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Shengyi S1170G is a halogen-free PCB base material. This laminate is highly preferred among PCB manufacturers since it is environmentally friendly. And this material features great thermal and mechanical properties. It is widely used for the production of double sided and multilayer boards.
In this article, we’ll discuss what really characterizes the Shengyi S1170G laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the High Tg PCB board, so please feel free to contact us.
What is the High Tg S1170G pcb material?
Shengyi S1170G material features a high glass transition temperature (Tg > 170°C), signifying its capacity to endure elevated temperatures without substantial degradation of mechanical or electrical properties. This S1170G laminates commonly incorporate reinforcement materials such as woven glass fiber or non-woven aramid fiber. These reinforcement materials enhance the mechanical strength, dimensional stability, and rigidity of the laminate. The material is renowned for its high thermal conductivity, low dielectric constant, and low dissipation factor. As such, it is an optimal choice for applications that demand reliable performance under high-temperature and challenging operating conditions.
Shengyi S1170G material is compatible with lead-free soldering processes, rendering it suitable for environmentally friendly and RoHS-compliant manufacturing. The material showcases robust thermal stability, which is of great significance for applications where temperature fluctuations may affect performance. The material displays excellent resistance to the formation of Conductive Anodic Filament (CAF), which can occur in printed circuit boards (PCBs) under certain circumstances and result in electrical failures. The material has a low coefficient of thermal expansion (CTE) in the Z-axis, indicating that it maintains dimensional stability under temperature variations, thereby reducing the risk of warping or delamination.
The laminates offer a powerful combination of performance, reliability, and environmental responsibility, making them a versatile solution for a wide range of applications—from computers and smartphones, to industrial instruments and automotive electronics.
The High Tg S1170G PCB material data sheet
The features of the High Tg S1170G PCB material
Glass Transition Temperature (Tg)
Shengyi S1170G features a high glass transition temperature of 175 degree celsius, ensuring dimensional stability and resistance to thermal deformation during lead free soldering processes and under elevated operating conditions.
Dielectric Constant (Dk)
With a dielectric constant (4.4 @1GHz), the Dielectric Constant (Dk) of S1170G material is a measure of its ability to store electrical energy in a capacitor-like manner. The material maintains a stable dielectric constant, which is essential for high quality pcb boards.
Dissipation Factor (Df)
With a dissipation factor (0.010 @1GHz) translates to reduced dielectric loss, ensuring minimal heat generation during signal transmission, which is crucial for applications that require efficient performance in thermally challenging environments.
Lead-Free Compatibility
Shengyi S1170G laminate is compatible with lead-free soldering processes, making it suitable for modern, environmentally-conscious manufacturing environments that adhere to industry standards for lead-free products. Fully compatible with lead-free soldering processes, aligning with RoHS compliance and promoting environmentally friendly manufacturing practices.
Anti-CAF Capability
Shengyi S1170G is engineered with advanced anti-CAF (Conductive Anodic Filament) technology, significantly enhancing long-term reliability by reducing the risk of internal failures caused by moisture absorption and electrochemical migration.
Halogen, Antimony and Red Phosphorous Free
The laminate is formulated without halogens, antimony, or red phosphorus, aligning with global environmental regulations such as RoHS directives. This PCB material is free of halogen. Halogen is a toxic substance with negative effects on the environment.
Excellent Through-Hole Reliability
Designed for robust performance, S1170G offers superior through-hole reliability, ensuring long-term durability even under repeated thermal cycling. The material exhibits outstanding adhesion and resistance to thermal stress, leading to superior reliability of plated through-holes. This is critical for multilayer boards and components with leads passing through the board.
Low Z-axis CTE
Especially important after the glass transition temperature (Tg), the low Z-axis CTE minimizes dimensional changes perpendicular to the board plane during thermal cycling. This dramatically reduces stress on copper plating within vias and plated through-holes, preventing cracks and enhancing overall interconnect reliability.
Low water absorption
Shengyi S1170G laminate features a low absorption rate of 0.12%. which is important for maintaining electrical and mechanical properties, particularly in high-humidity environments. Therefore, this pcb laminate can withstand humid environments.
What are the applications of the High Tg S1170G PCB material?
Thanks to its robust blend of properties, the material finds its home in demanding sectors requiring high reliability and signal integrity:
Computers
Ideal for use in desktop motherboards, graphics cards, and server hardware, where high thermal and electrical performance are essential. Motherboards, high-speed communication cards, graphics cards, and server backplanes benefit from its thermal stability, low loss, and PTH reliability for complex, heat-generating systems.
Instrumentation
High-precision measurement devices and automated test equipment (ATE) demand stable Dk/Df and signal fidelity, which S1170G delivers. Used in precision test and measurement equipment, where signal integrity and long-term reliability are critical.
The laminate delivers reliable performance while meeting environmental standards required by major OEMs. Meets the compact design and signal integrity requirements of modern mobile devices.
Automotive electronics
The laminate is widely used in the automotive industry. This PCB material is used for designing parts of automobiles, this material feature great thermal and mechanical properties. Therefore, it is ideal for this application. This material improves the performance of automobile features.
Consumer electronics
The laminate is ideal for use in this consumer electronics application since it is halogen-free. The consumer electronics industry makes use of halogen free materials. Therefore, it is a safe PCB material for the construction of consumer electronics.
Manufacturing advantages of the High Tg S1170G PCB material
Choosing Shengyi S1170G laminate isn’t just about technical specs, it offers significant practical benefits for manufacturers:
Compatibility with Lead-Free Soldering
As mentioned, its high Tg and thermal robustness make it inherently suitable for standard lead-free assembly processes (e.g., SAC alloys), eliminating compatibility concerns and ensuring process stability.
Cost-Effectiveness & Availability
Shengyi is a major global supplier. The S1170G offers a compelling balance of high performance and cost-effectiveness compared to some ultra-premium alternatives. Its widespread adoption ensures excellent supply chain availability and reduces procurement risks.
Environmentally Friendly Materials
The halogen-free, antimony-free, and red phosphorous-free composition meets various environmental regulations (like IPC-4101B slash sheets for halogen free materials) and corporate sustainability goals, making it a responsible choice.
Shengyi S1170G laminates represent a well-engineered balance between performance, reliability, and sustainability. Whether you’re designing for consumer electronics, automotive systems, or industrial instrumentation, S1170G delivers consistent performance while supporting global environmental compliance and cost control. By choosing the laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
