Medical Devices PCB: From wearable health monitors to implantable devices, HDI PCBs are playing a key role in the development of advanced medical electronics. These devices need to be compact,
The DS-7409HG laminate demonstrates a dielectric constant of 4.6 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The DS-7402HD laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
IT-958GTC laminate is a halogen free, High Tg (175° C by DSC), advanced multifunctional epoxy and low loss material. IT-958GTC laminate offers a low dielectric constant (Dk) of 3.7 at
ThinFlex-W22, W-0505RD-H1 represents a significant advancement in flexible printed circuit (FPC) materials technology. It is an adhesiveless double-sided (D/S) copper clad laminate, engineered to meet the demanding requirements of modern
ThinFlex-W22, W-2005RD-C is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with RA copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
Nelco N8000 Cyanate Esteer Epoxy Laminate and Prepreg are cyanate ester laminates with high-Tg that provide outstanding thermal and mechanical properties.The material boasts an exceptionally high Glass Transition Temperature (Tg)
The IS550H laminate features a glass transition temperature (Tg 200°C), providing excellent thermal stability and dimensional integrity under elevated temperatures. With a dielectric constant (DK 4.43 @10GHz) and a dissipation
Isola IS580G halogen-free laminates are designed with a high glass transition temperature (Tg 205°C), offers a stable dielectric constant (Dk 3.80 @10GHz) and a low dissipation factor (Df 0.006 @10GHz),
The I-Speed® provides a minimum Tg of 180°C, ensuring superior dimensional and mechanical stability under high thermal loads, making it ideal for use in lead-free soldering and high-temperature reflow processes.With
KB-6168LE is a high Tg laminate designed for applications requiring elevated thermal resistance and electrical stability. With a lead-free DSC Tg of 190°C, the laminate offers excellent thermal endurance under
NY2170 is engineered with a glass transition temperature (Tg) of 170°C, providing robust thermal performance under lead-free assembly processes.The dielectric constant (DK）is 4.5 @ 1 GHz and dissipation factor (DF）is
NPG-170D is designed with a glass transition temperature (Tg) of 170℃ (DSC), delivering superior thermal stability during both assembly and end-use. Its dielectric constant (DK 4.0 @1GHz) and dissipation factor
The DS-7409HG(KN) laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
