Shengyi S1000-2M is a high-Tg, lead-free-compatible FR-4 laminate for thermally demanding multilayer PCBs. Its value is not simply “a higher Tg.” The official datasheet combines a DMA Tg of 185°C, DSC Tg of 180°C, a 355°C decomposition temperature and controlled Z-axis expansion with anti-CAF positioning and through-hole reliability.
Those figures still do not approve a finished PCB by themselves. Layer count, copper distribution, board thickness, via structure, press cycles, moisture history and assembly profile determine whether the material fits your build. QFPCB therefore reviews S1000-2M as part of the complete construction rather than treating the material name as a reliability guarantee.
What Is Shengyi S1000-2M?
S1000-2M is a glass-reinforced epoxy FR-4 laminate made by Shengyi Technology. The corresponding bonding prepreg is S1000-2MB. Shengyi classifies the system as UL ANSI FR-4.0 and identifies computer, communication, automotive electronics and high-multilayer PCBs as application areas.
The official feature list includes anti-CAF capability, lead-free compatibility, thermal reliability, through-hole reliability and mechanical processability. These are material-family attributes, not permission to omit PCB-level qualification. If your drawing calls out S1000-2M, keep the exact grade, laminate thickness, copper, prepreg construction and substitution rules visible in the fabrication package.
S1000-2M Datasheet Values and Test Conditions
The following data comes from Shengyi document CN-TDS-2308-04-S1000-2M-S1000-2MB. Shengyi states that the listed values are typical, based on a 1.6mm specimen using eight plies of 7628 glass, and are for reference rather than specification limits.
| Property | Typical value | Condition | Unit | Test method |
|---|---|---|---|---|
| Tg | 185 | DMA | °C | IPC-TM-650 2.4.24.4 |
| Tg | 180 | DSC | °C | IPC-TM-650 2.4.25D |
| Td | 355 | TGA, 5% weight loss | °C | IPC-TM-650 2.4.24.6 |
| T260 / T288 / T300 | >60 / 30 / 15 | TMA | min | IPC-TM-650 2.4.24.1 |
| Thermal stress | >100 | 288°C solder dip | s | IPC-TM-650 2.4.13.1 |
| Z-axis CTE | 41 / 208 | Before / after Tg | ppm/°C | IPC-TM-650 2.4.24 |
| Z-axis expansion | 2.4 | 50-260°C | % | IPC-TM-650 2.4.24 |
| Permittivity | 4.6 | 1GHz, C-24/23/50 | – | IPC-TM-650 2.5.5.9 |
| Loss tangent | 0.018 | 1GHz, C-24/23/50 | – | IPC-TM-650 2.5.5.9 |
| Water absorption | 0.08 | D-24/23 | % | IPC-TM-650 2.6.2.1 |
| Flammability | V-0 | C-48/23/50 | rating | UL 94 |
| CTI | PLC 3 | Condition A | rating | IEC 60112 |
Tg, Td and T288 Answer Different Questions
Tg is the transition region where the resin system changes mechanical behavior; it is not a maximum operating temperature. The two published Tg values differ because DMA and DSC are different measurement methods. Reporting only “Tg 180°C” or “Tg 185°C” without the method removes useful context.
Td is measured at 5% weight loss and indicates decomposition behavior, while T288 reports time to delamination under a TMA condition at 288°C. These values help compare thermal robustness, but none of them alone defines an allowable continuous-use temperature or proves survival through your exact reflow cycles. Component mass, copper balance, moisture, board thickness and assembly profile still matter.
Why Z-Axis CTE Matters for Multilayer Vias
S1000-2M has typical Z-axis CTE values of 41ppm/°C below Tg and 208ppm/°C above Tg, with 2.4% expansion from 50°C to 260°C. Lower through-thickness expansion can reduce mechanical strain on plated hole barrels during thermal exposure. It does not eliminate via failures.
For a thick or high-layer-count board, QFPCB reviews finished-hole diameter, plating, aspect ratio, copper distribution and thermal history together. Our general FR-4 process baseline lists up to 70 layers, but constructions above 50 layers require evaluation. Prototype and small/medium-volume aspect-ratio windows also differ, so the highest prototype value must not be treated as an automatic production capability.
S1000-2MB Prepreg Options and Pressing Conditions
The current datasheet lists 106, 1037, 1080/1078, 2313/3313, 2116, 1506 and 7628 glass styles with typical cured thicknesses from 0.050mm to 0.227mm. Resin content and cured thickness vary by glass style, so “use S1000-2MB” is not a complete stackup instruction.
| Glass style | Resin content | Cured thickness | Standard roll size |
|---|---|---|---|
| 106 | 72% / 77% | 0.050 / 0.060mm | 1.260m × 150m |
| 1037 | 74% / 78% | 0.050 / 0.060mm | Confirm with supplier |
| 1080 / 1078 | 64% / 69% | 0.072 / 0.086mm | 1.260m × 300m |
| 2313 / 3313 | 56% | 0.096mm | 1.260m × 300m |
| 2116 | 51% / 55% / 57% | 0.108 / 0.120 / 0.127mm | 1.260m × 250m |
| 1506 | 45% | 0.150mm | 1.260m × 150m |
| 7628 | 44% / 46% / 50% / 52% | 0.187 / 0.196 / 0.216 / 0.227mm | 1.260m × 150m |
Shengyi specifies a curing time greater than 60 minutes at 185-195°C and notes that heat-up rate depends on the inner copper and multilayer structure. The datasheet also specifies storage for three months below 23°C and 50% RH, or six months below 5°C followed by at least four hours of room-temperature normalization. QFPCB confirms current prepreg availability and the production press cycle during engineering review.
Is S1000-2M a Low-Loss High-Speed Material?
Not by modern low-loss laminate standards. The datasheet reports a typical permittivity of 4.6 and loss tangent of 0.018 at 1GHz using IPC-TM-650 2.5.5.9. These numbers can support impedance modeling and a preliminary loss comparison, but they do not make S1000-2M a universal substitute for a dedicated low-loss material.
For short or moderate high-speed channels, stackup geometry and routing may allow high-Tg FR-4 to meet the system budget. Long channels, higher Nyquist frequencies or strict insertion-loss limits may require a lower-Df system. Give QFPCB the channel length, data rate, stackup, copper profile and loss target before material approval. Do not select a laminate from Tg alone.
S1000-2M for Multilayer and HDI PCB Stackups
S1000-2M is positioned for high-multilayer PCB applications, and QFPCB lists the grade within our conventional high-Tg FR-4 material family. For multilayer PCB manufacturing, we review core and prepreg availability, copper balance, resin demand, total thickness, drilling and registration before releasing the build.
Because S1000-2M is a conventional FR-4 system rather than a PTFE high-frequency laminate, it may also be evaluated for rigid HDI PCB constructions. Laser-via diameter, dielectric thickness, copper filling, sequential lamination and reliability requirements remain project-specific. A material datasheet never approves an Any-Layer stackup automatically.
12Layer 2nd order HDI stackupImpedance Simulation and Engineering Support
Published Dk is only one input to controlled impedance. The finished result also depends on dielectric thickness, glass style, resin content, copper thickness, etched trace geometry, reference planes and solder mask. QFPCB can provide stackup impedance simulation and technical review for multilayer PCB, hybrid PCB and HDI projects, including Any-Layer HDI when the specific structure passes engineering review.
For an impedance-control PCB, send your target impedance, tolerance requirement, line type and reference layers with the design. PCB engineer Alan has more than 10 years of PCB CAM engineering experience. For S1000-2M PCB layer stackup questions, contact [email protected]. This support does not imply an unreviewed tolerance, named software, universal test coverage or first-pass guarantee.
When S1000-2M Is the Wrong Material Choice
Do not specify S1000-2M only because “high Tg sounds safer.” A conventional board with a mild assembly profile may not benefit enough to justify changing the material system. Likewise, S1000-2M is not automatically the right answer for very low transmission loss, high thermal conductivity, a specific CTI class, halogen-free compliance or a customer-qualified automotive material list.
Start with the failure mode and requirement. If the priority is halogen-free construction or a different tracking-resistance class, compare the exact official datasheet rather than relying on the Shengyi brand alone. For example, Shengyi S1151G serves a different material-selection question and must not be treated as a direct drop-in replacement.
Files Needed for an S1000-2M PCB Quote
- Gerber, ODB++ or IPC-2581 data and NC drill files
- Layer order, finished thickness and copper weight by layer
- Exact S1000-2M core thickness and S1000-2MB prepreg requirements
- Finished-hole sizes, via types and aspect ratios
- Impedance table, line type, reference layers and requested tolerance
- Sequential-lamination or HDI layer pairs, if applicable
- Assembly peak temperature and expected reflow exposure
- Surface finish, solder mask, testing and certificate requirements
- Written material-substitution and change-control rules
- Prototype and production quantities
These inputs let QFPCB separate material properties from board-level acceptance criteria. They also prevent a quotation from silently assuming a generic “high-Tg FR-4,” an unavailable glass style or a production construction based only on a prototype capability limit.
If a project does not require a 180°C-class Tg, compare this grade with Shengyi S1000H mid-Tg FR-4. S1000H and S1000-2M are not automatic substitutes; check the Tg method, Td, Z-axis expansion, prepreg construction, assembly profile and customer qualification before changing material.
For another high-Tg FR-4 option, compare this system with ITEQ IT-180A laminate and prepreg. Tg alone is not enough: review CTE, T288, Dk/Df conditions, prepreg construction, qualification history and supply before approving a substitution.
Frequently Asked Questions
What is the Tg of Shengyi S1000-2M?
The official datasheet gives typical Tg values of 185°C by DMA and 180°C by DSC. Both values are valid under their respective IPC-TM-650 methods. Tg is not the board’s continuous-use temperature, so thermal qualification must also consider assembly exposure, copper distribution, moisture, thickness and the complete finished-board construction.
What is the decomposition temperature of S1000-2M?
Shengyi publishes a typical Td of 355°C using TGA at 5% weight loss under IPC-TM-650 2.4.24.6. Td describes a decomposition measurement, not a recommended soldering or operating temperature. Use the actual reflow profile and board construction when assessing manufacturing and field reliability.
What is the dielectric constant of S1000-2M?
The current datasheet lists a typical permittivity of 4.6 at 1GHz after C-24/23/50 conditioning, tested by IPC-TM-650 2.5.5.9. For impedance calculation, QFPCB also needs the real prepreg construction, resin content, pressed thickness, copper and trace geometry; the datasheet number alone is insufficient.
Is S1000-2M suitable for lead-free assembly?
Yes. Shengyi identifies S1000-2M as lead-free compatible and publishes T260 greater than 60 minutes, T288 of 30 minutes and T300 of 15 minutes by TMA. These typical laminate values do not approve every assembly profile. Confirm moisture handling, board mass, component constraints and the planned reflow cycles.
Is S1000-2M suitable for high-layer-count PCBs?
Yes, Shengyi explicitly lists high-multilayer PCB as an application. Manufacturability still depends on total thickness, via aspect ratio, copper balance, registration, resin demand and press cycles. QFPCB reviews prototype and volume-production capability separately instead of converting a material application statement into an unconditional layer-count promise.
Can S1000-2M be used for HDI or Any-Layer HDI?
It may be evaluated for rigid HDI and Any-Layer HDI because it is a conventional FR-4 system, but approval is construction-specific. Laser-via diameter, dielectric thickness, copper filling, stacked or staggered microvias and sequential lamination must be reviewed. The datasheet does not certify a particular HDI stackup or finished-board reliability class.
Does low water absorption make an S1000-2M PCB waterproof?
No. The published 0.08% water absorption is a laminate test result under D-24/23 conditioning. It does not make a PCB, enclosure or electronic product waterproof. Product ingress protection depends on enclosure sealing, connectors, coatings, assembly, pressure conditions and a defined test standard such as the applicable IP requirement.
What is the difference between S1000-2M and S1000-2MB?
S1000-2M identifies the laminate, while S1000-2MB is the corresponding bonding prepreg. The prepreg is available in multiple glass styles, resin contents and cured thicknesses. A complete fabrication drawing should distinguish core material from prepreg construction instead of using the two designations interchangeably.
Request an S1000-2M Stackup Review
Send QFPCB your fabrication data, material callout, board thickness, copper, via structure, impedance table, assembly profile and order quantity. We will review the S1000-2M/S1000-2MB construction, material availability and manufacturing inputs before quotation. Material substitutions or changes to the prepreg construction should remain subject to your written approval.
Official source: Shengyi S1000-2M/S1000-2MB datasheet, document CN-TDS-2308-04-S1000-2M-S1000-2MB.
