ThinFlex-W22, W-1005RD-C represents a significant advancement in flexible printed circuit (FPC) materials technology. It is an adhesiveless double-sided (D/S) copper clad laminate, engineered to meet the demanding requirements of modern
ThinFlex-W22, W-2005RD-C is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with RA copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
Panasonic R-F775 flexible laminate is a high-performance, halogen-free flexible laminate designed to meet the rigorous demands of modern electronics. With a dielectric constant (3.2 @1MHz) and With a dissipation factor
This SF305 laminate exhibits low dielectric constant (Dk 3.31 @10GHz) and low dissipation factor (Df 0.0188 @10GHz), resulting in minimal signal loss and stable electrical performance across a wide frequency
Shengyi SF230 Low Loss MPI FCCL (Flexible Copper Clad Laminate) stands out as a high-performance, cost-effective, and sustainable solution that bridges the gap between standard polyimide and premium LCP materials.
The SF202 Double Side Adhesiveless FCCL is renowned for its exceptional properties, which stem from its adhesiveless construction and advanced material composition. With a dielectric constant (3.2 @1GHz), the Dielectric
Transparent polyester CCL is a specialized type of copper-clad laminate where the base substrate is made from polyethylene terephthalate (PET) or similar transparent polymers, coated with a thin layer of
The IS550H laminate features a glass transition temperature (Tg 200°C), providing excellent thermal stability and dimensional integrity under elevated temperatures. With a dielectric constant (DK 4.43 @10GHz) and a dissipation
TerraGreen® 400G2 features a glass transition temperature (Tg) of 200°C, With a dielectric constant (DK 3.10 @ 10GHz) and a dissipation factor (DF 0.0015 @ 10GHz) translates to reduced dielectric
Isola IS580G halogen-free laminates are designed with a high glass transition temperature (Tg 205°C), offers a stable dielectric constant (Dk 3.80 @10GHz) and a low dissipation factor (Df 0.006 @10GHz),
The KB-6169GT offers a glass transition temperature (Tg) over 190°C,and KB-6169GT exhibits a stable Dielectric Constant (Dk 4.6 @1GHz) and a low Dissipation Factor (Df 0.011 @1GHz), contributing to low
With a DSC Tg over 150°C, it supports mid-temperature applications and is fully compatible with lead-free soldering processes. KB-6165G exhibits a stable dielectric constant (Dk 4.6 @1GHz) and low dissipation
NPG-186 laminate have a glass transition temperature (Tg) of 210°C (DMA),making it ideal for high thermal reliability environments. Key electrical properties such as a low dielectric constant (DK 3.66 @10GHz)
The DS-7409HG(KN) laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
Shengyi S1150G features a glass transition temperature of 155 degree Celsius. With a dielectric constant (4.5 @1GHz), the Dielectric Constant (Dk) of Shengyi S1150G material is a measure of its
With a Tg exceeding 185°C, these laminates maintain structural integrity and electrical stability even under high thermal stress, making them ideal for high-temperature environments. Panasonic MEGTRON M R-5735 laminate is
Shengyi S7439G Laminate exhibits a Dielectric Constant (Dk) of 3.86 and a Dissipation Factor (Df) of 0.0070 at 10 GHz. Shengyi S7439G laminate features a high Glass Transition Temperature (Tg)
IT-8350G is an advanced Ultra-Low Loss (ULL) & High Tg (185°C by TMA) material specifically engineered to meet the stringent requirements of demanding Radio Frequency (RF) applications.The Dielectric Constant (Dk)
Panasonic R-3566D is a high CTI and high RTI material, it has an excellent tracking resistance and excellent heat resistance. R-3566D has a glass transition temperature (Tg) of 170 degrees
The Tg of R-A555(W) is approximately 200°C, which ensures the laminate maintains its structural integrity under higher thermal conditions. R-A555(W) features a dielectric constant of around 3.4 at 1 GHz,
VT-770 and VT-770(LK) are advanced high frequency laminates specifically designed for applications that demand excellent electrical performance, high thermal stability, and reliability. With a high Tg of 260°C, these laminates
