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Shengyi Technology’s Synamic 6N laminates emerge as a premier solution, engineered to deliver exceptional performance, reliability, and manufacturability for the most challenging high-speed digital and RF applications.
In this article, we’ll discuss what really characterizes the Shengyi SYNAMIC 6N laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the Heat Resistance Multilayer PCB board, so please feel free to contact us.
What is the Synamic 6N pcb material?
Synamic 6N laminate demonstrates a Tg value of 185°C as measured by the DSC method, and a glass transition temperature (Tg) of 205°C determined via the DMA method. The glass transition temperature signifies the threshold at which the material transitions from a ductile to a brittle and rigid state, typically occurring at a lower temperature than the melting point of the material’s crystalline phase. The Synamic 6N laminate has a decomposition temperature of 402 degrees Celsius. Its high decomposition temperature allows it to endure multiple reflow cycles and extended operation under high thermal stress without degradation. It supports long-term thermal stability and resistance to degradation at high temperatures.
Synamic laminate has a low dielectric constant of 3.35 at 10 GHz, maintains outstanding dielectric stability across various frequency and temperature ranges. This stability is crucial for maintaining impedance control and minimizing signal distortion in high-speed circuits. With a dissipation factor of 0.0021 at 10 GHz, the material demonstrates an extremely low Df, significantly reducing signal loss and enabling efficient transmission of high-frequency signals. This is an important factor for achieving high data rates with minimal error.
Synamic laminate is designed with advanced anti-CAF (Conductive Anodic Filament) technology. This technology significantly enhances long-term reliability by reducing the risk of internal failures caused by moisture absorption and electrochemical migration.The Synamic 6N laminate features a lower Z-axis CTE, which minimizes dimensional changes perpendicular to the board plane during thermal cycling. This greatly reduces stress on copper plating within vias and plated through-holes, preventing cracks and enhancing overall interconnect reliability.
The Synamic 6N PCB material data sheet
The features of the Synamic 6N PCB material
Glass Transition Temperature (Tg)
The laminate features a high Glass Transition Temperature (Tg) of ≥ 180°C, ensuring dimensional stability and consistent electrical performance under the thermal stresses of dense, power-hungry assemblies and multiple reflow cycles.
High Thermal Decomposition Temperature (Td)
The laminate has a decomposition temperature of 402 degrees Celsius. Offers a high decomposition temperature, allowing it to withstand multiple reflow cycles and extended operation under high thermal stress without degradation. Supports long-term thermal stability and resistance to degradation at high temperatures.
Lower Dielectric Constant (Dk)
With a dielectric constant (3.35 @10GHz), Synamic 6N maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high speed circuits.
Lower Dissipation Factor (Df)
With a dissipation factor (0.0021 @10GHz), the material exhibits a very low Df, significantly reducing signal loss and enabling efficient transmission of high-frequency signals—an important factor for achieving high data rates with minimal error.
Excellent anti-CAF performance
Synamic 6N is engineered with advanced anti-CAF (Conductive Anodic Filament) technology, significantly enhancing long-term reliability by reducing the risk of internal failures caused by moisture absorption and electrochemical migration.
Excellent Thermal Reliability
Designed for demanding environments, Synamic 6N delivers superior thermal endurance, making it suitable for use in high power and high density PCBs where heat buildup is a concern.
Excellent Through-Hole Reliability
Designed for robust performance, Synamic 6N offers superior through-hole reliability, ensuring long-term durability even under repeated thermal cycling. The material exhibits outstanding adhesion and resistance to thermal stress, leading to superior reliability of plated through-holes. This is critical for multilayer boards and components with leads passing through the board.
Lower Z-axis CTE
The laminate features a lower Z-axis CTE minimizes dimensional changes perpendicular to the board plane during thermal cycling. This dramatically reduces stress on copper plating within vias and plated through-holes, preventing cracks and enhancing overall interconnect reliability.
What are the applications of the Synamic 6N PCB material?
Synamic 6N is purpose-built for high speed, high frequency applications across a range of advanced technology sectors:
Ultra High-Speed Network Equipment
Synamic 6N is ideal for data center switches, routers, and optical transceivers, where maintaining signal integrity at speeds beyond 25 Gbps is crucial. Supports the high data rates demanded by modern telecommunications.
Servers and Storage Systems
Used in high-performance computing platforms, Synamic 6N supports fast data transfer speeds and stable operation under high thermal loads, making it well-suited for AI accelerators and memory modules.
Base Station Equipment (BBU, Routers, Switches)
For 5G base stations and wireless infrastructure, Synamic 6N enables robust RF and digital signal processing with excellent thermal management capabilities. Facilitates robust signal processing and transmission in 5G and advanced wireless infrastructure.
High-Performance Computing (HPC)
The material is ideal for GPU modules, high-bandwidth interconnects, and backplanes, where consistent signal propagation and thermal resilience are key to system performance. Systems pushing the boundaries of computational power, including AI/ML accelerators and supercomputing modules.
High-Frequency Measuring Instruments
Synamic 6N supports the design of precision test equipment, including oscilloscopes, signal analyzers, and network analyzers, where measurement accuracy depends on stable dielectric properties. Test & Measurement equipment (Vector Network Analyzers, etc.) requiring substrates with minimal dielectric loss for accurate signal analysis.
Optical Communication Products
Used in optical modules and transceivers, Synamic 6N ensures minimal signal distortion and high reliability for fiber optic communications, especially in 100G/400G systems. High-speed optical transceivers (QSFP-DD, OSFP, COBO) and related modules where signal integrity is paramount.
Manufacturing advantages of the Synamic 6N PCB material
Choosing Shengyi Synamic 6N laminate isn’t just about technical specs, it offers significant practical benefits for manufacturers:
High Heat Resistance
Synamic 6N demonstrates excellent heat resistance, making it compatible with lead-free soldering processes and capable of enduring harsh operational conditions. Maintains dimensional and structural stability during assembly and reflow soldering processes.
UL 94 V-0 Flammability Rating
The material meets the UL 94 V-0 flammability standard, ensuring safety compliance for commercial and industrial electronics. Complies with stringent safety standards, enhancing device reliability and regulatory acceptance.
Cost-Effective and Readily Available
Compared to more exotic high-speed materials like PTFE or ceramic-filled composites, Synamic 6N offers a cost-efficient alternative with comparable performance—making it ideal for medium to large-scale production. Offers a competitive balance between high performance and material availability, helping to optimize total cost of ownership.
Great Electrical and Mechanical Performance
Synamic 6N combines outstanding electrical characteristics with robust mechanical durability, enabling designers to achieve both performance and reliability in complex, high-density PCBs.
Shengyi Synamic 6N laminates offer a powerful combination of electrical performance, thermal resilience, and environmental compliance, making them a preferred material for ultra-high-speed networking, 5G infrastructure, optical communication, and high frequency instrumentation. By choosing Synamic 6N laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
