As high frequency applications continue to evolve in complexity and performance demands, the materials behind advanced circuit designs play an increasingly critical role. Shengyi S7136H laminate emerges as a standout solution, engineered specifically to meet the rigorous requirements of advanced RF and microwave applications.
In this article, we’ll discuss what really characterizes the Shengyi S7136H laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency PCB board, so please feel free to contact us.
What is the Shengyi S7136H pcb material?
The Shengyi S7136H laminate is a glass-reinforced hydrocarbon and ceramic dielectric laminate. It has been meticulously engineered to meet the strict electrical performance requirements in RF and microwave designs. The laminate is characterized by a high Glass Transition Temperature (Tg) of over 280°C. This ensures dimensional stability and consistent electrical performance when subjected to the thermal stresses of dense, power-consuming assemblies and multiple reflow cycles. This advanced composite material system offers excellent thermal conductivity, mechanical strength, and long-term reliability even in harsh environments.
With a dielectric constant of 3.42 at 10GHz, the laminate maintains outstanding dielectric stability across various frequency and temperature ranges. This is crucial for maintaining impedance control and minimizing signal distortion in high speed circuits. Featuring a dissipation factor of 0.0030 at 10GHz, the material demonstrates a very low Df value. This reduces transmission losses, enabling reliable performance at high data rates. The value is extremely low, minimizing signal loss and ensuring high fidelity high frequency signal transmission.
The Shengyi laminate also has a low Z-axis CTE, which significantly enhances the reliability of plated through hole (PTH), especially in multi-layer and high frequency board undergoing thermal cycling. Shengyi laminate is a compelling choice. Its combination of electrical stability, thermal reliability, and ease of processing positions it as a go to material for advanced RF and microwave circuit applications.
The Shengyi S7136H PCB material data sheet
The features of the Shengyi S7136H PCB material
Glass Transition Temperature (Tg)
Shengyi laminate features a high Glass Transition Temperature (Tg) ＞280°C, ensuring dimensional stability and consistent electrical performance under the thermal stresses of dense, power-hungry assemblies and multiple reflow cycles.
Low Dielectric Constant (Dk)
With a dielectric constant (3.42 @10GHz), the laminate maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high speed circuits.
Very Low Dissipation Factor (Df)
With a dissipation factor (0.0030 @10GHz), the Shengyi laminate exhibits a very low Df value, reduces transmission losses, enabling reliable performance at high data rates. Exceptionally low, minimizing signal loss and ensuring high fidelity for high frequency signal transmission.
Glass-Reinforced Hydrocarbon and Ceramic Dielectric System
Shengyi laminate is a glass-reinforced hydrocarbon and ceramic dielectric laminate, carefully engineered to support the stringent electrical performance required in RF and microwave designs. This advanced composite material system provides excellent thermal conductivity, mechanical strength, and long-term reliability in harsh environments.
Excellent High-Frequency Performance
Thanks to its low dielectric tolerance and minimal loss, S7136H laminate delivers superb signal integrity at microwave and millimeter-wave frequencies, supporting next-generation wireless infrastructure.
Stable Electrical Properties Across Frequency Ranges
The Shengyi laminate maintains consistent Dk and Df values across a wide frequency range, reducing phase distortion and ensuring reliable RF performance. The laminate maintains consistent dielectric performance across a wide range of frequencies, which is crucial for reliable, wideband operation.
Low Z-CTE and Excellent Dimensional Stability
The laminate features a low Z-axis CTE, which significantly improves plated through hole (PTH) reliability, especially in multi-layer and high frequency boards subjected to thermal cycling. Combined with excellent in plane stability, it ensures reliable multilayer board construction and long term reliability.
What are the applications of the Shengyi S7136H PCB material?
With its robust performance across electrical, thermal, and mechanical metrics, Shengyi laminate is widely adopted in various high frequency applications, including:
Microstrip and Cellular Base Station Antennas
Shengyi S7136H laminate is widely used in 5G base stations, cellular antennas, and RF front end modules, where high frequency performance and long term reliability are essential. Ensures reliable signal transmission with minimal loss, critical for high speed data delivery.
Power Amplifiers
Ideal for RF power amplifier circuits, shengyi S7136H laminate supports efficient heat dissipation and maintains stable electrical properties even under high power conditions. Delivers low insertion loss and high efficiency, optimizing RF power transmission.
Point-to-Point Microwave Links
Used in microwave backhaul systems, Shengyi S7136H laminate enables high data rate transmission with minimal insertion loss and phase variation. Supports long distance, high bandwidth communication with stable dielectric properties.
Phased-Array Radar Systems
Shengyi S7136H laminate is suitable for military and commercial phased array radar applications, where precise beamforming and signal consistency are crucial. Provides the electrical and mechanical reliability needed for radar systems operating across wide frequency bands.
RF Components and Modules
The Shengyi laminate is ideal for manufacturing filters, couplers, isolators, and other RF components requiring tight tolerances and repeatable performance. Suitable for other passive components that require stable performance at high frequencies.
High-Frequency Wireless Communication Devices
From Wi-Fi 6/6E modules to millimeter wave sensors, Shengyi S7136H laminate supports the growing demand for compact, high-performance wireless connectivity solutions. Ideal for 5G infrastructure and other next-gen communication systems requiring low loss and high reliability.
Manufacturing advantages of the Shengyi S7136H PCB material
Choosing Shengyi S7136H laminate isn’t just about technical specs, it offers significant practical benefits for manufacturers:
UL 94V-0 Flame Rating
Shengyi S7136H laminate meet the stringent UL 94V-0 standard for flammability resistance, a critical safety requirement for many electronic equipment applications, particularly those in telecommunications and infrastructure.
Compatibility with Standard FR-4 PCB Processes
Despite being a high performance RF laminate,Shengyi laminate can be processed using standard FR-4 fabrication techniques, including etching, drilling, and plating—making it easy to integrate into existing production lines.
Cost-Effective and Readily Available
Compared to exotic high-frequency materials like pure PTFE based laminates, Shengyi S7136H laminate offers a more cost-effective solution while delivering excellent RF performance. Its compatibility with standard processes further contributes to overall cost savings. As a product from Shengyi, a major global laminate supplier, it benefits from established supply chain availability.
Shengyi S7136H laminates are specifically engineered to meet these challenges. Combining a glass-reinforced hydrocarbon and ceramic dielectric system, S7136H laminate offers exceptional high-frequency performance, making it an ideal choice for RF and microwave circuit designs where signal integrity, dimensional stability, and cost efficiency are critical. By choosing Shengyi S7136H laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
