EM-370(5) features a glass transition temperature of 150 degree Celsius and it is classified as a halogen-free material. The EM-370(5) is a specialized material characterized by its medium glass transition
The NP-175FM provides a minimum Tg of 170°C, making it fully lead-free compatible and suitable for advanced soldering profiles. The NP-175FM offers a well-balanced dielectric constant (DK 4.2 @1GHz) and
Nelco N8000 Cyanate Esteer Epoxy Laminate and Prepreg are cyanate ester laminates with high-Tg that provide outstanding thermal and mechanical properties.The material boasts an exceptionally high Glass Transition Temperature (Tg)
The N5000 laminate exhibits a glass transition temperature (Tg) of 185°C by DSC. It incorporates BT (bismaleimide triazine) resin, which offers low dielectric constant (Dk 3.6 @ 10GHz) and dissipation
N4000-13 laminate is high glass transition temperature (Tg > 210°C), which ensures thermal reliability in demanding applications. the material also features a low dielectric constant (DK 3.6 @ 10GHz) and
The IS550H laminate features a glass transition temperature (Tg 200°C), providing excellent thermal stability and dimensional integrity under elevated temperatures. With a dielectric constant (DK 4.43 @10GHz) and a dissipation
N4000-29 is an advanced, lead-free, low-CTE, high Tg (185°C by DSC) multifunctional epoxy PCB material with a high Tg, excellent thermal stability and good moisture resistance. Its dielectric constant (DK
TerraGreen® 400G2 features a glass transition temperature (Tg) of 200°C, With a dielectric constant (DK 3.10 @ 10GHz) and a dissipation factor (DF 0.0015 @ 10GHz) translates to reduced dielectric
Isola IS580G halogen-free laminates are designed with a high glass transition temperature (Tg 205°C), offers a stable dielectric constant (Dk 3.80 @10GHz) and a low dissipation factor (Df 0.006 @10GHz),
KB-6168LE is a high Tg laminate designed for applications requiring elevated thermal resistance and electrical stability. With a lead-free DSC Tg of 190°C, the laminate offers excellent thermal endurance under
The material exhibits a low dielectric constant (Dk 4.6 @1GHz) and low dissipation factor (Df 0.016 @1GHz), which are essential for maintaining signal integrity and low power loss in both
The Mid-Range Glass Transition Temperature (Tg) exceeding 150°C is a cornerstone feature.With a dielectric constant (DK 4.6 @ 1 GHz), the dielectric constant of the material is a measure of
NY2170 is engineered with a glass transition temperature (Tg) of 170°C, providing robust thermal performance under lead-free assembly processes.The dielectric constant (DK）is 4.5 @ 1 GHz and dissipation factor (DF）is
With a DSC Tg over 150°C, it supports mid-temperature applications and is fully compatible with lead-free soldering processes. KB-6165G exhibits a stable dielectric constant (Dk 4.6 @1GHz) and low dissipation
NP-155F features a glass transition temperature (Tg) ≥150°C, making it well-suited for lead-free assembly processes. The dielectric constant (Dk 4.6 @ 1MHz) and low dissipation factor (Df 0.016 @ 1MHz),
NY2150 features a glass transition temperature (Tg) of ≥150°C, making it fully compatible with lead-free soldering processes. The dielectric constant (DK) is 4.7 @1MHz and dissipation factor (DF) is 0.013
