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Enter Shengyi Synamic9GN, a next generation laminate engineered specifically to conquer the challenges of ultra high speed digital and high performance computing applications.
In this article, we’ll discuss what really characterizes the Shengyi Synamic9GN laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency multilayer PCB boards, so please feel free to contact us.
What is The Shengyi Synamic9GN PCB Material?
Shengyi SYNAMIC9GN laminate is a high performance, extremely low-loss PCB material specifically engineered for advanced high frequency applications. Built on a thermoset resin system, it delivers a high effective glass transition temperature (Tg 210℃ by DMA), ensuring excellent dimensional stability and long-term reliability under high temperature conditions and across multiple reflow cycles. SYNAMIC9GN laminate have a dielectric constant (DK 3.34 @10GHz) and the dissipation factor (Df) of just 0.0014 at 10 GHz, very Low Df values result in minimal signal loss, with stable Dk and Df across a wide frequency and temperature range, maintaining performance even in fluctuating environmental conditions.
This laminate also boasts a high decomposition temperature of 400°C, enabling it to withstand repeated reflow cycles and prolonged exposure to elevated thermal stress without degradation. This exceptional thermal stability ensures long-term performance and durability in demanding applications. In addition, the laminate exhibits a lower Z-axis coefficient of thermal expansion (CTE), which helps preserve the integrity of plated through holes (PTHs) during thermal cycling and high temperature processing—further enhancing reliability in multilayer and high density PCB designs.
SYNAMIC9GN laminate offers excellent PCB processability, seamlessly integrating into standard fabrication processes such as drilling, plating, and soldering. It is also well-suited for multilayer PCBs. This combination of superior electrical performance, mechanical robustness, and design flexibility makes Shengyi SYNAMIC9GN laminate an outstanding choice for next-generation RF and microwave systems, including 5G infrastructure, antenna arrays, and high-reliability communication platforms.
The Shengyi Synamic9GN PCB Material Data Sheet
The Features of Shengyi Synamic9GN PCB Material
High Glass Transition Temperature (Tg)
The laminate advanced resin system contributes to a high effective Tg (210℃ by DMA), ensuring dimensional stability and reliable performance during high temperature operations and multiple reflow cycles.
Low Dielectric Constant (Dk)
With a dielectric constant (3.34 @10GHz), this laminate maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high frequency circuits.
Low Dissipation Factor (Df)
With a dissipation factor (0.0014 @10GHz), this laminate minimizes signal loss, making it ideal for applications that demand precise and efficient signal transmission. ensuring minimal signal distortion and insertion loss—ideal for high speed and high frequency circuit designs.
Higher Heat Resistance Td: >400℃, T288>60min
With a decomposition temperature (Td) exceeding 400°C and a T288 value of over 60 minutes, Synamic9GN demonstrates outstanding heat resistance, allowing it to withstand repeated soldering cycles and prolonged exposure to elevated temperatures without structural degradation.
Environmentally Friendly Materials
Being halogen free and compliant with major environmental directives like RoHS and REACH, Synamic9GN laminate supports sustainable product development and eco-friendly manufacturing.
Lower Z-Axis Coefficient of Thermal Expansion (CTE)
The laminate exhibits a low Z-axis CTE, which minimizes expansion under thermal stress and helps maintain the integrity of plated through holes (PTHs), especially during multiple reflow cycles or under high temperature operation—crucial for maintaining long-term reliability in multilayer PCBs.
Low Moisture Absorption with Excellent Resistance to Heat and Humidity
The laminate features low moisture absorption, ensuring consistent electrical performance even in humid environments. Its excellent resistance to heat and moisture enhances long-term durability and reliability in demanding operating conditions.
What are The Applications of Shengyi Synamic9GN PCB Material?
Shengyi Synamic9GN laminate is purpose built for high speed, high frequency applications across a range of advanced technology sectors:
Ultra High Speed Network Equipment (Supporting up to 112Gbps)
This laminate is ideal for use in next-generation network switches, routers, and optical modules, where minimizing signal loss and maintaining signal integrity at extreme data rates is essential.
AI Servers, Storage, and Switching Equipment
In AI driven data centers, where high speed processing and low latency communication are critical, Synamic9GN supports backplanes, memory modules, and high density interconnects with its superior electrical properties and thermal resilience.
Baseband Units (BBUs) in Base Stations
As part of modern 5G infrastructure, BBUs require materials that can support high speed signal processing and RF front-end integration. Synamic9GN delivers the reliability and performance needed for these applications.
Supercomputing Systems
In supercomputers and high performance computing platforms, where thousands of processors work in parallel, Synamic9GN enables high speed interconnects and dense circuitry while maintaining signal fidelity and thermal stability.
High-Frequency Measuring Instruments
For test and measurement equipment used in R&D and quality assurance, Synamic9GN ensures precision and repeatability, supporting accurate signal capture and analysis at GHz-level frequencies.
Manufacturing Advantages of The Shengyi Synamic9GN PCB Material
Shengyi Synamic9GN laminate is not only high performing but also cost-effective and easy to process, which is essential for large-scale production environments:
Compatibility with Standard PCB Processes
Unlike many exotic high speed materials, Synamic9GN integrates seamlessly into existing PCB manufacturing workflows, including etching, drilling, plating, and soldering—reducing production complexity and cost.
Great Mechanical and Electrical Properties
This laminate offers a unique combination of mechanical durability, thermal resilience, and electrical consistency, ensuring long-term reliability even under challenging environmental conditions.
Cost-Effective and Readily Available
Positioned as a cost-effective solution within the high performance laminate segment. Crucially, it is readily available from Shengyi, a major global supplier, ensuring stable supply chains for volume production.
As the demand for ultra-fast, thermally robust, and high frequency PCBs continues to grow, Shengyi Synamic9GN emerges as a top-tier solution. Its superior thermal performance, low-loss electrical characteristics, and excellent reliability make it ideal for advanced electronics in data centers, AI platforms, and beyond. By choosing Synamic9GN laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
