In the fast-growing world of high-frequency wireless communication, the performance and reliability of PCB materials are critical. Shengyi’s LNB33C laminate is specifically engineered to meet the demands of next-generation RF and microwave applications.
In this article, we’ll discuss what really characterizes the Shengyi LNB33C laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the high frequency antenna PCB board, so please feel free to contact us.
What is the Shengyi LNB33C pcb material?
LNB33C laminate is founded upon a sophisticated glass-reinforced hydrocarbon and ceramic dielectric system. The LNB33C laminate is characterized by a high glass transition temperature (Tg) exceeding 280°C. This property ensures exceptional dimensional stability and minimal warpage under elevated temperatures, which is an indispensable characteristic for maintaining circuit integrity during lead-free soldering processes and long-term operational conditions.
The dielectric constant (Dk) of laminate is approximately 3.30 ± 0.05 at 10 GHz (as per IPC-TM-650 2.5.5.15). This low and highly stable Dk is of paramount importance for precise impedance control and predictable signal velocity across a wide spectrum of frequencies.
The loss tangent of laminate is approximately 0.0030 at 10 GHz (in accordance with IPC-TM-650 2.5.5.15). This minimal loss tangent plays a crucial role in maximizing signal strength, minimizing heat generation in power amplifiers, and preserving the signal-to-noise ratio in sensitive receivers, especially in high-frequency applications.
This advanced composite material system offers excellent thermal conductivity, mechanical strength, and long-term reliability in harsh environmental conditions. LNB33C laminate is engineered to exhibit low passive intermodulation (PIM), which is essential for maintaining signal purity in high-performance radio frequency (RF) and antenna systems, particularly in cellular base stations and wireless infrastructure.
Moreover, The laminate features a tightly regulated, low Z-axis coefficient of thermal expansion (CTE) and remarkable dimensional stability across temperature and humidity fluctuations. This effectively minimizes stress on plated through-holes, prevents warping in large antenna panels, and ensures consistent registration in multilayer structures, all of which are crucial for manufacturing processes.
The Shengyi LNB33C PCB material data sheet
The features of the Shengyi LNB33C PCB material
Glass Transition Temperature (Tg)
The laminate features a high Tg＞280°C, ensuring excellent dimensional stability and minimal warpage under elevated temperatures—an essential characteristic for maintaining circuit integrity during lead-free soldering and long-term operation.
Low Dielectric Constant (Dk)
With a low Dk of 3.30 +/- 0.05 @ 10 GHz (IPC-TM-650 2.5.5.15). This low and exceptionally stable Dk is crucial for precise impedance control and predictable signal velocity across wide frequency ranges.
Low Dissipation Factor (Df)
With a low Df of 0.0030 @ 10 GHz (IPC-TM-650 2.5.5.15). This minimal loss tangent is vital for maximizing signal strength, minimizing heat generation in power amplifiers, and preserving signal-to-noise ratio in sensitive receivers, especially critical for high-frequency operation.
Glass-Reinforced Hydrocarbon and Ceramic Dielectric System
This advanced composite material system provides excellent thermal conductivity, mechanical strength, and long-term reliability in harsh environments. This hybrid dielectric composition delivers a unique balance of electrical performance and mechanical strength, ideal for complex, high-frequency environments.
Reduced Passive Intermodulation (PIM)
The laminate is designed to exhibit low PIM, which is essential for maintaining signal purity in high-performance RF and antenna systems, especially in cellular base stations and wireless infrastructure. LNB33C laminate is designed to suppress PIM, which is essential in maintaining signal clarity and reducing interference in cellular and antenna systems.
Stable Electrical Properties Across Frequency Ranges
The material maintains consistent Dk and Df values across a wide frequency range, reducing phase distortion and ensuring reliable RF performance. The laminate offers minimal variation in Dk and Df over a wide frequency range, ensuring consistent performance in broadband applications.
Low Z-Axis Coefficient of Thermal Expansion (CTE)
The laminate features a low Z-axis CTE, which significantly improves plated-through-hole (PTH) reliability, especially in multi-layer boards subjected to thermal cycling. These properties improve reliability in multilayer PCB assemblies and minimize warping or distortion during thermal cycling.
Lead-Free Process Compatibility
Designed for modern manufacturing standards, LNB33C laminate supports lead-free soldering processes, ensuring compliance with environmental regulations and compatibility with RoHS-compliant assembly lines.
What are the applications of the Shengyi LNB33C PCB material?
The advanced electrical and thermal properties of LNB33C laminate make it highly suitable for a variety of high-frequency and wireless communication systems:
High-Frequency Wireless Communication Devices
Ideal for RF front-end modules, power amplifiers, and other key components in wireless infrastructure. From Wi-Fi 6/6E modules to millimeter-wave sensors, LNB33C laminate supports the growing demand for compact, high-performance wireless connectivity solutions.
Cellular Base Station Antennas
LNB33C laminate is widely used in 5G and LTE base station antennas, where low PIM, stable Dk/Df, and long-term reliability are essential for optimal network performance. Delivers high performance and low signal loss for 4G/5G antenna systems requiring robust PIM suppression.
Ideal for broadband wireless access systems, LNB33C laminate enables efficient RF signal transmission with minimal insertion loss and phase variation. Supports efficient and stable signal propagation in broadband wireless networks.
Processing Advantages of the Shengyi LNB33C PCB material
Excellent Dimensional Stability
LNB33C laminate resists warping and movement during lamination, drilling, and assembly processes, ensuring layer-to-layer alignment in complex multilayer RF boards and maintaining the geometric accuracy vital for antenna radiation patterns.
Suitable for Use in Epoxy Glass Multilayer Board Hybrid Designs
LNB33C laminate can be easily integrated into hybrid multilayer PCBs, combining high-frequency performance with standard FR-4 or high-Tg epoxy glass layers—offering flexibility in design and fabrication. This drastically optimizes cost without sacrificing RF performance where it matters most.
Cost-Effective and Readily Available
LNB33C laminate offers a very competitive price-to-performance ratio. Shengyi’s global scale ensures reliable supply chains, making it a practical choice for volume production. Compared to more exotic high-frequency materials like PTFE or Rogers laminates, LNB33C laminate offers a cost-efficient alternative with comparable RF performance—making it ideal for medium to large-scale production runs.
Shengyi LNB33C laminates offer an ideal solution for engineers seeking high-frequency performance, thermal stability, and manufacturing efficiency. By choosing LNB33C laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
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