Shengyi S7040G laminate is a high-performance halogen-free laminate system designed for use in demanding network and computing applications. It provides a combination of electrical precision and thermal resilience, supported by a stable and process-friendly platform.
In this article, we’ll discuss what really characterizes the Shengyi S7040G laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high reliability PCB board, so please feel free to contact us.
What is The Shengyi S7040G PCB Material?
Shengyi S7040G laminate demonstrates a Tg value of 175°C as measured by the DSC method, and a glass transition temperature (Tg) of 185°C determined via the DMA method. The glass transition temperature signifies the threshold at which the material transitions from a ductile to a brittle and rigid state, typically occurring at a lower temperature than the melting point of the material’s crystalline phase. The laminate has a decomposition temperature of 405 degrees Celsius. Its high decomposition temperature allows it to endure multiple reflow cycles and extended operation under high thermal stress without degradation. It supports long-term thermal stability and resistance to degradation at high temperatures.
The laminate has a low dielectric constant of 3.72 at 10 GHz, maintains outstanding dielectric stability across various frequency and temperature ranges. This stability is crucial for maintaining impedance control and minimizing signal distortion in high speed circuits. With a dissipation factor of 0.0089 at 10 GHz, the material demonstrates an extremely low Df, significantly reducing signal loss and enabling efficient transmission of high-frequency signals. This is an important factor for achieving high data rates with minimal error.
The laminate is designed with advanced anti-CAF (Conductive Anodic Filament) technology. This technology significantly enhances long-term reliability by reducing the risk of internal failures caused by moisture absorption and electrochemical migration.The Shengy laminate features a lower Z-axis CTE, which minimizes dimensional changes perpendicular to the board plane during thermal cycling. This greatly reduces stress on copper plating within vias and plated through-holes, preventing cracks and enhancing overall interconnect reliability.
The Shengyi S7040G PCB Material Data Sheet
The Features of The Shengyi S7040G PCB Material
Glass Transition Temperature (Tg)
Shengyi laminate features a high Glass Transition Temperature (Tg) of ≥ 175°C, ensuring dimensional stability and consistent electrical performance under the thermal stresses of dense, power-hungry assemblies and multiple reflow cycles.
High Thermal Decomposition Temperature (Td)
The laminate has a decomposition temperature of 405 degrees Celsius. Offers a high decomposition temperature, allowing it to withstand multiple reflow cycles and extended operation under high thermal stress without degradation. Supports long-term thermal stability and resistance to degradation at high temperatures.
Low Dielectric Constant (Dk)
With a dielectric constant (3.72 @10GHz), The laminate maintains excellent dielectric stability across frequency and temperature ranges, which is essential for maintaining impedance control and minimizing signal distortion in high speed circuits.
Low Dissipation Factor (Df)
With a dissipation factor (0.0089 @10GHz), the Shengyi laminate exhibits a low Df, significantly reducing signal loss and enabling efficient transmission of high frequency signals—an important factor for achieving high data rates with minimal error.
Halogen-Free Material
The laminate is fully halogen free, meeting global environmental regulations such as IEC 61249-2-21, and supports sustainable design practices and safe end-of-life disposal. Environmentally safe and compliant with global green regulations, such as RoHS and REACH.
Excellent anti-CAF performance
Shengyi S7040G laminate is engineered with advanced anti-CAF technology, significantly enhancing long term reliability by reducing the risk of internal failures caused by moisture absorption and electrochemical migration.
Excellent Thermal Reliability
Designed for demanding environments, Shengyi S7040G laminate delivers superior thermal endurance, making it suitable for use in high power and high density PCBs where heat buildup is a concern.
Excellent Through-Hole Reliability
Designed for robust performance, Shengyi laminate offers superior through-hole reliability, ensuring long term durability even under repeated thermal cycling. The material exhibits outstanding adhesion and resistance to thermal stress, leading to superior reliability of plated through-holes. This is critical for multilayer boards and components with leads passing through the board.
Lower Z-axis CTE
Shengyi S7040G laminate features a lower Z-axis CTE minimizes dimensional changes perpendicular to the board plane during thermal cycling. This dramatically reduces stress on copper plating within vias and plated through holes, preventing cracks and enhancing overall interconnect reliability.
What are The Applications of The Shengyi S7040G PCB Material?
The laminate is purpose built for high speed, high frequency applications across a range of advanced technology sectors:
Servers & Switches & Base Stations
Shengyi S7040G laminate is ideal for use in telecom infrastructure, including 5G base stations, enterprise switches, and data center servers, where high speed signal transmission and thermal resilience are critical. Provides the thermal and signal stability required for 24/7, high traffic networking environments.
Backplanes and Line Cards
Designed for complex backplane applications, Shengyi S7040G laminate supports multi-layer constructions with tight layer to layer registration and excellent PTH reliability. Supports high layer count and high speed signal transmission across complex PCB architectures.
High-Performance Computing (HPC)
The Shengyi laminate is ideal for GPU modules, high bandwidth interconnects, and backplanes, where consistent signal propagation and thermal resilience are key to system performance. Systems pushing the boundaries of computational power, including AI/ML accelerators and supercomputing modules.
For commercial and enterprise networking equipment, Shengyi laminate enables robust connectivity solutions with excellent signal integrity and manufacturing flexibility. Combines cost efficiency with stable performance, making it ideal for enterprise-grade networking hardware.
Manufacturing Advantages of The Shengyi S7040G PCB Material
Choosing Shengyi S7040G laminate isn’t just about technical specs, it offers significant practical benefits for manufacturers:
High Heat Resistance
Shengyi S7040G laminate demonstrates excellent heat resistance, making it compatible with lead-free soldering processes and capable of enduring harsh operational conditions. Maintains dimensional and structural stability during assembly and reflow soldering processes.
UL 94V-0 Flammability Rating
The material meets the UL 94V-0 flammability standard, ensuring safety compliance for commercial and industrial electronics. Complies with stringent safety standards, enhancing device reliability and regulatory acceptance.
Compatibility with Standard FR-4 PCB Processes
Despite its advanced performance, Shengyi laminate can be processed using standard FR-4 fabrication techniques, including etching, drilling, and plating—making it easy to integrate into existing manufacturing workflows.
Environmentally Safe
Being halogen-free and compliant with major environmental directives like RoHS and REACH, Shengyi S7040G laminate supports green manufacturing and sustainable product development.
Shengyi S7040G laminate delivers a powerful combination of cutting-edge electrical properties, outstanding thermal and mechanical reliability, and environmental responsibility. By choosing S7040G laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
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