The high glass transition temperature (Tg) of VT-447C, typically above 170°C, provides exceptional thermal stability.VT-447C is formulated as a halogen-free material, offering significant environmental and safety advantages over traditional brominated
The DS-7409HG(IQ) laminate demonstrates a dielectric constant of 4.3 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The Shengyi SI13U laminate demonstrates a dielectric constant of 4.8 at 1 GHz. A dissipation factor of 0.013 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during
One of its standout features is its exceptionally high glass transition temperature (Tg) of 280°C, which ensures outstanding dimensional stability and minimal warpage under elevated temperatures. The Shengyi SI10US laminate
The IT-170GRA2TC is a high Tg (175° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. IT-170GRA2TC cooperation produces
Shengyi S7040G laminate demonstrates a Tg value of 175°C as measured by the DSC method, and a glass transition temperature (Tg) of 185°C determined via the DMA method.Shengyi S7040G laminate
The NP-175FM provides a minimum Tg of 170°C, making it fully lead-free compatible and suitable for advanced soldering profiles. The NP-175FM offers a well-balanced dielectric constant (DK 4.2 @1GHz) and
ThinFlex-W22, W-0505RD-H1 represents a significant advancement in flexible printed circuit (FPC) materials technology. It is an adhesiveless double-sided (D/S) copper clad laminate, engineered to meet the demanding requirements of modern
Nelco N8000 Cyanate Esteer Epoxy Laminate and Prepreg are cyanate ester laminates with high-Tg that provide outstanding thermal and mechanical properties.The material boasts an exceptionally high Glass Transition Temperature (Tg)
N4000-29 is an advanced, lead-free, low-CTE, high Tg (185°C by DSC) multifunctional epoxy PCB material with a high Tg, excellent thermal stability and good moisture resistance. Its dielectric constant (DK
The I-Speed® provides a minimum Tg of 180°C, ensuring superior dimensional and mechanical stability under high thermal loads, making it ideal for use in lead-free soldering and high-temperature reflow processes.With
KB-6168LE is a high Tg laminate designed for applications requiring elevated thermal resistance and electrical stability. With a lead-free DSC Tg of 190°C, the laminate offers excellent thermal endurance under
The material exhibits a low dielectric constant (Dk 4.6 @1GHz) and low dissipation factor (Df 0.016 @1GHz), which are essential for maintaining signal integrity and low power loss in both
NPG-186 laminate have a glass transition temperature (Tg) of 210°C (DMA),making it ideal for high thermal reliability environments. Key electrical properties such as a low dielectric constant (DK 3.66 @10GHz)
NY2150 features a glass transition temperature (Tg) of ≥150°C, making it fully compatible with lead-free soldering processes. The dielectric constant (DK) is 4.7 @1MHz and dissipation factor (DF) is 0.013
Shengyi S7439G Laminate exhibits a Dielectric Constant (Dk) of 3.86 and a Dissipation Factor (Df) of 0.0070 at 10 GHz. Shengyi S7439G laminate features a high Glass Transition Temperature (Tg)
The high Tg of 185°C (DSC) IT-170GT PCB material which is known for its elevated glass transition temperature (Tg). IT-170GT cooperation produces laminates with dielectric constant as low as 3.9
The R-1755D boasts a high Tg value of ≥154°C, ensuring dimensional stability and mechanical integrity even under elevated temperatures. Panasonic R-1755D has a low Df of 0.016 at 1 GHz,
