Shengyi Synamic6GX laminates are a next-generation halogen-free solution designed to deliver superior signal integrity, thermal reliability, and manufacturability across a range of high-speed applications.
In this article, we’ll discuss what really characterizes the Shengyi Synamic6GX laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high reliability PCB board, so please feel free to contact us.
What is the Synamic6GX pcb material?
The laminate have a glass transition temperature of 172 degrees Celsius, it is a high Tg value, which significantly influences its thermal performance. Generally speaking, Tg serves as a measure of how a material softens when exposed to temperatures exceeding its threshold. Specifically, the Synamic6GX PCB material will start to soften when operating at temperatures above 172 degrees Celsius. The dielectric constant（DK）of Synamic6GX is 3.73, which is quite low. Thus, Synamic6GX exhibits a low dielectric constant. This electrical property plays a crucial role in ensuring signal integrity and impedance. It should be noted that the dielectric constant of a material is frequency-dependent. A material with a low and stable dielectric constant is highly suitable for high-frequency applications.
The laminate is a low-loss and high-reliability option. And the Td value of the Synamic6GX laminate is 405 degrees Celsius. The decomposition temperature indicates the temperature at which Synamic6GX undergoes chemical decomposition. Therefore, it will decompose chemically at 405 degrees Celsius. Notably, this value is relatively high. Materials with a high Tg are capable of withstanding thermal stress without breaking.
Moreover, it is a halogen free material, meaning it contains no halogen constituents. This makes it extremely safe for PCB fabrication, as it is free from toxic substances. Halogen is a harmful substance that can have detrimental effects on human health and the environment. Consequently, PCB manufacturers tend to prefer using halogen-free materials for their PCB fabrication processes. The laminate is engineered specifically to meet these challenges. Designed as a high-speed, halogen-free material solution, Synamic6GX delivers exceptional electrical performance, superior thermal resistance, and environmental compliance, making it an ideal choice for ultra-high-speed digital systems and optical communication modules.
The Synamic6GX PCB material data sheet
The features of the Synamic6GX PCB material
Glass Transition Temperature (Tg)
The laminate features a high Glass Transition Temperature (Tg) of 172°C, ensuring dimensional stability and consistent electrical performance under the thermal stresses of dense, power-hungry assemblies and multiple reflow cycles.
High Decomposition Temperature (Td)
This laminate has a decomposition temperature of 405 degrees Celsius. Offers a high decomposition temperature, allowing it to withstand multiple reflow cycles and extended operation under high thermal stress without degradation. Supports long-term thermal stability and resistance to degradation at high temperatures.
Low Dielectric Constant (Dk)
With a dielectric constant (3.73 @10GHz), Synamic6GX maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high speed circuits.
Very Low Dissipation Factor (Df)
With a dissipation factor (0.005 @10GHz), the material exhibits a very low Df value, reduces transmission losses, enabling reliable performance at high data rates. minimizing signal loss (insertion loss) and distortion critical for multi-gigabit applications.
Halogen Free Material
It is fully halogen free, meeting global environmental regulations such as IEC 61249-2-21 and supporting sustainable design practices. This is formulated without bromine or chlorine, reducing environmental impact and safety concerns during manufacturing and end-of-life disposal.
High Heat Resistance: T300 >60 minutes
Synamic6GX exhibits outstanding resistance to delamination under sustained high heat, reliably passing the demanding T300 test (>60 minutes at 300°C). This ensures long-term reliability in high-power density designs and harsh operating environments.
Lower Z-axis CTE
This critical property helps reduce stress on plated through holes (PTHs) during thermal cycling. The lower Z-axis CTE contributes significantly to superior PTH reliability, preventing barrel cracks and ensuring stable electrical connections over the product lifetime.
Lower Moisture Absorption
With minimal moisture uptake, Synamic6GX ensures stable electrical performance even in humid environments, making it suitable for outdoor or industrial applications. The material absorbs minimal moisture, mitigating the negative effects of humidity on electrical properties (Dk/Df) and reducing risks like delamination or “popcorning” during solder reflow.
What are the applications of the Synamic6GX PCB material?
Synamic6GX’s unique blend of electrical performance, thermal robustness, and halogen-free compliance makes it ideal for critical infrastructure:
High Speed Network Equipment
The PCB material is of vital significance in high speed networking. Moreover, this material provides excellent signal integrity, which is essential for high speed networking. High-speed network equipment is responsible for combining or splitting information within a telecommunications network. It encompasses Server, Switch, Storage and Routers. This equipment highly depends on the Synamic6GX PCB material.
Telecommunication System
The Synamic6GX enhances the signal integrity of PCBs. Owing to these advantages, it is extensively used in the telecommunications field. For example, a server is a device that provides services to other computer programs. It receives and stores information. The Synamic6GX PCB material plays a crucial part in the telecommunication system.
High Performance Computing
The laminate is frequently utilized in high-performance computing. This application enables engineers and researchers to solve complex problems in a shorter period. The laminate possesses properties that make it an ideal choice for this application. The material is ideal for GPU modules, backplanes, and high-density interconnects, where consistent signal propagation and thermal resilience are key to system performance.
Manufacturing advantages of the Synamic6GX PCB material
Choosing Shengyi Synamic6GX laminate isn’t just about technical specs, it offers significant practical benefits for manufacturers:
MOT 150°C
It has a Maximum Operating Temperature (MOT) of 150°C, allowing it to perform reliably in high-temperature environments and during extended operations. Supports demanding thermal environments and complex board assemblies.
High Heat Resistance
Synamic6GX demonstrates excellent heat resistance, making it compatible with lead-free soldering processes and capable of enduring harsh operational conditions. Maintains dimensional and structural stability during assembly and reflow soldering processes.
Environmentally Safe
Its Halogen Free composition aligns with global environmental directives (RoHS, REACH, etc.) and corporate sustainability goals, reducing hazardous substances. Halogen free formulation contributes to safer, more sustainable electronics manufacturing.
Cost-Effective and Readily Available
Compared to more exotic high speed materials like PTFE or ceramic-filled composites, Synamic6GX offers a cost-efficient alternative with comparable performance—making it ideal for medium to large-scale production. Offers a favorable balance of performance and procurement accessibility, making it a practical choice for both prototyping and volume production.
Shengyi laminates combine next-level thermal endurance, electrical performance, and environmental safety in one robust material system. By choosing Synamic6GX laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
