The DS-7409HG laminate demonstrates a dielectric constant of 4.6 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The DS-7409HG(IQ) laminate demonstrates a dielectric constant of 4.3 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The NP-175FM provides a minimum Tg of 170°C, making it fully lead-free compatible and suitable for advanced soldering profiles. The NP-175FM offers a well-balanced dielectric constant (DK 4.2 @1GHz) and
ThinFlex-W22, W-2010ED-N4 is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with ED copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
KB-6168LE is a high Tg laminate designed for applications requiring elevated thermal resistance and electrical stability. With a lead-free DSC Tg of 190°C, the laminate offers excellent thermal endurance under
The Mid-Range Glass Transition Temperature (Tg) exceeding 150°C is a cornerstone feature.With a dielectric constant (DK 4.6 @ 1 GHz), the dielectric constant of the material is a measure of
With a DSC Tg over 150°C, it supports mid-temperature applications and is fully compatible with lead-free soldering processes. KB-6165G exhibits a stable dielectric constant (Dk 4.6 @1GHz) and low dissipation
The DS-7409HG(KN) laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
Isola 370HR is a high Tg PCB laminate, This laminate comprises the Fr-4 epoxy resin system. This laminate comprises multifunctional epoxy resin with E-glass fabric reinforcement.
