Shengyi SG7350D2 laminates are engineered specifically for high frequency applications. As a glass-reinforced PTFE and ceramic composite material, SG7350D2 delivers ultra-low signal loss, stable dielectric properties over frequency, and enhanced thermal conductivity, making it an ideal choice for engineers working on cutting-edge RF and microwave designs.
In this article, we’ll discuss what really characterizes the Shengyi SG7350D2 laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency PCB boards, so please feel free to contact us.
What is the Shengyi SG7350D2 pcb material?
Shengyi SG7350D2 laminate is a high-performance laminate engineered with a glass-reinforced PTFE and ceramic dielectric system, tailored for applications requiring consistent performance at high frequencies. The SG7350D2 laminate has a decomposition temperature of 560 degrees Celsius. Its high decomposition temperature allows it to endure multiple reflow cycles and extended operation under high thermal stress without degradation. It supports long-term thermal stability and resistance to degradation at high temperatures.
Shengyi SG7350D2 laminate have a low dielectric constant of 3.55 at 10 GHz, maintains outstanding dielectric stability across various frequency and temperature ranges. With a dissipation factor of 0.0020 at 10 GHz, the material demonstrates an extremely low Df, significantly reducing signal loss and enabling efficient transmission of high-frequency signals. With a low and stable Dk/Df, SG7350D2 laminate minimizes signal loss and ensures accurate impedance control—crucial for high-speed digital and RF designs where signal integrity is key.
The SG7350D2 laminate features a low Z-axis CTE, which minimizes dimensional changes perpendicular to the board plane during thermal cycling. This greatly reduces stress on copper plating within vias and plated through-holes, preventing cracks and enhancing overall interconnect reliability. Shengyi SG7350D2 laminate strikes an optimal balance between high performance, thermal reliability, and manufacturability. Its high Tg, low and stable Dk/Df, high Td, and low Z-CTE make it a robust foundation for the next generation of telecom, PCB Passive Components，Power Amplifiers，Microwave Combiner and Power Dividers, and high-speed digital hardware.
The Shengyi SG7350D2 PCB material data sheet
The features of the Shengyi SG7350D2 PCB material
Glass-Reinforced PTFE & Ceramic Dielectric Composition
The laminate combines the benefits of polytetrafluoroethylene (PTFE) with ceramic fillers and woven glass reinforcement, resulting in a balanced blend of low-loss electrical performance, mechanical strength, and dimensional stability.
Stable Electrical Properties Over Frequency
One of the standout features of SG7350D2 laminate is its ability to maintain consistent dielectric constant (Dk) and dissipation factor (Df) across a broad frequency spectrum—from microwave to millimeter-wave bands—ensuring reliable signal transmission and minimal phase variation.
High Thermal Decomposition Temperature (Td)
The laminate has a decomposition temperature of 560 degrees Celsius. Offers a high decomposition temperature, allowing it to withstand multiple reflow cycles and extended operation under high thermal stress without degradation. Supports long-term thermal stability and resistance to degradation at high temperatures.
Low Dielectric Constant (Dk)
With a dielectric constant (3.55 @10GHz), this laminate maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high frequency circuits.
Low Dissipation Factor (Df)
With a dissipation factor (0.0020 @10GHz), this laminate minimizes signal loss, making it ideal for applications that demand precise and efficient signal transmission. ensuring minimal signal distortion and insertion loss—ideal for high speed and high frequency circuit designs.
Excellent High-Frequency Performance
This material is specifically designed for use in RF and microwave applications, offering minimal signal distortion, low insertion loss, and superior phase stability—critical for maintaining signal integrity at high frequencies.
Enhanced Thermal Conductivity
With improved thermal dissipation capabilities, the laminate supports efficient heat management in high-power RF components, helping to extend device lifespan and improve reliability.
Low Z-Axis Coefficient of Thermal Expansion (CTE)
SG7350D2 laminate exhibits a low Z-axis CTE, which minimizes expansion under thermal stress and helps maintain the integrity of plated through holes (PTHs), especially during multiple reflow cycles or under high temperature operation.
Compatible with Lead-Free Process
This laminate meets modern environmental standards and is fully compatible with lead-free soldering processes, supporting sustainable manufacturing practices without compromising performance.
What are the applications of the Shengyi SG7350D2 PCB material?
Shengyi SG7350D2 laminate is purpose built for high speed, high frequency applications across a range of advanced technology sectors:
PCB Passive Components
This laminate is widely used in the fabrication of filters, couplers, and isolators, where maintaining signal purity and minimizing insertion loss are essential for optimal system performance. Ideal for high-Q capacitors, inductors, and filters where low loss and stable electrical properties are critical.
Power Amplifiers
Ideal for use in high efficiency RF power amplifiers, this material ensures stable operation and excellent signal fidelity even under high power conditions. Handles the heat and power requirements efficiently due to its thermal conductivity and stability, while maintaining signal integrity at RF frequencies.
Microwave Combiners and Power Dividers
Due to its low Dk/Df variation, low loss, and excellent thermal conductivity, SG7350D2 laminate is a preferred substrate for designing microwave combiners and power dividers, ensuring uniform signal distribution and reduced phase noise.
LNA/LNB Modules
Used in both satellite communication systems and ground-based receivers, SG7350D2 laminate supports the development of LNA and LNB modules that require ultra-low signal degradation and high frequency stability.
Manufacturing advantages of the Shengyi SG7350D2 PCB material
Shengyi SG7350D2 laminate is not only high performing but also cost-effective and easy to process, which is essential for large-scale production environments:
Compatibility with Standard PCB Processes
Unlike many exotic high frequency materials, SG7350D2 laminate is compatible with standard PCB fabrication techniques, including etching, drilling, and soldering—making it easy to integrate into existing manufacturing workflows.
Great Mechanical and Electrical Properties
This laminate offers a unique combination of mechanical durability, thermal resilience, and electrical reliability, making it suitable for use in complex RF assemblies and high-demand environments.
Cost-Effective and Readily Available
Compared to more expensive alternatives like Rogers RO3000 series or other specialized PTFE materials, SG7350D2 laminate provides a cost-efficient solution with competitive electrical and mechanical performance, supporting medium to large-scale production runs.
Shengyi SG7350D2 laminate strikes an impressive balance. It delivers the essential high frequency electrical performance – stable Dk/Df, low loss – required for demanding RF and microwave applications, coupled with enhanced thermal management and dimensional stability. By choosing SG7350D2 laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
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