Medical Devices PCB: From wearable health monitors to implantable devices, HDI PCBs are playing a key role in the development of advanced medical electronics. These devices need to be compact,
The DS-7409HG laminate demonstrates a dielectric constant of 4.6 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The DS-7402HD laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
ThinFlex-W22, W-2010ED-N4 is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with ED copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
ThinFlex-W22, W-2005RD-C is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with RA copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
Nelco N8000 Cyanate Esteer Epoxy Laminate and Prepreg are cyanate ester laminates with high-Tg that provide outstanding thermal and mechanical properties.The material boasts an exceptionally high Glass Transition Temperature (Tg)
The N5000 laminate exhibits a glass transition temperature (Tg) of 185°C by DSC. It incorporates BT (bismaleimide triazine) resin, which offers low dielectric constant (Dk 3.6 @ 10GHz) and dissipation
The IS550H laminate features a glass transition temperature (Tg 200°C), providing excellent thermal stability and dimensional integrity under elevated temperatures. With a dielectric constant (DK 4.43 @10GHz) and a dissipation
N4000-29 is an advanced, lead-free, low-CTE, high Tg (185°C by DSC) multifunctional epoxy PCB material with a high Tg, excellent thermal stability and good moisture resistance. Its dielectric constant (DK
Isola IS580G halogen-free laminates are designed with a high glass transition temperature (Tg 205°C), offers a stable dielectric constant (Dk 3.80 @10GHz) and a low dissipation factor (Df 0.006 @10GHz),
NY2170 is engineered with a glass transition temperature (Tg) of 170°C, providing robust thermal performance under lead-free assembly processes.The dielectric constant (DK）is 4.5 @ 1 GHz and dissipation factor (DF）is
NPG-186 laminate have a glass transition temperature (Tg) of 210°C (DMA),making it ideal for high thermal reliability environments. Key electrical properties such as a low dielectric constant (DK 3.66 @10GHz)
The DS-7409HG(KN) laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The Tg of R-A555(W) is approximately 200°C, which ensures the laminate maintains its structural integrity under higher thermal conditions. R-A555(W) features a dielectric constant of around 3.4 at 1 GHz,
