Shengyi S7045GH is a halogen-free laminate designed to meet these high standards. It offers a combination of excellent thermal, electrical, and mechanical properties, making it a preferred choice for a wide range of high speed applications.
In this article, we’ll discuss what really characterizes the Shengyi S7045GH laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high speed PCB board, so please feel free to contact us.
What is the Shengyi S7045GH pcb material?
Shengyi S7045GH laminate demonstrates a Tg value of 180°C as measured by the DSC method, and a glass transition temperature (Tg) of 190°C determined via the DMA method. The glass transition temperature signifies the threshold at which the material transitions from a ductile to a brittle and rigid state, typically occurring at a lower temperature than the melting point of the material’s crystalline phase. The Shengyi laminate has a decomposition temperature of 415 degrees Celsius. Its high decomposition temperature allows it to endure multiple reflow cycles and extended operation under high thermal stress without degradation. It supports long-term thermal stability and resistance to degradation at high temperatures.
Shengyi laminate has a low dielectric constant of 3.95 at 10 GHz, maintains outstanding dielectric stability across various frequency and temperature ranges. This stability is crucial for maintaining impedance control and minimizing signal distortion in high speed circuits. With a dissipation factor of 0.0095 at 10 GHz, the material demonstrates an extremely low Df, significantly reducing signal loss and enabling efficient transmission of high frequency signals. With a low and stable Dk/Df, Shengyi laminate minimizes signal loss and ensures accurate impedance control—crucial for high speed digital and RF designs where signal integrity is key.
The Shengyi laminate features a lower Z-axis CTE, which minimizes dimensional changes perpendicular to the board plane during thermal cycling. This greatly reduces stress on copper plating within vias and plated through-holes, preventing cracks and enhancing overall interconnect reliability. Shengyi laminate strikes an optimal balance between high performance, thermal reliability, environmental responsibility, and manufacturability. Its high Tg, low and stable Dk/Df, halogen-free formulation, high Td, and low Z-CTE make it a robust foundation for the next generation of telecom, networking, server, and high-speed digital hardware.
The Shengyi S7045GH PCB material data sheet
The features of the Shengyi S7045GH PCB material
Glass Transition Temperature (Tg)
Shengyi S7045GH laminate features a high Glass Transition Temperature (Tg) of 180°C, ensuring dimensional stability and consistent electrical performance under the thermal stresses of dense, power-hungry assemblies and multiple reflow cycles.
High Thermal Decomposition Temperature (Td)
Shengyi laminate has a decomposition temperature of 415 degrees Celsius. Offers a high decomposition temperature, allowing it to withstand multiple reflow cycles and extended operation under high thermal stress without degradation. Supports long-term thermal stability and resistance to degradation at high temperatures.
Low Dielectric Constant (Dk)
With a dielectric constant (3.95 @10GHz), Shengyi laminate maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high speed circuits.
Low Dissipation Factor (Df)
With a dissipation factor (0.0095 @10GHz), Shengyi laminate minimizes signal loss, making it ideal for applications that demand precise and efficient signal transmission. This very low loss tangent minimizes signal attenuation (insertion loss), preserving signal integrity and power efficiency, especially vital for high-frequency applications like 5G and high-data-rate transmission.
Halogen-Free Material
Compliant with IEC 61249-2-21.Shengyi S7045GH laminate is a halogen free material that reduces toxic emissions and enhances fire safety. S7045GH laminate eliminates bromine and antimony trioxide flame retardants, making it an environmentally safer choice without sacrificing flame retardancy (typically UL 94V-0 rated). This aligns with RoHS, REACH, and other eco-initiatives.
Excellent Thermal Reliability
Designed for demanding environments, Shengyi laminate delivers superior thermal endurance, making it suitable for use in high power and high density PCBs where heat buildup is a concern.
Lower Z-axis CTE
Shengyi S7045GH laminate features a lower Z-axis CTE minimizes dimensional changes perpendicular to the board plane during thermal cycling. This dramatically reduces stress on copper plating within vias and plated through holes, preventing cracks and enhancing overall interconnect reliability.
What are the applications of the Shengyi S7045GH PCB material?
Shengyi S7045GH laminate is purpose built for high speed, high frequency applications across a range of advanced technology sectors:
Telecom Equipment
Shengyi S7045GH laminate is widely used in telecommunications infrastructure, including core network switches, transmission equipment, and optical modules, where high-speed signal transmission and thermal endurance are critical.
Servers
Ideal for use in data center servers, Shengyi S7045GH laminate supports fast data transfer rates and maintains signal integrity at high frequencies, making it suitable for high-performance computing platforms.
Switches
For enterprise and industrial networking switches, Shengyi laminate enables robust connectivity with excellent signal integrity and long-term reliability. High-layer count PCBs for enterprise and data center switches, especially 10/25/40/100GbE and beyond, needing low loss and stable impedance.
Base Stations
Used in 5G base stations and wireless access points, Shengyi S7045GH laminate provides the dielectric stability and low loss needed for high-frequency RF and microwave communications. RF power amplifiers, filters, and antenna interface boards for 4G LTE and 5G, demanding stable Dk/Df and thermal robustness.
Line Cards
Designed for complex line card applications, Shengyi S7045GH laminate supports high-speed serial links with tight layer-to-layer registration and superior PTH reliability. Critical interface cards within routers and switches, often requiring dense, high-speed interconnects and high reliability.
Manufacturing advantages of the Shengyi S7045GH PCB material
Shengyi S7045GH laminate is not only high-performing but also cost-effective and easy to process, which is essential for large-scale production environments:
Compatibility with High Tg Standard FR-4 Processes
Despite its advanced performance, Shengyi S7045GH laminate can be processed using standard FR-4 fabrication techniques, including etching, drilling, and plating—making it easy to integrate into existing production lines.
Environmentally Friendly Materials
Being halogen free and compliant with major environmental directives like RoHS and REACH, Shengyi S7045GH laminate supports green manufacturing and sustainable product development.
Cost-Effective and Readily Available
Compared to more exotic high speed materials, Shengyi S7045GH laminate offers a significantly more cost-effective solution while delivering excellent performance for many high-speed applications. Shengyi’s global manufacturing footprint also ensures good material availability and supply chain stability.
Ultimately,Shengyi S7045GH laminates offer a powerful combination of electrical performance, thermal resilience, and environmental compliance, making them a preferred material for next-generation telecom infrastructure, data centers, and industrial networking applications. By choosing S7045GH laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
