Aluminum Nitride (AlN) is the best available thermally conductive material (170 W/mK) that is also a strong electric insulator. It is therefore used in a variety of applications where heat
NP-155F features a glass transition temperature (Tg) ≥150°C, making it well-suited for lead-free assembly processes. The dielectric constant (Dk 4.6 @ 1MHz) and low dissipation factor (Df 0.016 @ 1MHz),
NY2150 features a glass transition temperature (Tg) of ≥150°C, making it fully compatible with lead-free soldering processes. The dielectric constant (DK) is 4.7 @1MHz and dissipation factor (DF) is 0.013
Isola 370HR is a high Tg PCB laminate, This laminate comprises the Fr-4 epoxy resin system. This laminate comprises multifunctional epoxy resin with E-glass fabric reinforcement.
