pcb material

FR4 material

Review Shengyi S1141 datasheet values, applications and limits for HDI, heavy copper, high-layer-count and controlled-impedance PCB designs.
Review IT-170GRA2 datasheet values, Dk, Df, Tg, CTE, stackup choices and QFPCB support for controlled-impedance multilayer, hybrid and HDI PCBs.
Review Shengyi S1151G datasheet values, CTI 600 V, halogen-free construction, S1151GB prepreg and limits for layer count, copper and rework.
Synamic 6N laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method. Synamic 6N
Shengyi Synamic6GX laminate have a glass transition temperature of 172 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance.The dielectric constant of Synamic6GX is 3.73,
The Shengyi S1190 laminate exhibits a glass transition temperature (Tg) of 170 °C under Thermomechanical Analysis (TMA) conditions, while its Tg under Dynamic Mechanical Analysis (DMA) conditions is 200 °C.The
Shengyi Synamic8G laminate have a glass transition temperature of 200 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance. The dielectric constant of Synamic8G is
The Shengyi ST110G laminate is fully halogen-free and exhibits a glass transition temperature (Tg) of 175 °C under Dynamic Mechanical Analysis (DMA). One of the standout features of ST110G laminate
The S7136H laminate is characterized by a high Glass Transition Temperature (Tg) of over 280°C.With a dielectric constant of 3.42 at 10GHz, the S7136H laminate maintains outstanding dielectric stability across
The NP-175FM provides a minimum Tg of 170°C, making it fully lead-free compatible and suitable for advanced soldering profiles. The NP-175FM offers a well-balanced dielectric constant (DK 4.2 @1GHz) and
Review Shengyi S1600 CTI, Tg, Td, Dk/Df and processing limits, with QFPCB guidance for power supplies, appliances and high-CTI PCB designs today.
Review Ventec VT-901 Tg, Td, CTE and processing data, with QFPCB guidance for burn-in boards, downhole drilling electronics and high-temperature PCBs.

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