In the era of 5G connectivity, high speed data transmission, and ultra compact electronics, the demand for advanced flexible circuit materials has never been greater. As signal frequencies push into the GHz range, traditional flexible laminates can no longer meet the stringent requirements for low signal loss, thermal stability, and environmental compliance.
In this article, we’ll discuss what really characterizes the SF230 Flexible laminate. The relevant information is available for pcb design engineers to refer to in the selection of materials, And you can also call QFPCB to discuss. QFPCB offers the best services when it comes to the Multi-layer FPC, so please feel free to contact us.
What is The SF230 Flexible Laminate?
It is a flexible polymer film that serves as the substrate for flexible printed circuits. There are several formulations of polyimide available under commercial brands like Kapton, Rogers, Dupont. Among these, Shengyi SF230 Low Loss MPI FCCL (Flexible Copper Clad Laminate) stands out as a high performance, cost effective, and sustainable solution that bridges the gap between standard polyimide and premium LCP materials. Engineered for next generation wireless and high speed digital applications, SF230 delivers exceptional electrical performance, excellent reliability, and full environmental compliance all while maintaining compatibility with existing manufacturing processes.
One of the most critical electrical properties for high frequency applications is the Dissipation Factor (Df), which measures how much signal energy is lost as heat during transmission. SF230 features an extremely low Df, typically in the range of 0.0056 at 10 GHz, making it one of the lowest loss MPI materials available. With low dissipation loss approaching LCP, excellent soldering reliability, dimensional stability, and chemical resistance, SF230 ensures superior signal integrity and long term durability. Its halogen free composition, UL94 VTM-0 rating, and RoHS compliance make it a safe and environmentally responsible choice. In applications ranging from smartphone antennas and microwave communication to high speed networking and automotive radar, SF230 provides a cost effective, readily available, and high performance alternative to traditional materials.
The SF230 Flexible Laminate Data Sheet
The Features of SF230 Flexible Laminate
Low Dissipation Loss Approach to LCP
With a dissipation factor (0.0056 @10GHz), it has a low Df, which minimizes energy losses as signals travel through the PCB. The most headline grabbing feature of the SF230 is its exceptionally low dissipation factor (Df). Dissipation factor, often referred to as loss tangent, is a measure of how much signal energy is lost as heat as it travels through the dielectric material. Lower Df means less signal attenuation, which translates to stronger signals, longer reach, less power consumption, and higher data integrity.
Dielectric Constant (Dk)
With a dielectric constant (3.2 @10GHz), the Dielectric Constant (Dk) of SF230 laminate is a measure of its ability to store electrical energy in a capacitor like manner. The material maintains a stable dielectric constant, which is essential for high quality pcb boards.
Excellent soldering reliability,dimensional stability, chemical resistance and electrical properties.
The SF230 is designed to withstand the thermal shock of lead free soldering processes without delamination, blistering, or significant degradation of properties. This ensures strong, reliable solder joints during assembly, which is critical for the long term functionality of the final product. Like its predecessor discussed in our SF302 blog, the SF230 exhibits excellent dimensional stability. It resists shrinking and warping during the thermal cycles of manufacturing, such as lamination, curing, and soldering. This stability is paramount for multi-layer flex designs and for maintaining precise impedance control across the entire board.
During PCB fabrication, the laminate is exposed to a variety of harsh chemicals, including etchants, plating solutions, and cleaners. The SF230 demonstrates robust chemical resistance, preventing attack or degradation that could lead to pitting, undercutting of traces, or a change in electrical properties. This resilience contributes to higher manufacturing yields and long term field reliability. Beyond low Df, SF230 maintains consistent dielectric constant (Dk 3.2) across a wide frequency range, enabling precise impedance control. Its stable electrical properties ensure minimal signal distortion, making it ideal for high-speed digital application.
Halogen free, flammability UL94 VTM-0
In line with growing environmental awareness and global safety regulations, SF230 is designed as a halogen free material. This means it contains no chlorine or bromine based flame retardants, reducing environmental impact during production, use, and disposal.
Despite being halogen free, SF230 maintains high flame retardant performance and has achieved the UL94 VTM-0 flammability rating, indicating that it self extinguishes quickly when exposed to flame and does not propagate fire. This safety feature is particularly important for applications in communication equipment, mobile devices, and network systems, where fire safety standards are strict.
Compatible with EU RoHS directive, free of Pb,Hg,Cd, Cr 6+ ,PBB,PBDE, etc.
The laminate is fully compliant with the European Union’s RoHS directive, which restricts the use of hazardous substances in electronic materials. The laminate is free of Pb, Hg, Cd, Cr⁶⁺, PBB, PBDE, and other restricted substances.
This compliance ensures that laminate can be safely used in global manufacturing environments without additional certification challenges. It also demonstrates the manufacturer’s commitment to environmental sustainability and global regulatory conformity.
What are The Applications of SF230 Flexible Laminate?
The unique combination of low loss, thermal reliability, and environmental safety makes SF230 ideal for a wide range of high performance electronic applications.
Smartphone Antennas and RF Modules
Modern smartphones require multiple antennas to support cellular, Wi-Fi, GPS, Bluetooth, and NFC communication. These antennas must operate efficiently at high frequencies while fitting into extremely compact spaces. It is widely used as a substrate material for smartphone antenna circuits due to its low dissipation loss and excellent dimensional stability. Its electrical properties ensure minimal signal attenuation, while its flexibility supports three dimensional folding or conformal antenna designs.
Microwave Communication
As the world transitions toward 5G and future 6G communication networks, materials with low dielectric loss are essential for maintaining signal quality at millimeter wave frequencies. SF230’s low loss performance makes it an ideal candidate for microwave and RF communication systems, including antennas, filters, and power amplifier modules.
High-Speed Network Equipment
In high speed network equipment such as routers, switches, and optical transceivers, maintaining signal integrity at gigabit speeds is crucial. SF230 helps achieve this by minimizing insertion loss and impedance variation across signal paths. Its superior dimensional control allows designers to maintain tight trace tolerances, improving high frequency signal transmission consistency. Additionally, the halogen free and RoHS compliant formulation of SF230 makes it suitable for environmentally responsible data communication systems.
Why Choose SF230 for Next-Generation Flexible Circuits?
As the demand for high frequency and high speed communication devices continues to expand, material selection becomes increasingly decisive in determining performance, reliability, and manufacturability. SF230 Low Loss MPI FCCL provides a balanced solution delivering low dissipation loss comparable to LCP, excellent dimensional and thermal stability, environmental compliance, and process friendliness.
Whether applied in smartphone antennas, microwave communication systems, high speed network equipment, or automotive radar modules, SF230 enables superior signal integrity and long term reliability. Its combination of electrical excellence, mechanical flexibility, chemical robustness, and cost efficiency makes it an optimal choice for engineers and designers seeking next generation FCCL materials.
In conclusion, SF230 stands as a versatile, high performance, and environmentally responsible Low Loss Modified Polyimide FCCL, ideally suited to meet the technical and economic requirements of the next wave of electronic innovation. By choosing SF230 laminate, manufacturers can achieve superior performance, enhanced safety, and extended product lifetimes.
If you have any further questions, please feel free to leave a comment below or contact QFPCB by email ([email protected]).
