Shengyi S1600 pcb material has a high CTI value of 600V, which measures the material's resistance to electric breakdown caused by surface contamination.The glass transition temperature (Tg) of Shengyi S1600,
TU-901 Tg260 material is made of high performance robust resin system and E-glass fabric. With a glass transition temperature (Tg) of 260°C, TU-901 Tg260 can withstand extreme temperatures without degrading
VT-462S features that have a high Tg exceeding 170°C, ensuring excellent dimensional stability and mechanical strength under elevated temperatures.With a very low Dk value, VT-462S minimizes signal delay and crosstalk,
The DS-7409HG laminate demonstrates a dielectric constant of 4.6 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The Shengyi S1190 laminate exhibits a glass transition temperature (Tg) of 170 °C under Thermomechanical Analysis (TMA) conditions, while its Tg under Dynamic Mechanical Analysis (DMA) conditions is 200 °C.The
The IT-968G laminate is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. With a lower Dk (Dielectric Constant) of 3.59 @
ThinFlex-W22, W-2010ED-N4 is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with ED copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
ThinFlex-W22, W-2005RD-C is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with RA copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
Nelco N8000 Cyanate Esteer Epoxy Laminate and Prepreg are cyanate ester laminates with high-Tg that provide outstanding thermal and mechanical properties.The material boasts an exceptionally high Glass Transition Temperature (Tg)
The N5000 laminate exhibits a glass transition temperature (Tg) of 185°C by DSC. It incorporates BT (bismaleimide triazine) resin, which offers low dielectric constant (Dk 3.6 @ 10GHz) and dissipation
The IS550H laminate features a glass transition temperature (Tg 200°C), providing excellent thermal stability and dimensional integrity under elevated temperatures. With a dielectric constant (DK 4.43 @10GHz) and a dissipation
N4000-29 is an advanced, lead-free, low-CTE, high Tg (185°C by DSC) multifunctional epoxy PCB material with a high Tg, excellent thermal stability and good moisture resistance. Its dielectric constant (DK
Isola IS580G halogen-free laminates are designed with a high glass transition temperature (Tg 205°C), offers a stable dielectric constant (Dk 3.80 @10GHz) and a low dissipation factor (Df 0.006 @10GHz),
The I-Speed® provides a minimum Tg of 180°C, ensuring superior dimensional and mechanical stability under high thermal loads, making it ideal for use in lead-free soldering and high-temperature reflow processes.With
The Mid-Range Glass Transition Temperature (Tg) exceeding 150°C is a cornerstone feature.With a dielectric constant (DK 4.6 @ 1 GHz), the dielectric constant of the material is a measure of
NY2170 is engineered with a glass transition temperature (Tg) of 170°C, providing robust thermal performance under lead-free assembly processes.The dielectric constant (DK）is 4.5 @ 1 GHz and dissipation factor (DF）is
With a DSC Tg over 150°C, it supports mid-temperature applications and is fully compatible with lead-free soldering processes. KB-6165G exhibits a stable dielectric constant (Dk 4.6 @1GHz) and low dissipation
NPG-186 laminate have a glass transition temperature (Tg) of 210°C (DMA),making it ideal for high thermal reliability environments. Key electrical properties such as a low dielectric constant (DK 3.66 @10GHz)
The DS-7409HG(KN) laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
Panasonic R-1785 PCB material offers a Tg value of 150 degrees Celsius, the glass transition temperature describes how a PCB material transforms from a solid state to a molten state.
