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Designed for demanding applications that require inner heavy copper layers or over 24 layer multilayer boards, Shengyi S1190 laminate delivers exceptional thermal reliability, superior through-hole integrity, and outstanding processability making it an ideal choice for high performance, high reliability printed circuit boards.
In this article, we’ll discuss what really characterizes the Shengyi S1190 laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the heavy copper multilayer PCB boards, so please feel free to contact us.
What is the High Tg S1190 pcb material?
The laminate exhibits a glass transition temperature (Tg) of 170 °C under Thermomechanical Analysis (TMA) conditions, while its Tg under Dynamic Mechanical Analysis (DMA) conditions is 200 °C. This indicates that at these temperatures, the printed circuit board material undergoes a transition from a rigid state to a softer one. Such a property renders it highly suitable for applications in printed circuit boards. The laminate has a decomposition temperature of 350 °C. At this temperature, the laminate undergoes chemical decomposition, resulting in a mass loss of at least 5%.
The Shengyi laminate demonstrates a dielectric constant of 4.6 at 1 GHz. The frequency significantly influences this value, with the dielectric constant decreasing as the frequency increases. A dissipation factor of 0.015 at 1 GHz implies reduced dielectric loss, ensuring minimal heat generation during signal transmission. This is of critical importance for applications demanding efficient performance in thermally challenging environments.
The Shengyi laminate also showcases excellent anti-Conductive Anodic Filament (CAF) performance. Additionally, it possesses high thermal resistance, signifying a strong ability to impede heat flow. This characteristic is a key reason why devices incorporating the laminate are less prone to damage. S1190 laminates offer a powerful combination of thermal resilience, electrical performance, and mechanical reliability, making them a preferred material for heavy copper and high-layer-count multilayer PCBs in industrial, automotive, and telecom applications.
The High Tg S1190 PCB material data sheet
The features of the High Tg S1190 PCB material
Glass Transition Temperature (Tg)
The laminate features a high glass transition temperature of 170 degree celsius, ensuring dimensional stability and resistance to thermal deformation during lead free soldering processes and under elevated operating conditions.
High Decomposition Temperature (Td)
With a high Decomposition Temperature (Td≥350°C), Shengyi S1190 laminate exhibits outstanding resistance to thermal degradation. This provides a crucial safety margin during soldering and ensures long-term reliability in high temperature operating environments.
Dielectric Constant (Dk)
With a dielectric constant (4.6 @1GHz), the Dielectric Constant (Dk) of Shengyi laminate is a measure of its ability to store electrical energy in a capacitor-like manner. The Shengyi S1190 laminate maintains a stable dielectric constant, which is essential for high quality pcb boards.
Dissipation Factor (Df)
With a dissipation factor (0.015 @1GHz) translates to reduced dielectric loss, Shengyi S1190 laminate ensuring minimal heat generation during signal transmission, which is crucial for applications that require efficient performance in thermally challenging environments.
Anti-CAF Capability
The laminate is engineered with advanced anti-CAF (Conductive Anodic Filament) technology, significantly enhancing long-term reliability by reducing the risk of internal failures caused by moisture absorption and electrochemical migration.
Excellent Thermal Reliability
The laminate demonstrates proven performance in thermal cycling and thermal shock tests. This excellent thermal reliability ensures the board withstands repeated expansions and contractions without failure.
Excellent Through-Hole Reliability
The laminate offers superior through hole reliability, ensuring long term durability even under repeated thermal cycling. The Shengyi laminate exhibits outstanding adhesion and resistance to thermal stress, leading to superior reliability of plated through-holes. This is critical for multilayer boards and components with leads passing through the board.
What are the applications of the High Tg S1190 PCB material?
Shengyi laminate isn’t for simple boards. Its properties make it ideal for complex, high-layer-count, and thermally challenging applications:
Computers
Shengyi S1190 laminate is ideal for use in desktop motherboards, graphics cards, and server hardware, where high thermal and electrical performance are essential. Motherboards, high speed communication cards, graphics cards, and server backplanes benefit from its thermal stability, low loss, and PTH reliability for complex, heat-generating systems.
Specialized for Heavy Copper & High Density
Shengyi S1190 laminate is particularly well-suited for inner layers with heavy copper weights (often 3oz and above). Its resin system effectively encapsulates the thick copper, preventing resin starvation and ensuring reliable bonding, even under thermal stress.
Over 24-Layer Multilayer PCBs
With its excellent dimensional stability and anti-CAF properties, Shengyi S1190 laminate is ideal for manufacturing complex multilayer boards with more than 24 layers, often found in telecom infrastructure, data center equipment, and automotive control modules.
Manufacturing advantages of the High Tg S1190 PCB material
Choosing Shengyi S1190 laminate isn’t just about technical specs, it offers significant practical benefits for manufacturers:
Excellent Heat Dissipation
Due to its superior thermal conductivity and stability, Shengyi S1190 laminate supports efficient heat dissipation, which is critical for maintaining component life and system performance in high-power applications.
Great Processability
Despite being a high-performance material, Shengyi S1190 laminate can be processed using standard FR-4 fabrication techniques, including etching, drilling, and plating—making it easy to integrate into existing production lines.
Cost-Effectiveness & Availability
Shengyi is a major global supplier. The Shengyi S1190 laminate offers a compelling balance of high performance and cost-effectiveness compared to some ultra-premium alternatives. Its widespread adoption ensures excellent supply chain availability and reduces procurement risks.
In the demanding world of modern electronics, especially for complex, high-reliability applications, the choice of printed circuit board (PCB) substrate material is critical. Shengyi S1190 laminate stands out as a premium laminate engineered to meet the toughest challenges. By choosing S1190 laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
