In the fast paced world of compact, high performance electronics, PCB materials must deliver exceptional reliability, signal integrity, and manufacturing efficiency. Shengyi SI10US halogen free laminates rise to this challenge, offering a tailored solution for cutting edge mobile and consumer devices.
In this article, we’ll discuss what really characterizes the Shengyi SI10US laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the IC Substrate, so please feel free to contact us.
What is the Shengyi SI10US pcb material?
Shengyi SI10US laminate is a halogen free and lead free PCB laminate, widely used as the primary raw material in PCB fabrication. It is specifically designed for high performance applications that demand excellent thermal and mechanical stability. One of its standout features is its exceptionally high glass transition temperature (Tg) of 280°C, which ensures outstanding dimensional stability and minimal warpage under elevated temperatures. The decomposition temperature (Td) of SI10US laminate is above 400°C at 5% weight loss, significantly higher than the typical 320°C threshold seen in many standard PCB materials. This makes it highly resistant to thermal degradation and suitable for use in demanding thermal environments.
The Shengyi IC Substrate laminate demonstrates a dielectric constant of 4.4 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor of 0.007 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during signal transmission. This is of critical importance for applications demanding efficient performance in thermally challenging environments.
In addition, IC Substrate laminate exhibits a low coefficient of thermal expansion (CTE) — 10 ppm/°C on the X/Y axes and 25 ppm/°C on the Z-axis — indicating minimal expansion or contraction with temperature fluctuations. This low CTE enhances reliability, especially in high-density and multilayer board designs.
The material also boasts a high flexural modulus, contributing to its mechanical rigidity and making it ideal for thin, high performance substrates used in advanced electronics. With its combination of superior thermal performance, low CTE, high Tg, and environmental compliance, Shengyi SI10US laminate is an excellent choice for applications requiring both reliability and sustainability, including mobile devices, memory modules, RF circuits, and sensor based systems.
The Shengyi SI10US PCB material data sheet
The features of the Shengyi SI10US PCB material
Glass Transition Temperature (Tg)
Shengyi IC Substrate laminate features a high glass transition temperature of 280 degree celsius, this is very high. ensuring dimensional stability and resistance to thermal deformation during lead free soldering processes and under elevated operating conditions.
High Decomposition Temperature (Td)
With a high Decomposition Temperature (Td >400°C), Shengyi SI10US laminate exhibits outstanding resistance to thermal degradation. This provides a crucial safety margin during soldering and ensures long term reliability in high temperature operating environments.
Dielectric Constant (Dk)
With a dielectric constant (4.4 @1GHz), the Dielectric Constant (Dk) of Shengyi SI10US laminate is a measure of its ability to store electrical energy in a capacitor like manner. The material maintains a stable dielectric constant, which is essential for high quality pcb boards.
Dissipation Factor (Df)
With a dissipation factor (0.007 @1GHz), Shengyi SI10US IC Substrate laminate minimizes signal loss and ensures accurate impedance control crucial for high speed digital and RF designs where signal integrity is key.
Low X/Y/Z-Axis Coefficient of Thermal Expansion (CTE)
Shengyi IC Substrate laminate exhibits low CTE in all three axes, which enhances dimensional stability and improves reliability in high density interconnects and multilayer boards. Enhances package reliability by minimizing expansion mismatch with copper and components.
High Flexural Modulus
This feature provides superior mechanical rigidity, making Shengyi IC Substrate laminate ideal for thin, high performance substrates used in portable and mobile electronics. Provides excellent rigidity and dimensional stability during multilayer lamination and assembly.
Halogen-free, compatible with lead-free processing
Shengyi IC Substrate laminate is fully halogen free and compliant with RoHS and REACH regulations, supporting green manufacturing and safe end of life disposal. It also supports lead free soldering processes, aligning with modern environmental and safety standards.
What are the applications of the SI10US PCB material?
Designed for space constrained, high functionality devices, Shengyi SI10US laminate is widely used in compact and integrated electronic modules, including:
eMMC Modules
Shengyi SI10US laminate is widely used in embedded MultiMediaCard (eMMC) packages due to its low loss, high thermal reliability, and compatibility with ultra thin substrate requirements.
DRAM Packaging
For memory modules like DRAM, Shengyi SI10US laminate offers the fine line capability, thermal stability, and signal integrity needed for high speed memory applications.
Application Processors (AP)
Used in smartphones, tablets, and embedded systems, Shengyi SI10US laminate supports the complex routing and high frequency demands of modern application processors.
Power Amplifiers (PA)
Ideal for use in mobile communication devices, Shengyi IC Substrate laminate delivers stable performance under high frequency and high temperature conditions.
Dual CM Modules
Shengyi SI10US laminate is suitable for camera modules requiring precise alignment and high frequency signal transmission, offering excellent dimensional control and reliability.
Fingerprint Modules
Designed for compact sensor modules, Shengyi IC Substrate laminate enables miniaturization while maintaining high signal fidelity and long term durability.
RF Modules
From Bluetooth to Wi-Fi modules, Shengyi SI10US laminate supports the growing demand for compact, high frequency wireless connectivity solutions with minimal signal distortion.
Manufacturing advantages of the Shengyi SI10US PCB material
In addition to its performance features, Shengyi SI10US laminates are well regarded for their excellent manufacturability and cost efficiency:
High Flexural Modulus
The laminate is well suited for thin substrates and high density packaging, especially in handheld and wearable electronics. Supports stable fabrication processes and reduces warpage during multilayer press cycles.
Great Performance
The laminate combines low dielectric loss, high thermal reliability, and mechanical strength, ensuring consistent performance in both digital and RF applications. Combines electrical, thermal, and mechanical attributes that simplify design and improve end product reliability.
Environmentally Friendly
Halogen free chemistry contributes to safer handling and eco conscious product life cycles. Being halogen free and compliant with major environmental directives like RoHS and REACH, Shengyi SI10US laminate supports sustainable product development and eco friendly manufacturing.
Ultimately, Shengyi SI10US laminates are a robust solution for manufacturers seeking high reliability materials for next generation modules and memory components. By choosing SI10US laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
