exceeding 210°C, the laminate offers exceptional thermal stability, making it resilient against the high temperatures encountered during lead-free assembly processes and in demanding operational
Isola IS680 laminates are designed with a glass transition temperature (Tg 200°C), providing excellent thermal stability under extreme conditions. With a dielectric constant (DK 2.80-3.45 @ 10GHz) and With a
IT-8350G is an advanced Ultra-Low Loss (ULL) & High Tg (185°C by TMA) material specifically engineered to meet the stringent requirements of demanding Radio Frequency (RF) applications.The Dielectric Constant (Dk)
RO4725JXR™ and RO4730G3™ laminates possess the mechanical and electrical properties essential for antenna design. These materials exhibit a dielectric constant (Dk) of 2.55 and 3.0, respectively, and a loss tangent

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