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As electronic devices shrink in size while demanding higher performance, the substrate materials inside semiconductor packages face immense challenges. Warpage control, signal integrity, and manufacturing yield become critical.Shengyi SI13U rises to this challenge as a purpose built laminate engineered for advanced packaging substrates (PKG), delivering the thermal stability, mechanical precision, and electrical performance needed for next gen miniaturization.
In this article, we’ll discuss what really characterizes the Shengyi SI13U laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the IC Substrate, so please feel free to contact us.
What is The Shengyi SI13U PCB Material?
Shengyi SI13U laminate is a halogen free and lead free PCB laminate（RoHS/WEEE compliant）, widely used as the primary raw material in PCB fabrication. It is specifically designed for high performance applications that demand excellent thermal and mechanical stability. One of its standout features is its exceptionally high glass transition temperature (Tg) of 230°C, which ensures outstanding dimensional stability and minimal warpage under elevated temperatures.
The laminate demonstrates a dielectric constant of 4.8 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor of 0.013 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during signal transmission. This is of critical importance for applications demanding efficient performance in thermally challenging environments.
In addition, the decomposition temperature (Td) of SI13U laminate is above 400°C at 5% weight loss, significantly higher than the typical 320°C threshold seen in many standard PCB materials. This makes it highly resistant to thermal degradation and suitable for use in demanding thermal environments. This laminate exhibits a low coefficient of thermal expansion (CTE) — 13 ppm/°C on the X/Y axes and 30 ppm/°C on the Z-axis — indicating minimal expansion or contraction with temperature fluctuations. This low CTE enhances reliability, especially in high-density and multilayer board designs.
The material also boasts a high flexural modulus, contributing to its mechanical rigidity and making it ideal for thin, high performance substrates used in advanced electronics. Its low CTE, excellent mechanical strength, and halogen free formulation make it a reliable choice for miniaturized, high speed, and environmentally conscious applications such as SSDs, memory modules, and RF components.
The Shengyi SI13U PCB Material Data Sheet
The Features of Shengyi SI13U PCB Material
Glass Transition Temperature (Tg)
Shengyi SI13U laminate features a high glass transition temperature ≥230℃ (DMA) , this is very high. ensuring dimensional stability and resistance to thermal deformation during lead-free soldering processes and under elevated operating conditions.
High Decomposition Temperature (Td)
With a high Decomposition Temperature (Td >400°C, 5% loss,TGA), Shengyi SI13U laminate exhibits outstanding resistance to thermal degradation. This provides a crucial safety margin during soldering and ensures long term reliability in high-temperature operating environments.
Dielectric Constant (Dk)
With a dielectric constant (4.8 @1GHz), the Dielectric Constant (Dk) of Shengyi SI13U laminate is a measure of its ability to store electrical energy in a capacitor like manner. The material maintains a stable dielectric constant, which is essential for high quality pcb boards.
Dissipation Factor (Df)
With a dissipation factor (0.013 @1GHz), Shengyi SI13U laminate minimizes signal loss and ensures accurate impedance control crucial for high speed digital and RF designs where signal integrity is key.
High Flexural Modulus with Low X/Y/Z-Axis CTE
The laminate exhibits low CTE in all three axes, which enhances dimensional stability and improves reliability in high density interconnects and multilayer boards. Enhances package reliability by minimizing expansion mismatch with copper and components.
Halogen-free, compatible with lead-free processing
This laminate is fully halogen free and compatible with lead free soldering processes, meeting global environmental standards such as RoHS and WEEE directives. This makes it suitable for use in eco conscious electronic products without compromising on performance or reliability.
What are The Applications of SI13U PCB Material?
Designed for space constrained, high functionality devices, Shengyi SI13U laminate is widely used in compact and integrated electronic modules, including:
Memory Cards and Solid-State Drives (SSD)
Shengyi SI13U laminate is widely used in memory card modules and solid state drives, where stable electrical performance and mechanical durability are essential for long term data integrity and device reliability.
DRAM Modules
For high density memory applications like DRAM packages, shengyi SI13U laminate provides the necessary thermal and dimensional stability to support reliable interconnects and high speed data transmission.
Fingerprint Sensors and RF Modules
The low loss characteristics and dimensional accuracy of SI13U laminate make it well suited for fingerprint sensors and RF modules, where maintaining signal clarity and structural integrity is key.
Advanced Packaging Applications: AP BOC, COB, and WBBGA
Shengyi IC Substrate laminate is particularly suited for advanced packaging technologies, including:
• AP BOC (Package on Package Ball Grid Array)
• COB (Chip on Board)
• WBBGA (Wire Bond BGA & coreless substrates)
These applications benefit from SI13U laminate’s low CTE, high flexural strength, and compatibility with fine pitch and wire bonding processes, making it a go to material for high performance IC packaging.
Manufacturing Advantages of The Shengyi SI13U PCB Material
In addition to its performance features, Shengyi SI13U laminates are well regarded for their excellent manufacturability and cost efficiency:
Environmentally Friendly
Halogen free chemistry contributes to safer handling and eco conscious product life cycles. Being halogen free and compliant with major environmental directives like RoHS and REACH, Shengyi SI13U laminate supports sustainable product development and eco friendly manufacturing.
Excellent Punching & Drilling Performance
This laminate is designed for precision manufacturing processes, including punching and drilling. Its optimized mechanical properties ensure clean hole walls and minimal burring, enhancing yield rates and reducing production downtime.
High Flexural Modulus
Shengyi IC Substrate laminate is well suited for thin substrates and high density packaging, especially in handheld and wearable electronics. Supports stable fabrication processes and reduces warpage during multilayer press cycles.
Great Performance
Shengyi SI13U laminate combines low dielectric loss, high thermal reliability, and mechanical strength, ensuring consistent performance in both digital and RF applications. Combines electrical, thermal, and mechanical attributes that simplify design and improve end product reliability.
Ultimately, Shengyi SI13U laminates offer a powerful blend of low CTE, high mechanical strength, and environmentally compliant processing, positioning them as a versatile and reliable solution for today’s most demanding packaging applications. By choosing SI13U laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
