The Shengyi ST115G pcb material has a high temperature for glass transition at Tg175, this is Halogen-Free and High Thermal Conductivity CCL,this material for printed circuit boards having great insulation
TU-900 Tg260 material is made of BT-like high performance resin system and E-glass fabric. its ultra-high glass transition temperature (Tg) of 260°C, this halogen-free material is engineered to possess both
Panasonic's R-5515 laminates stand out as a premium choice for high-performance applications. It has a dielectric constant of 3.06 and a dissipation factor of 0.0021, making it ideal for multilayer
The Panasonic R-1566(W) is a highly efficient laminate used for bonding several layers of multilayer boards. Panasonic R-1566(W) features a glass transition temperature of 148 degree Celsius. it is advisable
SYNAMIC9GN laminate have a dielectric constant (DK 3.34 @10GHz) and the dissipation factor (Df) of just 0.0014 at 10 GHz, very Low Df values result in minimal signal loss, with
This is a halogen-free build-up material for printed wiring boards. MGC's halogen-free material achieves the UL94 V-0 flame retardancy level not only without using brominated flame retardants or antimony compounds
The DS-7409HG laminate demonstrates a dielectric constant of 4.6 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The DS-7409HG(IQ) laminate demonstrates a dielectric constant of 4.3 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
The DS-7402HD laminate demonstrates a dielectric constant of 3.5 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor
Shengyi Synamic6GX laminate have a glass transition temperature of 172 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance.The dielectric constant of Synamic6GX is 3.73,
Shengyi Synamic8G laminate have a glass transition temperature of 200 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance. The dielectric constant of Synamic8G is
Shengyi S1151G features a glass transition temperature of 155 degree Celsius.With a dielectric constant (4.6 @1GHz), the Dielectric Constant (Dk) of Shengyi S1151G material is a measure of its ability
The Shengyi ST110G laminate is fully halogen-free and exhibits a glass transition temperature (Tg) of 175 °C under Dynamic Mechanical Analysis (DMA). One of the standout features of ST110G laminate
The IT-170GRA2TC is a high Tg (175° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. IT-170GRA2TC cooperation produces
IT-998GSETC laminates are specifically engineered to meet these demands. With an ultra-low dielectric constant (Dk < 3.21 @ 10 GHz) and ultra-low dissipation factor (Df < 0.0014 @ 10 GHz),
Shengyi S7045GH laminate demonstrates a Tg value of 180°C as measured by the DSC method, and a glass transition temperature (Tg) of 190°C determined via the DMA method.It has a
The IT-988GLSETC is an advanced low CTE, high Tg (Glass Transition Temperature, reaching 180° C as measured by TMA) and ultra low loss material. It has a relatively lower value,
Shengyi S1170G material features a high glass transition temperature (Tg > 170°C), signifying its capacity to endure elevated temperatures without substantial degradation of mechanical or electrical properties.With a dielectric constant
The IT-968G laminate is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. With a lower Dk (Dielectric Constant) of 3.59 @
Shengyi S7040G laminate demonstrates a Tg value of 175°C as measured by the DSC method, and a glass transition temperature (Tg) of 185°C determined via the DMA method.Shengyi S7040G laminate
IT-958GTC laminate is a halogen free, High Tg (175° C by DSC), advanced multifunctional epoxy and low loss material. IT-958GTC laminate offers a low dielectric constant (Dk) of 3.7 at
This DuPont™ Pyralux® HT laminate exhibits low dielectric constant (Dk 3.4 @1MHz) and low dissipation factor (Df 0.002 @1MHz), resulting in minimal signal loss and stable electrical performance across a
ThinFlex-W22, W-0505RD-H1 represents a significant advancement in flexible printed circuit (FPC) materials technology. It is an adhesiveless double-sided (D/S) copper clad laminate, engineered to meet the demanding requirements of modern
ThinFlex-W22, W-2010ED-N4 is an adhesiveless double-sided (D/S) copper clad laminate, using ThinFlex TPI film and laminated with ED copper foil on both sides. With a dielectric constant (3.3 @1GHz) and
