Rogers curamik® product suite offers best-in-class metallized ceramic substrates that enable higher power efficiency. The low coefficient of thermal expansion of the ceramic substrate means they outperform substrates based on
Aluminum Nitride (AlN) is the best available thermally conductive material (170 W/mK) that is also a strong electric insulator. It is therefore used in a variety of applications where heat
Ceramic printed circuit boards (PCB), also known as ceramic substrates, they are made with ceramic materials such as aluminum oxide(Al₂O₃) or aluminum nitride(AIN) instead of the standard fiberglass material. Ceramic
Yellowing has been observed on the Al₂O₃ ceramic portions of Direct Bonded Copper (DBC) substrates, with varying degrees of discoloration. Recently, some customers have expressed concerns that this phenomenon might
Ceramic metallization has the following requirements: excellent sealing performance, low sheet resistance and resistivity of the metal conductive layer, strong adhesion to the ceramic substrate, and the ceramic must still
Silicon nitride (Si₃N₄) ceramics are compound ceramics formed from silicon and nitrogen elements through high-temperature sintering. Their unique crystal structure and chemical bonds endow them with distinctive physical and chemical
Common alumina ceramics are classified based on their Al₂O₃ content, including variants with 99%, 95%, 90%, 96%, 85%, and sometimes 80% or 75% alumina. 99% alumina refers to alumina with
