Shengyi S7439G laminates are engineered for such high-performance environments, offering a powerful combination of electrical stability, thermal durability, and advanced reliability.
In this article, we’ll discuss what really characterizes the Shengyi S7439G laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high speed servers PCB board, so please feel free to contact us.
What is the Shengyi S7439G pcb material?
Shengyi S7439G Laminate represents a proprietary halogen free, high performance FR-4 system tailored for multilayer Printed Wiring Boards. This system features a glass transition temperature (Tg) of 180℃ (DSC) and is engineered to meet the demands of applications that necessitate exceptional electrical, thermal, and reliability performance.
Utilizing the IPC 2.5.5.5 test method, The material exhibits a Dielectric Constant (Dk) of 3.86 and a Dissipation Factor (Df) of 0.0070 at 10 GHz. Moreover, across a broad spectrum of frequencies, ranging from 1 GHz to 20 GHz, and temperatures spanning from – 40 ºC to +125 ºC, the system demonstrates a stable Dk and Df.
The material is highly compatible with high layer count applications. These applications often require multiple 2 oz. copper layers and have a pitch of 0.8mm. Additionally, when subjected to industry – standard CAF TVs across multiple OEMs, The material has shown excellent resistance to Conductive Anodic Filament (CAF) even at a pitch as small as 0.7mm. The Td value of the Shengyi S7439G laminate is 404 degrees Celsius. The decomposition temperature indicates the temperature at which S7439G undergoes chemical decomposition. Therefore,Shengyi S7439G Laminate will decompose chemically at 404 degrees Celsius. Notably, this value is relatively high. Materials with a high Tg are capable of withstanding thermal stress without breaking.
The Shengyi Laminate system is available in both spread and standard E-Glass configurations. By default, it is supplied with a 3um Rz roughness VLP copper. For applications where additional electrical bandwidth is required, a 2um VLP copper option is also accessible.
The Shengyi S7439G PCB material data sheet
The features of the Shengyi S7439G PCB material
Glass Transition Temperature (Tg)
The material features a high Glass Transition Temperature (Tg) of 180°C, ensuring dimensional stability and consistent electrical performance under the thermal stresses of dense, power-hungry assemblies and multiple reflow cycles.
High Td: 404°C (TGA @ 5% wt loss)
The material has a decomposition temperature of 404 degrees Celsius. Offers a high decomposition temperature, allowing it to withstand multiple reflow cycles and extended operation under high thermal stress without degradation. Supports long-term thermal stability and resistance to degradation at high temperatures.
Low Dielectric Constant (Dk)
With a dielectric constant (3.86 @10GHz) per IPC 2.5.5.5, Shengyi Laminate maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high speed circuits.
Low Dissipation Factor (Df)
With a dissipation factor (0.0070 @10GHz) per IPC 2.5.5.5, the Shengyi S7439G material exhibits a low Df value, reduces transmission losses, enabling reliable performance at high data rates. minimizing signal loss (insertion loss) and distortion critical for multi-gigabit applications.
Stable Dk/Df over Frequency and Temperature
One of the standout features of Shengyi Laminate is its exceptional dielectric stability across a wide range of frequencies and temperatures, which is crucial for maintaining signal integrity in high-speed digital and RF applications.
Low CTE @ 50/240 ppm/°C
With a low CTE of 50 ppm/°C Before Tg and 240 ppm/°C After Tg, per IPC-TM-650 2.4.24. Shengyi S7439G Laminate ensures superior plated-through-hole (PTH) reliability and mechanical stability, even in high-layer-count and high-density designs.
Excellent Electrical Performance
Shengyi Laminate provides low insertion loss, minimal skew, and consistent impedance control, enabling reliable operation at multi-gigabit speeds. Optimized for signal integrity in high-speed data transmission environments.
Superior CAF Performance
The material exhibits strong anti-CAF performance, ensuring long-term reliability in densely routed boards exposed to moisture or voltage gradients. Enhancing long-term reliability in densely routed boards exposed to moisture or voltage gradients.
What are the applications of the Shengyi S7439G PCB material?
Shengyi S7439G Laminate is widely used across industries that demand high-performance, high-density PCB solutions. Typical application scenarios include:
High-Speed Servers
The material is ideal for data center servers and storage systems, where maintaining signal integrity at speeds beyond 56 Gbps and 112 Gbps is critical. Supports data-intensive processing and transmission with reliable signal performance.
High Speed SANs
Used in enterprise storage solutions,Shengyi S7439G Laminate supports fast data transfer rates and stable operation under high thermal loads. Maintains stable transmission in data-critical environments.
Enables fast and reliable network traffic management. for telecom and networking infrastructure, Shengyi S7439G Laminate enables robust high-speed data routing with excellent thermal management capabilities.
High Layer Count Backplanes
Designed for complex backplane applications, Shengyi S7439G Laminate supports multi-layer boards with tight layer-to-layer registration and superior PTH reliability. Suitable for dense routing, large board formats, and stacked signal paths.
High Layer Count Line Cards
Ideal for line cards with dense interconnects, The material delivers the dielectric stability and low loss required for high-speed serial links. Suitable for dense routing, large board formats, and stacked signal paths.
Multiple 2 oz Copper Layers
Shengyi S7439G Laminate is well-suited for boards using heavy copper layers, supporting power delivery and heat dissipation in high-current applications. Handles high current without sacrificing reliability or thermal performance.
0.8mm Pitch Components
The material supports fine-pitch components, making it suitable for high-density packaging and advanced IC integration. Ideal for fine-pitch BGA and high-density interconnect applications.
Shengyi S7439G’s high thermal endurance makes it an excellent choice for burn-in testing of high-performance chips and modules. Withstands repeated thermal cycles for stress-testing electronic components.
HDI and Hybrid Builds
Whether used in HDI boards or hybrid constructions,Shengyi S7439G Laminate provides the electrical and mechanical performance needed for compact, high-speed designs. Compatible with complex build-ups involving mixed materials and microvia structures.
Manufacturing advantages of the Shengyi S7439G PCB material
Choosing Shengyi S7439G laminate isn’t just about technical specs, it offers significant practical benefits for manufacturers:
High Heat Resistance
The material demonstrates excellent heat resistance, making it compatible with lead-free soldering processes and capable of enduring harsh operational conditions. Maintains dimensional and structural stability during assembly and reflow soldering processes.
Environmentally Safe
Shengyi S7439G Laminate is fully halogen-free, meeting global environmental regulations such as IEC 61249-2-21 and supporting sustainable design practices. The material is formulated without bromine or chlorine, reducing environmental impact and safety concerns during manufacturing and end-of-life disposal. Halogen-free formulation contributes to safer, more sustainable electronics manufacturing.
UL 94 V-0 Flame Rating
The material meets the UL 94 V-0 flammability standard, ensuring safety compliance for commercial and industrial electronics. Complies with stringent safety and flame resistance requirements.
Compatibility with Standard FR-4 PCB Processes
Despite its advanced performance, Shengyi S7439G Laminate can be processed using standard FR-4 fabrication methods, including etching, drilling, and plating—making it easy to integrate into existing manufacturing lines. Compatible with existing manufacturing processes, allowing easy integration without special adjustments.
Ultimately, Shengyi S7439G laminates are a robust and versatile material solution for the evolving demands of high-speed, high-density electronic systems. With excellent electrical characteristics, thermal stability, CAF resistance, and proven manufacturability, Shengyi S7439G helps engineers deliver reliable, scalable, and efficient PCB solutions.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
