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Shengyi ST110G laminates are engineered to meet these exact challenges. As a high-performance FR-4 material with enhanced thermal conductivity, ST110G offers a unique combination of thermal dissipation, mechanical strength, and electrical insulation properties, making it ideal for applications where heat buildup and electrical reliability are critical concerns.
In this article, we’ll discuss what really characterizes the Shengyi ST110G laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high thermal conductivity multilayer PCB boards, so please feel free to contact us.
What is the high thermal conductivity ST110G pcb material?
The Shengyi ST110G laminate is fully halogen-free and exhibits a glass transition temperature (Tg) of 175 °C under Dynamic Mechanical Analysis (DMA). This indicates that at these temperatures, the printed circuit board material undergoes a transition from a rigid state to a softer one. Such a property renders it highly suitable for applications in printed circuit boards. The Shengyi laminate has a decomposition temperature of 400°C. At this temperature, the laminate undergoes chemical decomposition, resulting in a mass loss of at least 5%.
The laminate demonstrates a dielectric constant of 4.13 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor of 0.0099 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during signal transmission. This is of critical importance for applications demanding efficient performance in thermally challenging environments.
The laminate also showcases excellent anti-Conductive Anodic Filament (CAF) performance. Shengyi ST110G Laminate delivers outstanding thermal conductivity, around 1 W/mK. This characteristic ensures efficient heat dissipation, which is crucial for maintaining device performance and preventing thermal degradation in high-power applications. Furthermore, this material demonstrates exceptional processability and design flexibility, along with outstanding cost-performance characteristics. Notably, the Shengyi ST110G adheres to key industry standards within the PCB sector.
The high thermal conductivity ST110G PCB material data sheet
The features of the high thermal conductivity ST110G PCB material
High Thermal Conductivity (1.0 W/(m-K))
One of the standout features of ST110G laminate is its enhanced high thermal conductivity of 1.0 W/(m·K). This makes it an excellent solution for managing heat in high-power circuits, reducing operating temperatures, and improving long-term reliability.
Glass Transition Temperature (Tg)
The laminate features a high glass transition temperature of 175 degree celsius, ensuring dimensional stability and resistance to thermal deformation during lead-free soldering processes and under elevated operating conditions.
High Decomposition Temperature (Td)
With a high Decomposition Temperature (Td≥400°C), ST110G laminate exhibits outstanding resistance to thermal degradation. This provides a crucial safety margin during soldering and ensures long-term reliability in high temperature operating environments.
Dielectric Constant (Dk)
With a dielectric constant (4.13 @1GHz), the Dielectric Constant (Dk) of laminate is a measure of its ability to store electrical energy in a capacitor-like manner. The material maintains a stable dielectric constant, which is essential for high quality pcb boards.
Dissipation Factor (Df)
With a dissipation factor (0.0099 @1GHz) translates to reduced dielectric loss, ensuring minimal heat generation during signal transmission, which is crucial for applications that require efficient performance in thermally challenging environments.
High Voltage & Anti-CAF Capability
Designed with anti-conductive anodic filamentation (Anti-CAF) properties, Shengyi ST110G laminate provides enhanced protection against leakage currents and electrical shorts, especially in high-voltage environments.
Excellent Thermal and Insulation Reliability
The Shengyi material maintains outstanding insulation resistance and dielectric strength, even under harsh conditions such as high temperature and humidity, ensuring safe and reliable operation in mission-critical applications.
Lower Z-axis CTE
Features a Lower Z-axis CTE compared to standard materials. This better matches the CTE of copper plated through holes (PTHs), significantly reducing stress on the barrel and lowering the risk of interconnect failure during thermal cycling.
RTI 160℃ (≥0.2mm min. build-up thickness)
The laminate meets the UL RTI 160°C standard, allowing it to be used in applications requiring long-term thermal endurance, especially when built with a minimum core thickness of 0.2mm, ensuring dependable insulation over the product lifecycle.
What are the applications of the high thermal conductivity ST110G PCB material?
Shengyi ST110G laminate isn’t for simple boards. Its properties make it ideal for complex, high-layer-count, and thermally challenging applications:
PCB Heat Dissipation Solutions
The 1.0 W/(m-K) thermal conductivity is the star here. The laminate is ideal for boards needing to dissipate heat from components like MOSFETs, IGBTs, regulators, and high-power LEDs without resorting to complex (and costly) metal-core boards or heavy copper weights alone.
DC/DC Converters and Other Power Supply Units
High efficiency power conversion generates significant heat. ST110G laminate helps manage this heat effectively while providing the high voltage isolation and reliability needed in converters, inverters, SMPS, and POL (Point-of-Load) modules.
Automotive Electronics
In the automotive industry, where components must withstand extreme temperatures and vibrations, ST110G laminate delivers the reliability, thermal resilience, and electrical safety required for use in engine control units (ECUs), onboard chargers, and ADAS systems.
Manufacturing advantages of the High Tg ST110G PCB material
Choosing Shengyi ST110G laminate isn’t just about technical specs, it offers significant practical benefits for manufacturers:
Compatibility with Standard PCB Processes
Unlike many exotic thermal management materials, the laminate is compatible with standard FR-4 fabrication processes, including etching, drilling, and soldering—making it easy to integrate into existing manufacturing workflows.
Great Mechanical and Electrical Properties
This laminate combines excellent mechanical rigidity with stable electrical performance, ensuring both structural durability and signal/power integrity across a wide range of applications.
Cost-Effective and Readily Available
Compared to highly specialized ceramic-filled or polyimide-based thermal materials, the laminate offers a much more attractive price point while delivering substantial thermal improvement over standard FR-4. Its compatibility with standard processes further reduces overall manufacturing costs. As a product from Shengyi, a major global laminate supplier, it benefits from established supply chains and availability.
Shengyi ST110G laminate presents a powerful solution for engineers battling thermal challenges in power electronics, automotive systems, and other reliability-critical applications. By choosing ST110G laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
