Shengyi S1000H is a mid-Tg, lead-free-compatible FR-4 laminate intended for electronics that need more thermal and through-hole reliability than a basic conventional FR-4 system. The current official data lists Tg at 155°C by DSC and 160°C by DMA, Td at 348°C and Z-axis expansion of 2.8% from 50°C to 260°C.
Those numbers do not make S1000H a high-Tg 180°C material, a low-loss laminate or a finished-board reliability guarantee. At QFPCB, we evaluate the material callout together with the stackup, copper, via geometry, lamination, assembly profile and project qualification requirements before confirming a build.
What Is Shengyi S1000H?
S1000H is a glass-reinforced epoxy laminate from Shengyi Technology. S1000HB is the matching bonding prepreg. Shengyi describes the system as UL ANSI FR-4.0, high performance, mid-Tg and lead-free compatible. The official application list includes computers and notebooks, instruments, consumer electronics, automotive electronics, power supplies and industrial equipment.
The manufacturer highlights low Z-axis CTE, anti-CAF performance, IST performance, low water absorption and thermal reliability. These are material-level attributes. A regulated or reliability-critical product still needs the applicable PCB construction, test plan, traceability and customer approvals.
S1000H Datasheet Values and Test Conditions
The table below uses Shengyi document CN-TDS-1911-03-S1000H-S1000HB. The manufacturer states that the values are typical references rather than specification limits. Most values are based on a 1.6mm specimen made with eight plies of 7628 glass; the Tg specimen is at least 0.50mm thick.
| Property | Typical value | Condition | Unit | Method |
|---|---|---|---|---|
| Tg | 160 | DMA | °C | IPC-TM-650 2.4.24.4 |
| Tg | 155 | DSC | °C | IPC-TM-650 2.4.25D |
| Td | 348 | TGA, 5% weight loss | °C | IPC-TM-650 2.4.24.6 |
| T260 / T288 | >60 / 20 | TMA | min | IPC-TM-650 2.4.24.1 |
| Thermal stress | >100, no delamination | 288°C solder dip | s | IPC-TM-650 2.4.13.1 |
| Z-axis CTE | 37 / 230 | Before / after Tg | ppm/°C | IPC-TM-650 2.4.24 |
| Z-axis expansion | 2.8 | 50-260°C | % | IPC-TM-650 2.4.24 |
| Permittivity | 4.6 | 1GHz, C-24/23/50 | – | IPC-TM-650 2.5.5.9 |
| Loss tangent | 0.011 | 1GHz, C-24/23/50 | – | IPC-TM-650 2.5.5.9 |
| Water absorption | 0.09 | D-24/23 | % | IPC-TM-650 2.6.2.1 |
| Peel strength, 1oz | 1.3 [7.43] | After 288°C / 10s | N/mm [lb/in] | IPC-TM-650 2.4.8 |
| Flammability / CTI | V-0 / PLC 3 | Published conditions | rating | UL 94 / IEC 60112 |
S1000H Is Mid-Tg, Not High-Tg 180°C FR-4
S1000H belongs in the mid-Tg category because Shengyi publishes 155°C by DSC and 160°C by DMA. Tg is not a melting point, a maximum operating temperature or an instruction to operate the finished PCB continuously up to 155°C. It describes a transition in the cured resin’s mechanical behavior under a specified test method.
For a higher-Tg Shengyi option, S1000-2M publishes 180°C by DSC and 185°C by DMA. That does not make S1000-2M automatically better: material cost, loss tangent, press cycle, qualification and the actual failure mode still determine the better choice.
What Tg, Td and T288 Mean for Assembly
The 348°C Td value is measured at 5% weight loss. T288 is the time to delamination under a TMA test at 288°C, while thermal stress uses a solder-dip method. These measurements describe different behaviors and should not be collapsed into one “temperature tolerance.”
Lead-free compatibility also does not mean every reflow profile is approved. Review peak temperature, time above liquidus, number of reflows, rework, moisture conditioning, board thickness, copper distribution and plated-hole geometry. S1000H can add thermal margin over conventional FR-4, but the finished assembly needs its own acceptance criteria.
Why Z-Axis CTE and CAF Matter
S1000H lists Z-axis CTE of 37ppm/°C below Tg, 230ppm/°C above Tg and 2.8% expansion from 50°C to 260°C. These figures help assess strain on plated through holes during thermal exposure. They do not guarantee via life because hole diameter, plating thickness, aspect ratio, registration and thermal cycling remain part of the construction.
Shengyi also describes good anti-CAF and IST performance. CAF risk depends on voltage gradient, conductor and hole spacing, humidity, contamination, glass-resin interfaces and processing. For a CAF-sensitive project, specify the required method and acceptance limit rather than converting the feature statement into an unlimited lifetime claim.
S1000HB Prepreg Constructions and Storage
S1000HB is the bonding prepreg for S1000H. The official sheet lists several glass styles, resin contents and typical cured thicknesses. These are construction references, not guaranteed pressed dielectrics for every copper pattern.
| Glass style | Resin content | Cured thickness | Standard roll size |
|---|---|---|---|
| 106 / 1037 | 73% / 78% | 0.050 / 0.063mm | 1.260m × 150m |
| 1080 / 1078 | 65% / 68% / 70% | 0.072 / 0.081 / 0.087mm | 1.260m × 300m |
| 2313 | 57% | 0.100mm | 1.260m × 300m |
| 2116 | 55% / 58% | 0.120 / 0.130mm | 1.260m × 250m |
| 1506 | 48% | 0.160mm | 1.260m × 150m |
| 7628 | 46% / 48% / 50% / 52% | 0.195 / 0.205 / 0.215 / 0.225mm | 1.260m × 150m |
Shengyi specifies more than 45 minutes of cure time at 180-190°C and notes that heat-up rate depends on inner copper and multilayer structure. Storage is three months below 23°C and 50% RH, or six months below 5°C followed by at least four hours of room-temperature normalization. Keep prepreg protected from moisture, UV and strong light.
Is S1000H a Low-Loss or High-Speed Material?
S1000H has a typical Dk of 4.6 and Df of 0.011 at 1GHz under IPC-TM-650 2.5.5.9. The Df is lower than the 0.018 published for S1000-2M at the same frequency and method, but one datasheet number does not determine total channel loss or make S1000H a dedicated low-loss laminate.
For high-speed digital routing, compare insertion-loss budget, channel length, data rate, copper profile, glass weave, dielectric thickness and fabrication variation. A short channel may work with reviewed mid-Tg FR-4, while a long or loss-sensitive channel may require a different material family. QFPCB will not select a laminate from Tg or Df alone.
Multilayer, HDI and Impedance Stackup Review
For multilayer PCB manufacturing, QFPCB reviews core and prepreg availability, copper balance, resin demand, finished thickness, registration and hole structure. S1000H is not listed in our current general FR-4 capability baseline, so we confirm the exact grade and construction during quotation rather than claiming that every thickness is stocked.
As a conventional FR-4 system, S1000H may be considered for a rigid HDI PCB when the project-specific build is approved. Laser-via size, dielectric thickness, copper filling, stacked or staggered microvias and lamination cycles remain part of the review; the laminate datasheet does not qualify an Any-Layer HDI structure by itself.
Published Dk is only one input to controlled impedance. QFPCB can provide stackup impedance simulation and technical support for multilayer PCB, hybrid PCB and HDI projects, including Any-Layer HDI when the specific conventional-material construction passes engineering review. For an impedance-control PCB, send target impedance, requested tolerance, line type and reference layers.
PCB engineer Alan has more than 10 years of PCB CAM engineering experience. Contact [email protected] with the S1000H core/prepreg callout, copper, geometry and via structure. Engineering support does not imply a universal tolerance, named software, test scope or first-pass guarantee.
When S1000H Is the Wrong Choice
Do not specify S1000H only because it is “better FR-4.” A simple board with a mild assembly profile may be served by a conventional option such as Shengyi S1141. Conversely, a board that needs Tg near 180°C, lower Z-axis expansion, high thermal margin, very low loss, halogen-free construction or a different CTI class may need another grade.
Also avoid calling 0.09% water absorption “waterproof.” It is a laminate test result under a defined conditioning method, not an ingress-protection rating for the finished product. Enclosure seals, connectors, coatings, assembly and a defined environmental test govern product-level moisture protection.
Files Needed for an S1000H PCB Quote
- Gerber, ODB++ or IPC-2581 data and NC drill files
- Finished board dimensions, thickness and layer order
- Exact S1000H laminate and S1000HB prepreg requirements
- Copper weight by layer and copper-profile requirements
- Finished-hole sizes, via types, aspect ratios and HDI layer pairs
- Impedance table with line type, reference layer and requested tolerance
- Assembly peak temperature, expected reflow cycles and rework exposure
- CAF, CTI, flammability, traceability and certificate requirements
- Permitted substitute materials and written approval rules
- Prototype and production quantities
These inputs let QFPCB review the material as part of a manufacturable stackup. They also prevent a quotation from silently treating S1000H as generic FR-4, assuming an unavailable prepreg construction or using a prototype capability as a volume-production commitment.
If the limiting requirement is through-board heat spreading rather than only Tg and plated-hole reliability, compare this material with Shengyi ST115G high-thermal-conductivity laminate. Use like-for-like test methods and evaluate the complete PCB thermal path before substitution.
Frequently Asked Questions
What is the Tg of Shengyi S1000H?
Shengyi publishes typical Tg values of 155°C by DSC and 160°C by DMA. The numbers differ because the methods measure material response differently. Tg is not the melting point or a continuous operating-temperature rating; use the assembly profile, board construction and product environment to determine suitability.
Is S1000H a high-Tg material?
Shengyi describes S1000H as mid-Tg. It should not be grouped with S1000-2M, which publishes 180°C by DSC and 185°C by DMA. Some suppliers use broader commercial Tg categories, so put the actual grade and measurement method on the drawing instead of relying on an ambiguous “high Tg” label.
What are the Dk and Df of S1000H?
The official typical values are Dk 4.6 and Df 0.011 at 1GHz under IPC-TM-650 2.5.5.9. They are reference measurements, not universal design values. Impedance and loss analysis must use the selected glass style, resin content, pressed dielectric thickness, copper profile and trace geometry.
Is S1000H suitable for lead-free assembly?
Yes, Shengyi identifies it as lead-free compatible and publishes T260 greater than 60 minutes, T288 of 20 minutes and thermal stress greater than 100 seconds without delamination under the stated methods. These typical laminate results do not approve every reflow profile, board thickness or rework sequence.
Can S1000H be used for HDI or Any-Layer HDI?
It may be evaluated for rigid HDI and Any-Layer HDI as a conventional FR-4 material, but approval is stackup-specific. QFPCB reviews laser-via diameter, dielectric thickness, copper filling, microvia structure and lamination cycles. Neither the datasheet nor a material name alone qualifies the finished HDI construction.
Does S1000H prevent CAF failures?
No laminate can remove every CAF risk. Shengyi describes good anti-CAF performance, while board reliability also depends on voltage, hole and conductor spacing, humidity, contamination, glass-resin interfaces and processing. Specify the required CAF test method, preconditioning and acceptance limit for a qualification-sensitive project.
What is the difference between S1000H and S1000HB?
S1000H is the copper-clad laminate, while S1000HB is its bonding prepreg. S1000HB is offered in multiple glass styles, resin contents and cured thicknesses. A complete multilayer drawing should distinguish core material from prepreg construction and state whether substitutions require written approval.
How does S1000H compare with S1000-2M?
S1000H is mid-Tg at 155°C DSC, while S1000-2M is high-Tg at 180°C DSC. S1000H publishes Df 0.011 versus 0.018 for S1000-2M at 1GHz, but S1000-2M has stronger published Tg, Td, T288 and Z-axis expansion figures. Choose by the complete electrical, thermal and reliability requirement.
Request an S1000H Material and Stackup Review
Send QFPCB your files, S1000H/S1000HB construction, copper, vias, impedance table, assembly profile and quantity. We will check the exact material availability and review whether the proposed stackup fits the project before quotation. Do not approve a substitution or freeze trace geometry until the production construction is confirmed.
Official source: Shengyi S1000H product page and TDS, document CN-TDS-1911-03-S1000H-S1000HB.
