Shengyi S1600 pcb material has a high CTI value of 600V, which measures the material's resistance to electric breakdown caused by surface contamination.The glass transition temperature (Tg) of Shengyi S1600,
VT-481 is based on a mid-glass transition temperature (Tg) FR4.0 resin system, that TG is 150°C and providing a balanced thermal performance.VT-481 exhibits excellent resistance to conductive anodic filament (CAF)
ThunderClad 2 Sp (TU-883 Sp) is a low-loss material based on a high-performance resin system. This material offers a dielectric constant (Dk) of 3.15 at 10GHz, a dissipation factor (Df)
The high Tg of 180 °C (DSC) TU-752 PCB material which is known for its elevated glass transition temperature (Tg). TU-752/ TU-75P laminate / prepreg are made of high quality
Synamic 6 laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method.Synamic 6 laminate
The Shengyi ST110G laminate is fully halogen-free and exhibits a glass transition temperature (Tg) of 175 °C under Dynamic Mechanical Analysis (DMA). One of the standout features of ST110G laminate
The IT-170GRA2TC is a high Tg (175° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. IT-170GRA2TC cooperation produces
The NP-175FM provides a minimum Tg of 170°C, making it fully lead-free compatible and suitable for advanced soldering profiles. The NP-175FM offers a well-balanced dielectric constant (DK 4.2 @1GHz) and
Nelco N8000 Cyanate Esteer Epoxy Laminate and Prepreg are cyanate ester laminates with high-Tg that provide outstanding thermal and mechanical properties.The material boasts an exceptionally high Glass Transition Temperature (Tg)
The IS550H laminate features a glass transition temperature (Tg 200°C), providing excellent thermal stability and dimensional integrity under elevated temperatures. With a dielectric constant (DK 4.43 @10GHz) and a dissipation
Isola IS580G halogen-free laminates are designed with a high glass transition temperature (Tg 205°C), offers a stable dielectric constant (Dk 3.80 @10GHz) and a low dissipation factor (Df 0.006 @10GHz),
The KB-6169GT offers a glass transition temperature (Tg) over 190°C,and KB-6169GT exhibits a stable Dielectric Constant (Dk 4.6 @1GHz) and a low Dissipation Factor (Df 0.011 @1GHz), contributing to low
NY2170 is engineered with a glass transition temperature (Tg) of 170°C, providing robust thermal performance under lead-free assembly processes.The dielectric constant (DK）is 4.5 @ 1 GHz and dissipation factor (DF）is
NPG-170D is designed with a glass transition temperature (Tg) of 170℃ (DSC), delivering superior thermal stability during both assembly and end-use. Its dielectric constant (DK 4.0 @1GHz) and dissipation factor
Shengyi S1150G features a glass transition temperature of 155 degree Celsius. With a dielectric constant (4.5 @1GHz), the Dielectric Constant (Dk) of Shengyi S1150G material is a measure of its
Panasonic R-1786 PCB material offers a Tg value of 140 degrees Celsius, the glass transition temperature describes how a PCB material transforms from a solid state to a molten state.
The high Tg of 185°C (DSC) IT-170GT PCB material which is known for its elevated glass transition temperature (Tg). IT-170GT cooperation produces laminates with dielectric constant as low as 3.9
IT-8350G is an advanced Ultra-Low Loss (ULL) & High Tg (185°C by TMA) material specifically engineered to meet the stringent requirements of demanding Radio Frequency (RF) applications.The Dielectric Constant (Dk)
Panasonic R-3566D is a high CTI and high RTI material, it has an excellent tracking resistance and excellent heat resistance. R-3566D has a glass transition temperature (Tg) of 170 degrees
IT-158 is classified as a middle Tg prepreg with a glass transition temperature of 155°C. With a dielectric constant (around 4.3 @ 1 GHz), the Dielectric Constant (Dk) of the
The Shengyi S1000-2M PCB material is a high-performance FR-4 epoxy laminate & prepreg systems designed for advanced circuitry applications. And the S1000-2M pcb material also brings the board reliability with
The High Tg of 180 °C (DSC) TU-768 PCB material which is known for its elevated glass transition temperature (Tg). It is classified as high thermal reliability due to its
